SCHEMBL3363123

SCHEMBL3363123

C=C(C)COCCC[SiH2]OCC

nearest known ligand 0.32

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
CES2 O00748 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17743496 0.82 CES2 (0.31) CES2
SCHEMBL345836 0.81 CES2 (0.31) CES2
SCHEMBL29225298 0.78 ALDH1A1 (0.36)
SCHEMBL7799292 0.77 LMNA (0.32)
SCHEMBL8766930 0.77 CES2 (0.34) CES2
SCHEMBL2684216 0.76
SCHEMBL6429677 0.76
SCHEMBL1936164 0.76 CES2 (0.32) CES2
SCHEMBL7256155 0.75 CES2 (0.39) CES2
SCHEMBL871697 0.75 CES2 (0.44) CES2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9527224-B2 Endless flexible members with a polymeric release agent for imaging devices XEROX CORPORATION (US) 2016-12-27 US claimed
WO-2024070415-A1 DISPERSION COMPOSITION, FLUORORESIN FILM, METAL-CLAD LAMINATED BOARD, AND METHOD FOR PRODUCING SAME 日鉄ケミカル&マテリアル株式会社 2024-04-04 WO disclosed
WO-2023243652-A1 DISPERSION LIQUID, METHOD FOR PRODUCING SAME, AND CURED PRODUCT THEREOF テイカ株式会社 2023-12-21 WO disclosed
WO-2023189795-A1 DISPERSION COMPOSITION, FLUORORESIN FILM, METAL-CLAD LAMINATED BOARD, AND METHOD FOR PRODUCING SAME 日鉄ケミカル&マテリアル株式会社 2023-10-05 WO disclosed
WO-2023189794-A1 METAL-CLAD LAMINATED BOARD AND METHOD FOR PRODUCING SAME 日鉄ケミカル&マテリアル株式会社 2023-10-05 WO disclosed
CN-111629998-B Fused spherical silica powder and method for producing same 株式会社德山 2023-06-30 CN disclosed
CN-110099969-B Composition for inkjet printing and inkjet printed steel sheet using the same POSCO公司 2022-11-29 CN disclosed
US-9527224-B2 Endless flexible members with a polymeric release agent for imaging devices XEROX CORPORATION (US) 2016-12-27 US disclosed
EP-2527410-B1 ANTIBACTERIAL SURFACE TREATMENT WITH DENATURED URUSHIOL DERIVATIVE POSCO (KR) 2015-09-16 EP disclosed
US-9034937-B2 Surface treatment method for a substrate using denatured urushiol derived from Toxicodendron vernicifluum POSCO (KR) 2015-05-19 US disclosed
US-20100327730-A1 ELECTRON EMITTING ELEMENT AND METHOD FOR PRODUCING ELECTRON EMITTING ELEMENT SHARP KABUSHIKI KAISHA (JP) 2010-12-30 US disclosed
US-20100296843-A1 ELECTRON EMITTING ELEMENT, ELECTRON EMITTING DEVICE, LIGHT EMITTING DEVICE, AIR BLOWING DEVICE, CHARGING DEVICE, ELECTRON-BEAM CURING DEVICE, AND METHOD FOR PRODUCING ELECTRON EMITTING ELEMENT SHARP KABUSHIKI KAISHA (JP) 2010-11-25 US disclosed
US-20100215402-A1 ELECTRON EMITTING ELEMENT, ELECTRON EMITTING DEVICE, LIGHT EMITTING DEVICE, IMAGE DISPLAY DEVICE, AIR BLOWING DEVICE, COOLING DEVICE, CHARGING DEVICE, IMAGE FORMING APPARATUS, ELECTRON-BEAM CURING DEVICE, AND METHOD FOR PRODUCING ELECTRON EMITTING ELEMENT SHARP KABUSHIKI KAISHA (JP) 2010-08-26 US disclosed
WO-2010067906-A1 COMPOSITION FOR PATTERNING ON THERMOSTABLE TRANSPARENT INSULATOR THIN FILM AND PATTERNING METHOD OF THIN FILM APM INC. (KR) 2010-06-17 WO disclosed
US-20090018277-A1 RESIN COMPOSITION EXCELLENT IN HEAT RESISTANCE AND ADHESIVENESS, AND METHOD FOR PRODUCING SAME SOKEN CHEMICAL & ENGINEERING CO., LTD. (JP) 2009-01-15 US disclosed
US-20080174016-A1 Flexible Printed Wiring Board and Semiconductor Device MITSUI MINING & SMELTING CO., LTD. (JP) 2008-07-24 US disclosed
EP-0662491-B1 Prepreg, process for preparation of prepreg, and products derived therefrom NIKKISO CO LTD (JP) 1999-03-24 EP disclosed
US-5512351-A IMPREGNATING INORGANIC FIBERS WITH MIXTURE OF METAL OXIDE POWDER, POLYSILOXANE, ORGANOSILICON COMPOUND, PEROXIDE,AND UNSATURATED MONOMER NIKKISO COMPANY LIMITED (JP) 1996-04-30 US disclosed
EP-0662491-A1 Prepreg, process for preparation of prepreg, and products derived therefrom NIKKISO CO., LTD. (JP) 1995-07-12 EP disclosed
EP-0276469-B1 METHOD OF ELECTRODEPOSITION COATING, AND WATER-BASE PAINT RESIN COMPOSITION KANSAI PAINT CO., LTD. (JP) 1992-03-18 EP disclosed