SCHEMBL3344987

SCHEMBL3344987

CC(=O)c1cccc(-c2c3ccccc3nc3ccccc23)c1

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAP4K4 O95819 2/20 0.57
CSNK1G2 P78368 2/20 0.57
CLK4 Q9HAZ1 2/20 0.57
MKNK2 Q9HBH9 2/20 0.57
MAP4K5 Q9Y4K4 2/20 0.57
MEN1 O00255 3/20 0.55
KMT2A Q03164 3/20 0.55
MAPT P10636 5/20 0.52
NPSR1 Q6W5P4 2/20 0.52
GAA P10253 1/20 0.52
KDM1A O60341 1/20 0.52
BRD4 O60885 1/20 0.51
BRD2 P25440 1/20 0.51
CREBBP Q92793 1/20 0.51
TP53 P04637 2/20 0.51
DHFR P00374 2/20 0.50
NPC1 O15118 1/20 0.50
ESR1 P03372 2/20 0.49
ESR2 Q92731 2/20 0.49
ALDH1A1 P00352 3/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29488277 1.00 MAP4K4 (0.57) MAP4K4CSNK1G2CLK4MKNK2MAP4K5
SCHEMBL29488288 0.82 MAPT (0.58) MEN1KMT2AMAPTNPSR1GAA
SCHEMBL3343178 0.82 MAPT (0.58) MEN1KMT2AMAPTNPSR1GAA
SCHEMBL38651407 0.82 BRD4 (0.54) MAP4K4CSNK1G2CLK4MKNK2MAP4K5
SCHEMBL29117960 0.81 KMT2A (0.65) MEN1KMT2AMAPTNPSR1GAA
SCHEMBL13046288 0.80 MAP4K4 (0.52) MAP4K4CSNK1G2CLK4MKNK2MAP4K5
SCHEMBL22282039 0.78 MAP4K4 (0.60) MAP4K4CSNK1G2CLK4MKNK2MAP4K5
SCHEMBL30937995 0.78 MAP4K4 (0.60) MAP4K4CSNK1G2CLK4MKNK2MAP4K5
SCHEMBL407605 0.77 KMO (0.67) MAP4K4CSNK1G2CLK4MKNK2MAP4K5
SCHEMBL29446517 0.77 KMO (0.67) MAP4K4CSNK1G2CLK4MKNK2MAP4K5

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 53 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110357989-B Tertiary amine photosensitizer, preparation method thereof, photosensitive resin composition containing tertiary amine photosensitizer and application of photosensitive resin composition 常州强力电子新材料股份有限公司 2022-04-22 CN claimed
US-5346805-A Initiator comprising an onium compound and an acridine derivative; printing plate, resist, photomask FUJI PHOTO FILM CO., LTD. (JP) 1994-09-13 US claimed
US-4587200-A Photopolymerizable composition comprising an acridine and a heterocyclic thiol compound as a photopolymerization initiator and a photographic process using said photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1986-05-06 US claimed
US-12353130-B2 Photosensitive resin composition and photosensitive resin multilayer body ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-07-08 US disclosed
US-20240408595-A1 STRUCTURE COMPRISING MICROCHANNEL, PRODUCTION METHOD FOR SAID STRUCTURE, AND MICROCHANNEL DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-12-12 US disclosed
US-12032286-B2 Method for producing multi-layered type microchannel device using photosensitive resin laminate ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-07-09 US disclosed
CN-118119565-A Structure having micro-channel, method for manufacturing same, and micro-channel device 旭化成株式会社 2024-05-31 CN disclosed
US-20240059803-A1 PHOTOSENSITIVE RESIN MULTILAYER BODY AND METHOD FOR PRODUCING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-02-22 US disclosed
US-20230375930-A1 PHOTOSENSITIVE RESIN MULTILAYER BODY ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-11-23 US disclosed
CN-111527450-B Photosensitive resin laminate and method for producing same 旭化成株式会社 2023-08-08 CN disclosed
CN-111596526-B Photosensitive resin composition and photosensitive resin laminate 旭化成株式会社 2023-07-25 CN disclosed
CN-102144189-B Photosensitive resin composition, photosensitive resin laminate, method for forming resist pattern, conductive pattern, and method for manufacturing printed wiring board ASAHI KASEI E MATERIALS CORP 2015-06-10 CN disclosed
CN-104471482-A Method for producing photosensitive resin element ASAHI KASEI E MATERIALS CORP 2015-03-25 CN disclosed
CN-102144189-A Photosensitive resin composition, photosensitive resin laminate, method for forming resist pattern, conductive pattern, printed wiring board, lead frame, base, and method for manufacturing semiconductor package ASAHI KASEI E MATERIALS CORP 2011-08-03 CN disclosed
US-20100159691-A1 PHOTOSENSITIVE RESIN COMPOSITION AND LAMINATE ASAHI KASEI EMD CORPORATION (JP) 2010-06-24 US disclosed
CN-1945429-B Photosensitive resin composition and photosensitive resin laminate using the same ASAHI KASEI DENSHI K K 2010-06-09 CN disclosed
CN-101438208-A Photosensitive resin composition ASAHI KASEI EMD CORP (JP) 2009-05-20 CN disclosed
CN-1945429-A Photosensitive resin composition and photosensitive resin laminate using the same ASAHI KASEI DENSHI K K (JP) 2007-04-11 CN disclosed
US-5346805-A Initiator comprising an onium compound and an acridine derivative; printing plate, resist, photomask FUJI PHOTO FILM CO., LTD. (JP) 1994-09-13 US disclosed
US-4587200-A Photopolymerizable composition comprising an acridine and a heterocyclic thiol compound as a photopolymerization initiator and a photographic process using said photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1986-05-06 US disclosed