Water

Water

SCHEMBL3307446

CC(C)(C)NCCCCO.O

nearest known ligand 0.41

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

ABCC9ABL1ACEACHEACVR1ADORA1ADORA2AADORA2BADORA3ADRA1AADRA1BADRA1DADRA2AADRA2BADRA2CADRB1ADRB2ADRB3AGTR1ALOX5ATP4AATP4BBCRBTKCACNA1ACACNA1BCACNA1CCACNA1DCACNA1ECACNA1FCACNA1GCACNA1HCACNA1ICACNA1SCACNA2D1CACNA2D2CACNA2D3CACNA2D4CACNB1CACNB2CACNB3CACNB4CACNG1CACNG2CACNG3CACNG4CACNG5CACNG6CACNG7CACNG8CALCRLCFBCHRM1CHRM2CHRM3CHRM4CHRM5CHRNA1CHRNB1CHRNDCHRNECHRNGCRBNCUL4ACXCR1CXCR2DDB1DDCDHFRDPP4DRD2DRD3DRD4EGFRERBB2ERBB4ESR1ESR2FDPSFKBP1AFLT1FLT3FLT4GARTGHSRGRIA1GRIA2GRIA3GRIA4GRIK1GRIK2GRIK3GRIK4GRIK5GRIN2AGSK3AGSK3BHDAC1HDAC10HDAC11HDAC2HDAC3HDAC4HDAC5HDAC6HDAC7HDAC8HDAC9HRH1HTR1AHTR1BHTR1DHTR1EHTR1FHTR2AHTR2BHTR2CHTR3AHTR3BHTR3CHTR3DHTR3EHTR4HTR5AHTR6HTR7IDH1IDH2IMPA1ITGA2BITGB3JAK1JAK2JAK3KCNJ11KCNK3KCNK9KDRKITMEN1METMMP1MMP13MMP7MMP8NANOD2NS5bODC1OPG057OPRD1OPRK1OPRM1PPARP1PARP2PDE3APDE3BPDE4APDE4BPDE4CPDE4DPDGFRBPIK3CAPIK3CBPIK3CDPIK3CGPIK3R1PIK3R2PIK3R3PIK3R5PKLRPPARDPPATPTGS1PTGS2RBX1ROCK1ROCK2RRM1RRM2RRM2BSCN10ASCN11ASCN1ASCN2ASCN3ASCN4ASCN5ASCN7ASCN8ASCN9ASCNN1ASCNN1BSCNN1GSIGMAR1SLC10A2SLC5A2SLC6A2SLC6A3SLC6A4SLC9A3SYKTACR1THRATHRBTOP1TUBA1ATUBA1BTUBA1CTUBA3CTUBA3ETUBA4ATUBBTUBB1TUBB2ATUBB2BTUBB3TUBB4ATUBB4BTUBB6TUBB8TYK2TYMSVDRampCblablaT-3blaT-4blaT-5blaT-6blaUOE-1dacAdacBdacCfolAfolPftsIgyrAgyrBileSmecAmrcAmrcBmrdAparCparEpbp2pbp4pbpApbpFrplArplBrplCrplDrplErplFrplIrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmE2rpmFrpmGrpmG1rpmG2rpmG3rpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUthyAykgMykgO

The experimentally established mechanism targets of Water. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
MEN1 known ✓ O00255 1/20 0.33
PTGS1 known ✓ P23219 1/20 0.31
TDP1 Q9NUW8 1/20 0.41
HRH4 Q9H3N8 2/20 0.36
HRH3 Q9Y5N1 2/20 0.36
POLB P06746 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.35
CA1 P00915 3/20 0.34
CA2 P00918 3/20 0.34
CA12 O43570 2/20 0.34
CA9 Q16790 2/20 0.34
LMNA P02545 2/20 0.33
ALDH1A1 P00352 2/20 0.33
HSD17B10 Q99714 1/20 0.33
KMT2A Q03164 1/20 0.33
TSHR P16473 1/20 0.33
KCNH2 Q12809 1/20 0.31
RAB9A P51151 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3317690 0.97 TDP1 (0.42) TDP1HRH4HRH3POLBSMN1; SMN2
SCHEMBL3313068 0.95 TDP1 (0.45) TDP1HRH4HRH3POLBSMN1; SMN2
SCHEMBL27760960 0.95 TDP1 (0.45) TDP1HRH4HRH3POLBSMN1; SMN2
SCHEMBL18555820 0.95 TDP1 (0.45) TDP1HRH4HRH3POLBSMN1; SMN2
SCHEMBL18555657 0.95 TDP1 (0.45) TDP1HRH4HRH3POLBSMN1; SMN2
Water SCHEMBL3302088 0.92 PTGS1 (0.36) TDP1HRH4HRH3POLBSMN1; SMN2
SCHEMBL2000597 0.89
Bromide SCHEMBL21248489 0.86 PTGS1 (0.36) TDP1HRH4HRH3POLBSMN1; SMN2
SCHEMBL22932144 0.84 CYP4F2 (0.42) TDP1HRH4HRH3POLBALDH1A1
Formic Acid SCHEMBL27760962 0.84 TDP1 (0.43) TDP1HRH4HRH3POLBCA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8349207-B2 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device JSR CORPORATION (JP) 2013-01-08 US disclosed
US-20100099260-A1 AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHNG AND CHEMICAL MECHANICAL POLISHING METHOD FOR SEMICONDUCTOR DEVICE JSR CORPORATION (JP) 2010-04-22 US disclosed
EP-2131389-A1 AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING METHOD FOR SEMICONDUCTOR DEVICE JSR Corporation (JP) 2009-12-09 EP disclosed
US-20040077512-A1 Cleaning agent for a semi-conductor substrate WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2004-04-22 US disclosed
US-6716803-B2 HAVING COPPER WIRINGS ON ITS SURFACE, COMPRISING A NONIONIC SURFACTANT, ESPECIALLY A POLYOXYALKYLENE COMPOUNDS CONTAINING AN ACETYLENIC GROUP. WAKO PURE CHEMCIAL INDUSTRIES, LTD. (JP) 2004-04-06 US disclosed
US-6534458-B1 This invention relates to a cleaning agent for a semi-conductor substrate, particularly, one having copper wirings on its surface, comprising a nonionic surfactant and a method for cleaning the same. control a speed of etching on WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2003-03-18 US disclosed
US-20020016272-A1 Cleaning agent for a semi-conductor substrate WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2002-02-07 US disclosed
US-6310019-B1 COMPRISING NONIONIC SURFACTANT; FOR CLEANING SURFACE HAVING COPPER WIRINGS; CORROSION RESISTANCE WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2001-10-30 US disclosed