Tetrylammonium

Tetrylammonium

SCHEMBL3361545

CCCCC(c1ccc(F)cc1)C(OB([O-])O)(c1ccc(F)cc1)c1ccc(F)cc1.CC[N+](CC)(CC)CC

nearest known ligand 0.32

Full drug profile on Sugi Atlas →

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
FAAH O00519 1/20 0.31
MEN1 O00255 1/20 0.30
ALDH1A1 P00352 1/20 0.30
KMT2A Q03164 1/20 0.30
BCL2L1 Q07817 1/20 0.30
SMN1; SMN2 Q16637 1/20 0.30
BCL2L2 Q92843 1/20 0.30
SLC6A9 P48067 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Tetramethylammonium Ion SCHEMBL3361129 0.93 FAAH (0.32) FAAHMEN1KMT2ASLC6A9
Tetrabuthylammonium SCHEMBL3362457 0.92 FAAH (0.33) FAAH
Tetrylammonium SCHEMBL3361503 0.88
SCHEMBL8016538 0.84 FAAH (0.35) FAAHMEN1ALDH1A1KMT2ABCL2L1
Tetrabuthylammonium SCHEMBL3362455 0.83 FAAH (0.32) FAAH
Tetrylammonium SCHEMBL3361654 0.82 SLC7A5 (0.33)
SCHEMBL8016536 0.81 FAAH (0.34) FAAHMEN1ALDH1A1KMT2ABCL2L1
Tetramethylammonium Ion SCHEMBL3360762 0.81 SLC6A9 (0.31) FAAHSLC6A9
Tetrabuthylammonium SCHEMBL810026 0.78 CTSK (0.35) MEN1KMT2A
Tetramethylammonium Ion SCHEMBL3362589 0.75 SLC7A5 (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2172806-A2 Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board Hitachi Chemical Company, Ltd. (JP) 2010-04-07 EP disclosed
US-7232647-B2 Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board HITACHI CHEMICAL CO., LTD. (JP) 2007-06-19 US disclosed
US-7220533-B2 Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern, and method for producing printed wiring board HITACHI CHEMICAL CO., LTD. (JP) 2007-05-22 US disclosed
US-20050164124-A1 Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board HITACHI CHEMICAL CO., LTD. (JP) 2005-07-28 US disclosed
US-20040038149-A1 Photosensitive resin composition, photosensitive element comprising the same, method for producing resist pattern, and method for producing printed wiring board HITACHI CHEMICAL CO., LTD. (JP) 2004-02-26 US disclosed
EP-1282010-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT COMPRISING THE SAME, METHOD FOR PRODUCING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD HITACHI CHEMICAL COMPANY, LTD. (JP) 2003-02-05 EP disclosed