SCHEMBL3297791

SCHEMBL3297791

CC(=O)Oc1ccc(C(=O)Oc2ccc(C3CC4C=CC3C4)cc2)cc1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HSD17B10 Q99714 2/20 0.42
MAPT P10636 5/20 0.40
TDP1 Q9NUW8 1/20 0.40
ELANE P08246 1/20 0.40
L3MBTL1 Q9Y468 1/20 0.39
ESR1 P03372 1/20 0.39
PGR P06401 1/20 0.39
CHRM2 P08172 1/20 0.39
ADORA3 P0DMS8 1/20 0.39
AR P10275 1/20 0.39
CHRM1 P11229 1/20 0.39
SLC6A2 P23975 1/20 0.39
SLC6A3 Q01959 1/20 0.39
LMNA P02545 3/20 0.37
KMT2A Q03164 6/20 0.36
MEN1 O00255 3/20 0.36
SMN1; SMN2 Q16637 3/20 0.36
GFER P55789 1/20 0.36
PARP10 Q53GL7 1/20 0.35
POLB P06746 2/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3292302 0.92 ELANE (0.49) HSD17B10MAPTTDP1ELANEESR1
SCHEMBL1739262 0.92 LMNA (0.43) HSD17B10MAPTELANEESR1PGR
SCHEMBL3292358 0.89 HSD17B10 (0.46) HSD17B10MAPTTDP1ELANEESR1
SCHEMBL3295278 0.85 LMNA (0.37) HSD17B10MAPTELANEESR1PGR
SCHEMBL3292272 0.85 ELANE (0.39) HSD17B10MAPTELANEESR1PGR
SCHEMBL3291051 0.84 KDM1A (0.37) HSD17B10MAPTELANEESR1PGR
SCHEMBL3292906 0.81 LMNA (0.35) HSD17B10MAPTELANEESR1PGR
SCHEMBL3296262 0.81 LMNA (0.34) HSD17B10MAPTELANEESR1PGR
SCHEMBL15698038 0.81 KDM4E (0.42) HSD17B10MAPTTDP1LMNAKMT2A
SCHEMBL8686930 0.79 LMNA (0.37) MAPTL3MBTL1ESR1LMNAKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7727705-B2 High etch resistant underlayer compositions for multilayer lithographic processes FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2010-06-01 US disclosed
WO-2008140846-A1 HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-11-20 WO disclosed
US-20080206667-A1 HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. 2008-08-28 US disclosed