SCHEMBL3355826

SCHEMBL3355826

Cc1cccc(P(=O)(O)O)c1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA2 P00918 1/20 0.52
CA4 P22748 1/20 0.52
CA5A P35218 1/20 0.52
PGK1 P00558 3/20 0.48
PGK2 P07205 3/20 0.48
ACHE P22303 3/20 0.48
ACP3 P15309 1/20 0.47
HDAC8 Q9BY41 1/20 0.44
HDAC6 Q9UBN7 1/20 0.44
NPC1 O15118 2/20 0.43
CASP3 P42574 1/20 0.43
SENP8 Q96LD8 1/20 0.43
SENP7 Q9BQF6 1/20 0.43
SENP6 Q9GZR1 1/20 0.43
PTPN5 P54829 1/20 0.43
TSHR P16473 2/20 0.43
LMNA P02545 1/20 0.43
GRIK1 P39086 1/20 0.42
PARP1 P09874 1/20 0.42
SMN1; SMN2 Q16637 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11806733 0.98 CA2 (0.50) CA2CA4CA5APGK1PGK2
SCHEMBL7821515 0.89 PGK1 (0.49) CA2CA4CA5APGK1PGK2
SCHEMBL971683 0.86 LMNA (0.54) CA2CA4CA5AACHEACP3
SCHEMBL27633807 0.84 ACHE (0.46) CA2CA4CA5AACHEACP3
SCHEMBL27395625 0.83 ALDH1A1 (0.50) CA2CA4CA5AACHELMNA
SCHEMBL6262029 0.83 CA2 (0.65) CA2CA4CA5APGK1PGK2
SCHEMBL1003285 0.81 ACHE (0.52) ACHEACP3HDAC8HDAC6NPC1
SCHEMBL29968470 0.81 ACHE (0.52) ACHEACP3HDAC8HDAC6NPC1
M-Xylene SCHEMBL867616 0.80 ACHE (0.67) ACHEACP3HDAC8HDAC6NPC1
M-Xylene SCHEMBL31175847 0.80 ACHE (0.67) ACHEACP3HDAC8HDAC6NPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 86 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240393684-A1 METHOD OF FORMING PATTERNS SAMSUNG SDI CO., LTD. (KR) 2024-11-28 US claimed
CN-119024654-A Method for forming pattern 三星SDI株式会社 2024-11-26 CN claimed
WO-2023087996-A1 COMPOSITE FLAME-RETARDANT MATERIAL AND PREPARATION METHOD THEREFOR, SEPARATOR, NEGATIVE ELECTRODE PLATE, SECONDARY BATTERY, AND ELECTRIC DEVICE 宁德时代新能源科技股份有限公司 2023-05-25 WO claimed
EP-2173925-B1 CORROSION PROTECTION OF BRONZES MACDERMID ENTHONE INC (US) 2020-09-16 EP claimed
EP-2142485-B1 METALLIC SURFACE ENHANCEMENT MACDERMID ENTHONE INC (US) 2019-07-24 EP claimed
US-10017863-B2 Corrosion protection of bronzes CITIBANK, N.A. 2018-07-10 US claimed
US-8741390-B2 Metallic surface enhancement ENTHONE INC. (US) 2014-06-03 US claimed
US-20100319572-A1 CORROSION PROTECTION OF BRONZES ENTHONE INC. (US) 2010-12-23 US claimed
US-20100151263-A1 METALLIC SURFACE ENHANCEMENT ENTHONE INC. (US) 2010-06-17 US claimed
US-20080314283-A1 CORROSION PROTECTION OF BRONZES ENTHONE INC. (US) 2008-12-25 US claimed
US-20240393684-A1 METHOD OF FORMING PATTERNS SAMSUNG SDI CO., LTD. (KR) 2024-11-28 US disclosed
CN-119024654-A Method for forming pattern 三星SDI株式会社 2024-11-26 CN disclosed
WO-2023087996-A1 COMPOSITE FLAME-RETARDANT MATERIAL AND PREPARATION METHOD THEREFOR, SEPARATOR, NEGATIVE ELECTRODE PLATE, SECONDARY BATTERY, AND ELECTRIC DEVICE 宁德时代新能源科技股份有限公司 2023-05-25 WO disclosed
EP-2173925-B1 CORROSION PROTECTION OF BRONZES MACDERMID ENTHONE INC (US) 2020-09-16 EP disclosed
EP-3621141-A1 NON-AQUEOUS LIQUID ELECTROLYTE AND NON-AQUEOUS LIQUID ELECTROLYTE SECONDARY BATTERY MITSUBISHI CHEMICAL CORPORATION (JP) 2020-03-11 EP disclosed
US-5817603-A HERBICIDES BASF AKTIENGESELLSCHAFT (DE) 1998-10-06 US disclosed
EP-0547578-B1 Light-sensitive composition FUJI PHOTO FILM CO LTD (JP) 1998-03-18 EP disclosed
EP-0816354-A1 Process for preparing and stabilisation of aliphatic six-membered cyclic carbonates BAYER AG (DE) 1998-01-07 EP disclosed
US-5424165-A Printing durability, storage stability FUJI PHOTO FILM CO., LTD. (JP) 1995-06-13 US disclosed
EP-0547578-A1 Light-sensitive composition FUJI PHOTO FILM CO., LTD. (JP) 1993-06-23 EP disclosed