Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP1A2 | P05177 | 1/20 | 0.46 |
| ▸ | ATM | Q13315 | 1/20 | 0.45 |
| ▸ | NPC1 | O15118 | 2/20 | 0.44 |
| ▸ | RAB9A | P51151 | 2/20 | 0.44 |
| ▸ | NR1H2 | P55055 | 1/20 | 0.44 |
| ▸ | NR1H3 | Q13133 | 1/20 | 0.44 |
| ▸ | ADORA2B | P29275 | 4/20 | 0.44 |
| ▸ | ADORA2A | P29274 | 3/20 | 0.44 |
| ▸ | DHODH | Q02127 | 1/20 | 0.43 |
| ▸ | ADORA3 | P0DMS8 | 1/20 | 0.42 |
| ▸ | ADORA1 | P30542 | 1/20 | 0.42 |
| ▸ | PI4KA | P42356 | 1/20 | 0.42 |
| ▸ | PI4K2B | Q8TCG2 | 1/20 | 0.42 |
| ▸ | PI4K2A | Q9BTU6 | 1/20 | 0.42 |
| ▸ | PI4KB | Q9UBF8 | 1/20 | 0.42 |
| ▸ | PTGER1 | P34995 | 1/20 | 0.42 |
| ▸ | TLR7 | Q9NYK1 | 1/20 | 0.41 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.40 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.40 |
| ▸ | LMNA | P02545 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5200829 | 0.93 | CYP1A2 (0.41) | CYP1A2ATMNPC1RAB9ANR1H2 | |
| SCHEMBL33657 | 0.84 | ATM (0.45) | ATMNPC1RAB9ANR1H2NR1H3 | |
| SCHEMBL11057443 | 0.80 | CYP1A2 (0.59) | CYP1A2ATMNPC1RAB9ANR1H2 | |
| SCHEMBL5795858 | 0.79 | ATM (0.47) | CYP1A2ATMNPC1RAB9ANR1H2 | |
| SCHEMBL11515633 | 0.78 | PTGER1 (0.47) | CYP1A2ATMNPC1RAB9ANR1H2 | |
| SCHEMBL27690602 | 0.78 | ATM (0.46) | CYP1A2ATMNPC1RAB9ANR1H2 | |
| SCHEMBL3627522 | 0.76 | ATM (0.45) | ATMNPC1RAB9ANR1H2NR1H3 | |
| SCHEMBL11312831 | 0.76 | CYP1A2 (0.58) | CYP1A2ATMNPC1RAB9ANR1H2 | |
| SCHEMBL468709 | 0.75 | LTB4R (0.46) | CYP1A2ATMNPC1NR1H2NR1H3 | |
| SCHEMBL27763769 | 0.74 | ALDH1A1 (0.49) | CYP1A2NPC1KDM4EALDH1A1MAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 131 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119614117-A | Modified epoxidized polybutadiene-containing build-up adhesive film for FC-BGA packaging carrier plate and preparation method and application thereof | 深圳市纽菲斯新材料科技有限公司 | 2025-03-14 | — | — | CN | claimed |
| CN-117690902-B | Packaging substrate containing modified adhesive film | 江门市和美精艺电子有限公司 | 2024-04-12 | — | — | CN | claimed |
| CN-117690902-A | Packaging substrate containing modified adhesive film | 江门市和美精艺电子有限公司 | 2024-03-12 | — | — | CN | claimed |
| CN-117025118-A | Layer-increased adhesive film for flame-retardant FC-BGA packaging loading board, and preparation method and application thereof | 深圳市纽菲斯新材料科技有限公司 | 2023-11-10 | — | — | CN | claimed |
| CN-116554821-A | Boron nitride-containing FC-BGA packaging loading plate layer-added adhesive film, preparation method and application thereof | 深圳市纽菲斯新材料科技有限公司 | 2023-08-08 | — | — | CN | claimed |
| CN-104194271-B | Dielectric composite material for fingerprint sensor induction layer and preparation method thereof | 天津德高化成新材料股份有限公司 | 2016-08-17 | — | — | CN | claimed |
| US-20140034367-A1 | EPOXY RESIN COMPOSITION FOR PRITNED CIRCUIT BOARD, INSULATING FILM, PREPREG, AND MULTILAYER PRINTED CIRCUIT BOARD | SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) | 2014-02-06 | — | — | US | claimed |
| EP-1384738-B1 | ONE-COMPONENT HOT-SETTING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR MOUNTING UNDERFILL MATERIAL | SUNSTAR ENGINEERING INC (JP) | 2006-12-27 | — | — | EP | claimed |
| JP-59147068-A | — | — | None | — | — | JP | disclosed |
| JP-59142270-A | — | — | None | — | — | JP | disclosed |
| US-20250154300-A1 | RESIN COMPOSITION AND CURABLE RESIN COMPOSITION USING THE SAME | NAMICS CORPORATION (JP) | 2025-05-15 | — | — | US | disclosed |
| CN-119614117-A | Modified epoxidized polybutadiene-containing build-up adhesive film for FC-BGA packaging carrier plate and preparation method and application thereof | 深圳市纽菲斯新材料科技有限公司 | 2025-03-14 | — | — | CN | disclosed |
| CN-114641532-B | Resin composition, cured product, composite molded body, and semiconductor device | 三菱化学株式会社 | 2024-12-24 | — | — | CN | disclosed |
| EP-4477710-A1 | RESIN COMPOSITION AND CURABLE RESIN COMPOSITION USING SAME | Namics Corporation (JP) | 2024-12-18 | — | — | EP | disclosed |
| EP-0915383-A2 | Photosensitive resin composition | HITACHI CHEMICAL CO., LTD. (JP) | 1999-05-12 | — | — | EP | disclosed |
| EP-0858725-A1 | MULTILAYER PRINTED CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME | Sumitomo Bakelite Company Limited (JP) | 1998-08-19 | — | — | EP | disclosed |
| WO-1997016948-A1 | MULTILAYER PRINTED CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1997-05-09 | — | — | WO | disclosed |
| CN-1118794-A | Latent Catalysts, Cure-inhibited epxoy resin compositions and laminates prepared therefrom | DOW CHEMICAL CO (US) | 1996-03-20 | — | — | CN | disclosed |
| JP-S59147068-A | PRODUCTION OF HEAT-RESISTANT ELECTRICALLY CONDUCTIVE ADHESIVE | MATSUSHITA ELECTRIC IND CO LTD | 1984-08-23 | — | — | JP | disclosed |
| JP-S59142270-A | HEAT-RESISTANT ELECTRICALLY CONDUCTIVE ADHESIVE | MATSUSHITA ELECTRIC IND CO LTD | 1984-08-15 | — | — | JP | disclosed |