SCHEMBL3365879

SCHEMBL3365879

CC(C)(C)OC(=O)OC(CC1CC2C=CC1C2)C(F)(F)F

nearest known ligand 0.32

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 4/20 0.32
ALDH1A1 P00352 2/20 0.31
POLB P06746 1/20 0.30
ALOX15 P16050 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3366580 0.84 KDM4E (0.34) KDM4EALDH1A1POLBALOX15
SCHEMBL15063217 0.81 KDM4E (0.33) KDM4EALDH1A1POLBALOX15
SCHEMBL3363553 0.77 KDM4E (0.41) KDM4EALDH1A1POLBALOX15
SCHEMBL3364687 0.75 ALDH1A1 (0.32) ALDH1A1
SCHEMBL5417038 0.75 KDM4E (0.35) KDM4EALDH1A1POLBALOX15
SCHEMBL3367438 0.74 KDM4E (0.33) KDM4EALDH1A1POLBALOX15
SCHEMBL3364020 0.74 KDM4E (0.33) KDM4EALDH1A1POLBALOX15
SCHEMBL4379431 0.71 KDM4E (0.38) KDM4EALDH1A1POLBALOX15
SCHEMBL4271968 0.70 KDM4E (0.37) KDM4EALDH1A1POLBALOX15
SCHEMBL7146563 0.69 KDM4E (0.36) KDM4EALDH1A1POLBALOX15

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1164434-B1 Radiation-sensitive resin composition JSR CORP (JP) 2010-10-06 EP disclosed
US-7202016-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2007-04-10 US disclosed
US-6964840-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2005-11-15 US disclosed
US-20050214680-A1 Radiation-sensitive resin composition MIYAJI MASAAKI 2005-09-29 US disclosed
US-6933094-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2005-08-23 US disclosed
US-20040241580-A1 Radiation-sensitive resin composition NISHIMURA YUKIO (JP) 2004-12-02 US disclosed
US-6800414-B2 FLUOROPOLYMER JSR CORPORATION (JP) 2004-10-05 US disclosed
US-6623907-B2 Chemical amplified photoresist JSR CORPORATION (JP) 2003-09-23 US disclosed
US-20020058201-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2002-05-16 US disclosed
EP-1193558-A2 Radiation-sensitive resin composition JSR Corporation (JP) 2002-04-03 EP disclosed
US-20020009668-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2002-01-24 US disclosed
EP-1164434-A2 Radiation-sensitive resin composition JSR Corporation (JP) 2001-12-19 EP disclosed
US-20010023050-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2001-09-20 US disclosed
EP-1122605-A2 Radiation-sensitive resin composition JSR Corporation (JP) 2001-08-08 EP disclosed