SCHEMBL3258685

SCHEMBL3258685

CC1CCCc2ccc(C(N)=O)c(c2C(N)=O)C1

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 4/20 0.40
KDM4E B2RXH2 4/20 0.40
ALDH1A1 P00352 2/20 0.40
HPGD P15428 1/20 0.40
ALOX15 P16050 1/20 0.40
HSD17B10 Q99714 1/20 0.40
PARP1 P09874 4/20 0.37
PDE4B Q07343 2/20 0.36
PDE4D Q08499 2/20 0.36
GAA P10253 2/20 0.35
MEN1 O00255 1/20 0.35
KMT2A Q03164 1/20 0.35
DUSP3 P51452 1/20 0.34
PTPN5 P54829 1/20 0.34
PTPN11 Q06124 1/20 0.34
HTR1A P08908 1/20 0.34
NPC1 O15118 1/20 0.33
ATM Q13315 1/20 0.33
L3MBTL1 Q9Y468 1/20 0.33
TP53 P04637 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL375164 0.83 PARP1 (0.41) MAPTKDM4EALDH1A1HPGDALOX15
SCHEMBL472840 0.78 MAPT (0.40) MAPTKDM4EALDH1A1HPGDALOX15
SCHEMBL16892762 0.78 PARP1 (0.39) MAPTKDM4EALDH1A1HPGDALOX15
SCHEMBL36051 0.77 HSD17B10 (0.41) MAPTKDM4EALDH1A1HPGDALOX15
SCHEMBL10942539 0.77 HSD17B10 (0.41) MAPTKDM4EALDH1A1HPGDALOX15
SCHEMBL918600 0.77 HSD17B10 (0.41) MAPTKDM4EALDH1A1HPGDALOX15
SCHEMBL18489764 0.77 HSD17B10 (0.41) MAPTKDM4EALDH1A1HPGDALOX15
SCHEMBL8864195 0.77 HSD17B10 (0.41) MAPTKDM4EALDH1A1HPGDALOX15
SCHEMBL6052857 0.75 HSD17B10 (0.40) MAPTKDM4EALDH1A1HPGDALOX15
SCHEMBL6466252 0.74 PARP1 (0.37) MAPTKDM4EALDH1A1HPGDALOX15

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1961839-B1 PLATED RESIN MOLDING DAICEL POLYMER LTD (JP) 2017-10-18 EP disclosed
EP-1719615-B1 PLATED RESIN FORMED ARTICLE DAICEL POLYMER LTD (JP) 2016-08-17 EP disclosed
US-9057127-B2 Plated resin molded articles DAICEL POLYMER LTD. (JP) 2015-06-16 US disclosed
WO-2012092093-A1 NOISE DAMPING COMPOSITIONS E. I. DU PONT DE NEMOURS AND COMPANY (US) 2012-07-05 WO disclosed
EP-1426465-B1 PLATED MOLDED RESIN ARTICLE AND PROCESS OF PRODUCING THEREOF DAICEL POLYMER LTD (JP) 2010-12-08 EP disclosed
US-20100143730-A1 Plated Resin Molded Article DAICEL POLYMER LTD. (JP) 2010-06-10 US disclosed
US-7645370-B2 Plating resin molded article and process for producing the same DAICEL POLYMER LTD. (JP) 2010-01-12 US disclosed
US-20090169850-A1 Plated Resin Molded Article DAICEL POLYMER LTD. (JP) 2009-07-02 US disclosed
US-20090028628-A1 Direct liquid-writing instrument MICRO CO., LTD. (JP) 2009-01-29 US disclosed
EP-2014482-A1 Direct liquid-writing instrument Daicel Polymer Ltd. (JP) 2009-01-14 EP disclosed
EP-1961839-A1 PLATED RESIN MOLDING Daicel Polymer Ltd. (JP) 2008-08-27 EP disclosed
US-20080027165-A1 Plated Resin Molded Articles DAICEL POLYMER LTD. (JP) 2008-01-31 US disclosed
US-20070298227-A1 Plated Resin Molded Articles DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2007-12-27 US disclosed
EP-1783160-A1 PLATED RESIN MOLDING Daicel Polymer Ltd. (JP) 2007-05-09 EP disclosed
EP-1719615-A1 PLATED RESIN FORMED ARTICLE Daicel Polymer Ltd. (JP) 2006-11-08 EP disclosed
US-20040224169-A1 Plated resin molded article and process for producing the same DAICEL POLYMER LTD. 2004-11-11 US disclosed
EP-1426465-A1 PLATED RESIN MOLDING AND PROCESS FOR PRODUCING THE SAME Daicel Polymer Ltd. (JP) 2004-06-09 EP disclosed
US-20030059621-A1 Plating resin molded article and process for producing the same DAICEL POLYMER LTD. (JP) 2003-03-27 US disclosed