SCHEMBL336816

SCHEMBL336816

Cc1ccc(S(=O)(=O)[O-])cc1.N#[N+]c1ccccc1

nearest known ligand 0.56

Known targets — ChEMBL curated mechanism

CHRM1CHRM2CHRM3CHRM4CHRM5SLC6A2dacAdacBdacCftsImrcAmrcBmrdA

The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA12 O43570 4/20 0.43
CA9 Q16790 4/20 0.43
CA1 P00915 2/20 0.43
CA2 P00918 2/20 0.43
HTT P42858 1/20 0.42
SMN1; SMN2 Q16637 1/20 0.42
GAA P10253 4/20 0.42
CYP3A4 P08684 3/20 0.41
CYP2D6 P10635 2/20 0.41
LMNA P02545 1/20 0.41
MAPK1 P28482 1/20 0.41
THPO P40225 1/20 0.41
CYP1A2 P05177 2/20 0.41
KDM4E B2RXH2 2/20 0.41
ALDH1A1 P00352 2/20 0.41
TDP1 Q9NUW8 2/20 0.41
CYP2C9 P11712 1/20 0.41
HPGD P15428 1/20 0.41
ALOX12 P18054 1/20 0.41
CYP2C19 P33261 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8431688 0.91 GAA (0.46) CA12CA9CA1CA2SMN1; SMN2
SCHEMBL10825103 0.89 HTR6 (0.41) CA12CA9CA1CA2SMN1; SMN2
SCHEMBL9333324 0.83 ALDH1A1 (0.42) CA12CA9CA1CA2HTT
Methyldiazonium SCHEMBL6359805 0.81 GAA (0.52) CA12CA9CA1CA2SMN1; SMN2
SCHEMBL28176280 0.81 KEAP1 (0.37) CA12CA9CA2PTGS2
SCHEMBL10418852 0.81 GAA (0.52) CA12CA9CA1CA2HTT
Sulfuric Acid SCHEMBL10539106 0.81 GAA (0.46) CA12CA9CA1CA2SMN1; SMN2
SCHEMBL1941777 0.80 LMNA (0.37) LMNATDP1
Sulfuric Acid SCHEMBL4738161 0.80 CA4 (0.37) CA12CA9CA1CA2SMN1; SMN2
Benzene SCHEMBL29261851 0.80 GAA (0.56) CA12CA9CA1CA2HTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119080824-A Method for synthesizing aryl stannane compound by ZnO@GO piezoelectric catalysis 西北大学 2024-12-06 CN disclosed
US-11021572-B2 Photosensitive resin composition, cured product of same, interlayer insulating film, surface protective film and electronic component HD MICROSYSTEMS, LTD. (JP) 2021-06-01 US disclosed
US-20190161580-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT OF SAME, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM AND ELECTRONIC COMPONENT HD MICROSYSTEMS, LTD. (JP) 2019-05-30 US disclosed
US-8765868-B2 Resin composition for insulating film or surface-protective film of electronic components, method for producing pattern-cured film and electronic components HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2014-07-01 US disclosed
US-8304149-B2 Photosensitive polymer composition, method of forming relief patterns, and electronic equipment HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2012-11-06 US disclosed
US-8097386-B2 Positive-type photosensitive resin composition, method for producing patterns, and electronic parts HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2012-01-17 US disclosed
US-7932012-B2 Polymer (polyimide or polybenzoxazole precursor) having an acid functional group, a compound having substituent(s) derived from an amine functional group as chain extender, a photoreactive compound, and a solvent; surface protecting film or interlayer dielectric for semiconductor device HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2011-04-26 US disclosed
US-20110076458-A1 PHOTOSENSITIVE POLYMER COMPOSITION, METHOD OF FORMING RELIEF PATTERNS, AND ELECTRONIC EQUIPMENT NUNOMURA MASATAKA 2011-03-31 US disclosed
US-20110027544-A1 Resin composition for insulating film or surface-protective film of electronic components, method for producing pattern-cured film and electronic components HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2011-02-03 US disclosed
US-7851128-B2 Photosensitive polymer composition, method of forming relief patterns, and electronic equipment HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2010-12-14 US disclosed
US-5753407-A Polyamic acid composition KABUSHIKI KAISHA TOSHIBA (JP) 1998-05-19 US disclosed
US-5744281-A P-HYDROXYSTYRENE POLYMER KABUSHIKI KAISHA TOSHIBA (JP) 1998-04-28 US disclosed
US-5658706-A CONTAINING COMPOUND WHICH DECOMPOSES INTO AN ACID KABUSHIKI KAISHA TOSHIBA (JP) 1997-08-19 US disclosed
US-5585217-A Polyamic acid composition KABUSHIKI KAISHA TOSHIBA (JP) 1996-12-17 US disclosed
US-5580702-A COMPRISING A PHOTOSENSITIVE ACID-GENERATING COMPOUND AND A COPOLYMER OF P-HYDROXYSTYRENE AND AN ESTER OF P-CARBOXYMETHOXYSTYRENE; NONTOXIC; STEEP WALLS; HIGH SPEED; SEMICONDUCTORS KABUSHIKI KAISHA TOSHIBA (JP) 1996-12-03 US disclosed
EP-0396254-B1 Photosensitive composition and pattern formation method using the same TOSHIBA KK (JP) 1996-07-10 EP disclosed
US-5403695-A Photolithography; high resolution; semiconductors KABUSHIKI KAISHA TOSHIBA (JP) 1995-04-04 US disclosed
US-5332648-A Alklali soluble phenolic polymer, cyclic ester or sulfonate which converts to the acid, an onium salt which generates an an acid on exposure to radiation KABUSHIKI KAISHA TOSHIBA (JP) 1994-07-26 US disclosed
US-5326675-A Pattern forming method including the formation of an acidic coating layer on the radiation-sensitive layer KABUSHIKI KAISHA TOSHIBA (JP) 1994-07-05 US disclosed
EP-0396254-A2 Photosensitive composition and pattern formation method using the same KABUSHIKI KAISHA TOSHIBA (JP) 1990-11-07 EP disclosed