SCHEMBL3340097

SCHEMBL3340097

CCO[Si](Cc1ccccc1)(OC)OCC

nearest known ligand 0.39

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
TP53 P04637 1/20 0.39
LTA4H P09960 2/20 0.35
SMN1; SMN2 Q16637 1/20 0.34
TSHR P16473 3/20 0.33
ATM Q13315 1/20 0.33
TAAR1 Q96RJ0 1/20 0.33
HTT P42858 1/20 0.33
CYP1A2 P05177 1/20 0.32
CYP3A4 P08684 1/20 0.32
CYP2D6 P10635 1/20 0.32
PRMT1 Q99873 1/20 0.32
CALM1 P0DP23 1/20 0.32
MAPK1 P28482 1/20 0.32
SIGMAR1 Q99720 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19816647 0.96 TP53 (0.39) TP53LTA4HSMN1; SMN2TSHRATM
SCHEMBL2330913 0.94 TP53 (0.38) TP53LTA4HSMN1; SMN2TSHRATM
SCHEMBL19809179 0.91 ADORA3 (0.34) TP53LTA4HSMN1; SMN2TSHRCYP1A2
SCHEMBL28236978 0.90 CA2 (0.33) TP53LTA4HSMN1; SMN2TSHRMAPK1
SCHEMBL104109 0.90 TP53 (0.44) TP53LTA4HSMN1; SMN2TSHRATM
SCHEMBL19809456 0.88 ALDH1A1 (0.38) LTA4HSMN1; SMN2TSHRCYP1A2CYP3A4
SCHEMBL10569880 0.88 LTA4H (0.34) TP53LTA4HSMN1; SMN2TSHRCYP1A2
SCHEMBL19809405 0.86 RAB9A (0.33) LTA4HSMN1; SMN2TSHRMAPK1
SCHEMBL104953 0.85 TP53 (0.42) TP53LTA4HTSHRATMTAAR1
SCHEMBL19809353 0.85 TP53 (0.37) TP53LTA4HSMN1; SMN2ATMTAAR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116075368-B Resin composition, cured product, method for producing same, and laminate 三菱化学株式会社 2024-06-11 CN disclosed
CN-116075368-A Resin composition, cured product, method for producing same, and laminate 三菱化学株式会社 2023-05-05 CN disclosed
CN-108250754-B Silicon-containing resin composition, silicon-containing resin film, silica film, light-emitting display element panel, and light-emitting display device 东京应化工业株式会社 2022-01-25 CN disclosed
CN-107709464-B Silicon-containing resin composition 东京应化工业株式会社 2021-09-28 CN disclosed
CN-112334795-A Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device 东京应化工业株式会社 2021-02-05 CN disclosed
CN-107922733-B Polyimide precursor composition 东京应化工业株式会社 2020-09-11 CN disclosed
US-10696845-B2 Energy-sensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 2020-06-30 US disclosed
CN-107076894-B Infrared shielding composition, cured film, and solid-state imaging device JSR株式会社 2020-01-31 CN disclosed
EP-3275940-B1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2019-12-18 EP disclosed
US-20190225804-A1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2019-07-25 US disclosed
EP-3275940-A1 ENERGY-SENSITIVE RESIN COMPOSITION Tokyo Ohka Kogyo Co., Ltd. (JP) 2018-01-31 EP disclosed
US-8968458-B2 Composition for resist underlayer film and process for producing same JSR CORPORATION (JP) 2015-03-03 US disclosed
US-8808446-B2 Composition for resist underlayer film and process for producing same JSR CORPORATION (JP) 2014-08-19 US disclosed
US-20100151384-A1 COMPOSITION FOR RESIST UNDERLAYER FILM AND PROCESS FOR PRODUCING SAME JSR CORPORATION (JP) 2010-06-17 US disclosed
US-20090050020-A1 COMPOSITION FOR RESIST UNDERLAYER FILM AND PROCESS FOR PRODUCING SAME JSR CORPORATION (JP) 2009-02-26 US disclosed
EP-1855159-A1 COMPOSITION FOR UNDERLAYER FILM OF RESIST AND PROCESS FOR PRODUCING THE SAME JSR Corporation (JP) 2007-11-14 EP disclosed