SCHEMBL3343178

SCHEMBL3343178

CC(=O)c1ccc(-c2c3ccccc3nc3ccccc23)cc1

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 5/20 0.58
SMN1; SMN2 Q16637 4/20 0.58
NPSR1 Q6W5P4 2/20 0.53
GAA P10253 1/20 0.53
NPC1 O15118 2/20 0.50
GUSB P08236 1/20 0.50
ESR1 P03372 2/20 0.49
ESR2 Q92731 2/20 0.49
RAB9A P51151 2/20 0.48
AHR P35869 1/20 0.47
ALDH1A1 P00352 4/20 0.47
HTT P42858 1/20 0.47
HPGD P15428 3/20 0.46
TP53 P04637 2/20 0.46
KDM4E B2RXH2 1/20 0.46
MEN1 O00255 1/20 0.46
CYP3A4 P08684 1/20 0.46
CYP2D6 P10635 1/20 0.46
KMT2A Q03164 1/20 0.46
HIF1A Q16665 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29488288 1.00 MAPT (0.58) MAPTSMN1; SMN2NPSR1GAANPC1
SCHEMBL28601450 0.86 ATM (0.57) MAPTSMN1; SMN2NPSR1GAANPC1
SCHEMBL20783478 0.85 MAPT (0.73) MAPTSMN1; SMN2NPC1RAB9AALDH1A1
SCHEMBL20783543 0.84 MAPT (0.77) MAPTSMN1; SMN2NPC1RAB9AALDH1A1
SCHEMBL29274262 0.82 TNKS (0.63) MAPTSMN1; SMN2GAANPC1RAB9A
SCHEMBL29488277 0.82 MAP4K4 (0.57) MAPTSMN1; SMN2NPSR1GAANPC1
SCHEMBL3344987 0.82 MAP4K4 (0.57) MAPTSMN1; SMN2NPSR1GAANPC1
SCHEMBL29141505 0.80 MAPT (0.55) MAPTSMN1; SMN2GAANPC1GUSB
SCHEMBL38651690 0.80 MAPT (0.63) MAPTSMN1; SMN2NPC1RAB9AALDH1A1
SCHEMBL9638586 0.79 ELANE (0.51) MAPTSMN1; SMN2NPSR1GAANPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 61 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5346805-A Initiator comprising an onium compound and an acridine derivative; printing plate, resist, photomask FUJI PHOTO FILM CO., LTD. (JP) 1994-09-13 US claimed
US-4587200-A Photopolymerizable composition comprising an acridine and a heterocyclic thiol compound as a photopolymerization initiator and a photographic process using said photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1986-05-06 US claimed
US-12353130-B2 Photosensitive resin composition and photosensitive resin multilayer body ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-07-08 US disclosed
WO-2025018412-A1 PHOTOSENSITIVE ELEMENT, PHOTOSENSITIVE ELEMENT ROLL, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR FORMING CONDUCTOR PATTERN 旭化成株式会社 2025-01-23 WO disclosed
US-20240408595-A1 STRUCTURE COMPRISING MICROCHANNEL, PRODUCTION METHOD FOR SAID STRUCTURE, AND MICROCHANNEL DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-12-12 US disclosed
US-12032286-B2 Method for producing multi-layered type microchannel device using photosensitive resin laminate ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-07-09 US disclosed
US-20240059803-A1 PHOTOSENSITIVE RESIN MULTILAYER BODY AND METHOD FOR PRODUCING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-02-22 US disclosed
US-20230375930-A1 PHOTOSENSITIVE RESIN MULTILAYER BODY ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-11-23 US disclosed
CN-116981999-A Photosensitive resin laminate and method for producing same 旭化成株式会社 2023-10-31 CN disclosed
CN-111694218-B Photosensitive resin composition and method for forming circuit pattern 旭化成株式会社 2023-09-08 CN disclosed
CN-111527450-B Photosensitive resin laminate and method for producing same 旭化成株式会社 2023-08-08 CN disclosed
CN-101779165-A Photosensitive resin composition and laminate thereof ASAHI KASEI EMD CORP 2010-07-14 CN disclosed
US-20100159691-A1 PHOTOSENSITIVE RESIN COMPOSITION AND LAMINATE ASAHI KASEI EMD CORPORATION (JP) 2010-06-24 US disclosed
CN-1945429-B Photosensitive resin composition and photosensitive resin laminate using the same ASAHI KASEI DENSHI K K 2010-06-09 CN disclosed
CN-101568882-A Photosensitive resin composition and laminate ASAHI KASEI EMD CORP (JP) 2009-10-28 CN disclosed
CN-101449208-A Photosensitive resin composition and laminate ASAHI KASEI EMD CORP (JP) 2009-06-03 CN disclosed
CN-101438208-A Photosensitive resin composition ASAHI KASEI EMD CORP (JP) 2009-05-20 CN disclosed
CN-1945429-A Photosensitive resin composition and photosensitive resin laminate using the same ASAHI KASEI DENSHI K K (JP) 2007-04-11 CN disclosed
US-5346805-A Initiator comprising an onium compound and an acridine derivative; printing plate, resist, photomask FUJI PHOTO FILM CO., LTD. (JP) 1994-09-13 US disclosed
US-4587200-A Photopolymerizable composition comprising an acridine and a heterocyclic thiol compound as a photopolymerization initiator and a photographic process using said photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1986-05-06 US disclosed