⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Tetramethylammonium Ion SCHEMBL3360762 | 0.92 | SLC6A9 (0.31) | — | |
| Tetrylammonium SCHEMBL3361545 | 0.88 | FAAH (0.31) | — | |
| Tetrylammonium SCHEMBL4331841 | 0.85 | CHRM2 (0.35) | — | |
| SCHEMBL8006470 | 0.83 | LMNA (0.33) | — | |
| Tetramethylammonium Ion SCHEMBL3361129 | 0.81 | FAAH (0.32) | — | |
| Tetrylammonium SCHEMBL3361103 | 0.80 | EDNRB (0.31) | — | |
| Tetrabuthylammonium SCHEMBL3362457 | 0.80 | FAAH (0.33) | — | |
| SCHEMBL8006468 | 0.80 | IDO1 (0.32) | — | |
| Tetramethylammonium Ion SCHEMBL2428732 | 0.76 | LMNA (0.34) | — | |
| Tetrylammonium SCHEMBL4331836 | 0.74 | CHRM1 (0.36) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2172806-A2 | Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board | Hitachi Chemical Company, Ltd. (JP) | 2010-04-07 | — | — | EP | disclosed |
| US-7232647-B2 | Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board | HITACHI CHEMICAL CO., LTD. (JP) | 2007-06-19 | — | — | US | disclosed |
| US-7220533-B2 | Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern, and method for producing printed wiring board | HITACHI CHEMICAL CO., LTD. (JP) | 2007-05-22 | — | — | US | disclosed |
| US-20050164124-A1 | Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board | HITACHI CHEMICAL CO., LTD. (JP) | 2005-07-28 | — | — | US | disclosed |
| US-20040038149-A1 | Photosensitive resin composition, photosensitive element comprising the same, method for producing resist pattern, and method for producing printed wiring board | HITACHI CHEMICAL CO., LTD. (JP) | 2004-02-26 | — | — | US | disclosed |
| EP-1282010-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT COMPRISING THE SAME, METHOD FOR PRODUCING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2003-02-05 | — | — | EP | disclosed |