Known targets — ChEMBL curated mechanism
GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQ
The experimentally established mechanism targets of Water. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DNM1 | Q05193 | 5/20 | 0.56 |
| ▸ | HTT | P42858 | 2/20 | 0.56 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.56 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.54 |
| ▸ | RAD52 | P43351 | 1/20 | 0.54 |
| ▸ | BBOX1 | O75936 | 3/20 | 0.46 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.41 |
| ▸ | LMNA | P02545 | 2/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.39 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.39 |
| ▸ | MEN1 | O00255 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16594115 | 0.97 | DNM1 (0.59) | DNM1HTTKMT2AHSP90AA1RAD52 | |
| SCHEMBL30961249 | 0.95 | DNM1 (0.64) | DNM1HTTKMT2AHSP90AA1RAD52 | |
| Hydrochloric Acid SCHEMBL16594142 | 0.95 | DNM1 (0.56) | DNM1HTTKMT2AHSP90AA1RAD52 | |
| SCHEMBL30961256 | 0.95 | DNM1 (0.64) | DNM1HTTKMT2AHSP90AA1RAD52 | |
| SCHEMBL30961252 | 0.95 | DNM1 (0.64) | DNM1HTTKMT2AHSP90AA1RAD52 | |
| Hydrochloric Acid SCHEMBL16594167 | 0.92 | DNM1 (0.61) | DNM1HTTKMT2AHSP90AA1RAD52 | |
| Water SCHEMBL3302085 | 0.92 | DNM1 (0.52) | DNM1HTTKMT2AHSP90AA1RAD52 | |
| SCHEMBL13852614 | 0.89 | — | — | |
| Hydrochloric Acid SCHEMBL5715241 | 0.86 | DNM1 (0.52) | DNM1HTTKMT2AHSP90AA1RAD52 | |
| Water SCHEMBL3305448 | 0.86 | DNM1 (0.56) | DNM1HTTKMT2ASMN1; SMN2LMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10304694-B2 | Semiconductor treatment composition and treatment method | JSR CORPORATION (JP) | 2019-05-28 | — | — | US | disclosed |
| US-20190122896-A1 | SEMICONDUCTOR TREATMENT COMPOSITION | JSR CORPORATION (JP) | 2019-04-25 | — | — | US | disclosed |
| US-20180226267-A1 | SEMICONDUCTOR TREATMENT COMPOSITION AND TREATMENT METHOD | JSR CORPORATION (JP) | 2018-08-09 | — | — | US | disclosed |
| US-8349207-B2 | Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device | JSR CORPORATION (JP) | 2013-01-08 | — | — | US | disclosed |
| US-20100099260-A1 | AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHNG AND CHEMICAL MECHANICAL POLISHING METHOD FOR SEMICONDUCTOR DEVICE | JSR CORPORATION (JP) | 2010-04-22 | — | — | US | disclosed |
| EP-2131389-A1 | AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING METHOD FOR SEMICONDUCTOR DEVICE | JSR Corporation (JP) | 2009-12-09 | — | — | EP | disclosed |
| US-20040077512-A1 | Cleaning agent for a semi-conductor substrate | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2004-04-22 | — | — | US | disclosed |
| US-6716803-B2 | HAVING COPPER WIRINGS ON ITS SURFACE, COMPRISING A NONIONIC SURFACTANT, ESPECIALLY A POLYOXYALKYLENE COMPOUNDS CONTAINING AN ACETYLENIC GROUP. | WAKO PURE CHEMCIAL INDUSTRIES, LTD. (JP) | 2004-04-06 | — | — | US | disclosed |
| US-6534458-B1 | This invention relates to a cleaning agent for a semi-conductor substrate, particularly, one having copper wirings on its surface, comprising a nonionic surfactant and a method for cleaning the same. control a speed of etching on | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2003-03-18 | — | — | US | disclosed |
| US-20020016272-A1 | Cleaning agent for a semi-conductor substrate | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2002-02-07 | — | — | US | disclosed |
| US-6310019-B1 | COMPRISING NONIONIC SURFACTANT; FOR CLEANING SURFACE HAVING COPPER WIRINGS; CORROSION RESISTANCE | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2001-10-30 | — | — | US | disclosed |