Known targets — ChEMBL curated mechanism
GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQ
The experimentally established mechanism targets of Water. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DNM1 | Q05193 | 4/20 | 0.48 |
| ▸ | SLC22A1 | O15245 | 2/20 | 0.43 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.43 |
| ▸ | SLC22A2 | O15244 | 1/20 | 0.43 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.41 |
| ▸ | LMNA | P02545 | 2/20 | 0.41 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.41 |
| ▸ | TSHR | P16473 | 2/20 | 0.41 |
| ▸ | MEN1 | O00255 | 1/20 | 0.41 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.41 |
| ▸ | TP53 | P04637 | 1/20 | 0.39 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.39 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.39 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.39 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28463174 | 0.97 | DNM1 (0.50) | DNM1SLC22A1SMN1; SMN2SLC22A2ALDH1A1 | |
| Water SCHEMBL3307120 | 0.94 | DNM1 (0.55) | DNM1SLC22A1SMN1; SMN2SLC22A2ALDH1A1 | |
| Water SCHEMBL3305378 | 0.94 | DNM1 (0.48) | DNM1SLC22A1SMN1; SMN2SLC22A2ALDH1A1 | |
| SCHEMBL1686201 | 0.92 | DNM1 (0.57) | DNM1SLC22A1SMN1; SMN2SLC22A2ALDH1A1 | |
| Water SCHEMBL3308247 | 0.92 | DNM1 (0.43) | DNM1SLC22A1SMN1; SMN2SLC22A2ALDH1A1 | |
| SCHEMBL28461185 | 0.92 | DNM1 (0.50) | DNM1SLC22A1SMN1; SMN2SLC22A2ALDH1A1 | |
| SCHEMBL10600603 | 0.89 | DNM1 (0.62) | DNM1SLC22A1SMN1; SMN2SLC22A2ALDH1A1 | |
| SCHEMBL7297733 | 0.89 | DNM1 (0.62) | DNM1SLC22A1SMN1; SMN2SLC22A2ALDH1A1 | |
| Bromide SCHEMBL17458752 | 0.86 | DNM1 (0.64) | DNM1SLC22A1SMN1; SMN2ALDH1A1LMNA | |
| SCHEMBL10002123 | 0.86 | DNM1 (0.50) | DNM1SLC22A1SMN1; SMN2SLC22A2ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8349207-B2 | Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device | JSR CORPORATION (JP) | 2013-01-08 | — | — | US | disclosed |
| US-20100099260-A1 | AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHNG AND CHEMICAL MECHANICAL POLISHING METHOD FOR SEMICONDUCTOR DEVICE | JSR CORPORATION (JP) | 2010-04-22 | — | — | US | disclosed |
| EP-2131389-A1 | AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING METHOD FOR SEMICONDUCTOR DEVICE | JSR Corporation (JP) | 2009-12-09 | — | — | EP | disclosed |
| US-20040077512-A1 | Cleaning agent for a semi-conductor substrate | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2004-04-22 | — | — | US | disclosed |
| US-6716803-B2 | HAVING COPPER WIRINGS ON ITS SURFACE, COMPRISING A NONIONIC SURFACTANT, ESPECIALLY A POLYOXYALKYLENE COMPOUNDS CONTAINING AN ACETYLENIC GROUP. | WAKO PURE CHEMCIAL INDUSTRIES, LTD. (JP) | 2004-04-06 | — | — | US | disclosed |
| US-6534458-B1 | This invention relates to a cleaning agent for a semi-conductor substrate, particularly, one having copper wirings on its surface, comprising a nonionic surfactant and a method for cleaning the same. control a speed of etching on | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2003-03-18 | — | — | US | disclosed |
| US-20020016272-A1 | Cleaning agent for a semi-conductor substrate | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2002-02-07 | — | — | US | disclosed |
| US-6310019-B1 | COMPRISING NONIONIC SURFACTANT; FOR CLEANING SURFACE HAVING COPPER WIRINGS; CORROSION RESISTANCE | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2001-10-30 | — | — | US | disclosed |