Known targets — ChEMBL curated mechanism
ACHEBDKRB2CHRM1CHRM2CHRM3CHRNA1CHRNB1CHRNDCHRNECHRNGGUCY1A1GUCY1A2GUCY1B1GUCY1B2NAMPTPTAFRSLC10A2SLC6A2SLC6A3TACR1dacAdacBdacCftsImrcAmrcBmrdA
The experimentally established mechanism targets of Hydrochloric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 3/20 | 0.44 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.44 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.44 |
| ▸ | MAPT | P10636 | 2/20 | 0.44 |
| ▸ | RECQL | P46063 | 2/20 | 0.44 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.44 |
| ▸ | GAA | P10253 | 2/20 | 0.44 |
| ▸ | GLA | P06280 | 1/20 | 0.44 |
| ▸ | KDM1A | O60341 | 12/20 | 0.43 |
| ▸ | KEAP1 | Q14145 | 1/20 | 0.40 |
| ▸ | NFE2L2 | Q16236 | 1/20 | 0.40 |
| ▸ | NPC1 | O15118 | 1/20 | 0.38 |
| ▸ | PKM | P14618 | 1/20 | 0.38 |
| ▸ | RAB9A | P51151 | 1/20 | 0.38 |
| ▸ | KLF5 | Q13887 | 1/20 | 0.38 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.38 |
| ▸ | HPGD | P15428 | 3/20 | 0.38 |
| ▸ | CYP3A4 | P08684 | 3/20 | 0.38 |
| ▸ | TSHR | P16473 | 3/20 | 0.38 |
| ▸ | TP53 | P04637 | 2/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrochloric Acid SCHEMBL2856656 | 0.81 | IDO1 (0.44) | MEN1KMT2AKDM4EMAPTTDP1 | |
| Hydrochloric Acid SCHEMBL1812816 | 0.75 | RELA (0.37) | MEN1KMT2AKDM4EMAPTRECQL | |
| SCHEMBL16285329 | 0.72 | KDM1A (0.50) | MEN1KMT2AKDM4EMAPTRECQL | |
| SCHEMBL29019333 | 0.71 | GAA (0.45) | MEN1KMT2AKDM4EMAPTRECQL | |
| SCHEMBL111466 | 0.71 | MEN1 (0.45) | MEN1KMT2AKDM4EMAPTRECQL | |
| Hydrochloric Acid SCHEMBL27576854 | 0.70 | TDP1 (0.44) | MEN1KMT2AKDM4EMAPTRECQL | |
| Hydrochloric Acid SCHEMBL14895224 | 0.70 | MEN1 (0.44) | MEN1KMT2AKDM4EMAPTRECQL | |
| Hydrochloric Acid SCHEMBL4638633 | 0.70 | TDP1 (0.44) | MEN1KMT2AKDM4EMAPTRECQL | |
| Brilliant Green SCHEMBL608624 | 0.70 | ALDH1A1 (0.50) | MEN1KMT2AKDM4EMAPTTDP1 | |
| SCHEMBL11962221 | 0.70 | GAA (0.85) | MEN1KMT2AKDM4EMAPTRECQL |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 436 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2003022233-A1 | AGENT FOR DYEING KERATIN FIBERS, CONTAINING A BLUE CATIONIC ANTHRAQUINONE DYE | WELLA AKTIENGESELLSCHAFT (DE) | 2003-03-20 | — | — | WO | claimed |
| EP-0101807-B1 | TETRAMETHACRYLIC OR TETRAACRYLIC ACID COMPOUNDS AND THEIR USE | Blendax-Werke R. Schneider GmbH & Co. (DE) | 1987-03-25 | — | — | EP | claimed |
| US-4420306-A | DENTAL RESTORATIVE AND FILLING MATERIAL | BLENDAX-WERKE R. SCHNEIDER GMBH & CO. (DE) | 1983-12-13 | — | — | US | claimed |
| CN-122095314-A | Photosensitive resin laminate, method for forming resist pattern, and method for manufacturing wiring board having conductor pattern | — | 2026-05-26 | — | — | CN | disclosed |
| WO-2026100708-A1 | PHOTOSENSITIVE RESIN LAMINATE, PHOTOSENSITIVE ELEMENT, AND PATTERN FORMING METHOD | 旭化成株式会社 | 2026-05-15 | — | — | WO | disclosed |
| CN-114114841-B | Photosensitive resin laminate and method for forming resist pattern | 旭化成株式会社 | 2026-05-12 | — | — | CN | disclosed |
| CN-122029490-A | Photosensitive resin laminate, method for forming resist pattern, and method for forming wiring board | 旭化成株式会社 | 2026-05-12 | — | — | CN | disclosed |
| CN-120077329-A | Photosensitive resin composition, photosensitive resin laminate, and method for forming resist pattern | 旭化成株式会社 | 2025-05-30 | — | — | CN | disclosed |
| CN-120044756-A | Photosensitive resin composition | 旭化成株式会社 | 2025-05-27 | — | — | CN | disclosed |
| WO-2025095102-A1 | PHOTOSENSITIVE RESIN LAMINATE, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING WIRING BOARD HAVING CONDUCTOR PATTERN | 旭化成株式会社 | 2025-05-08 | — | — | WO | disclosed |
| WO-2025074970-A1 | PHOTOSENSITIVE RESIN LAMINATE, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR FORMING WIRING BOARD | 旭化成株式会社 | 2025-04-10 | — | — | WO | disclosed |
| EP-0475592-A2 | Coated article having improved adhesion to organic coatings | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1992-03-18 | — | — | EP | disclosed |
| US-5091033-A | ADHESIVE FOR CERAMICS AND PROCESSES FOR THE BONDING OF CERAMICS USING SAME | MITSUI SEKIYU KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 1992-02-25 | — | — | US | disclosed |
| EP-0206362-B1 | ADHESIVE COATING MATERIAL | TOKUYAMA SODA KABUSHIKI KAISHA (JP) | 1990-10-17 | — | — | EP | disclosed |
| US-4885332-A | WITH POLYACRYLOYL MONOMER AND FREE RADICAL INITIATOR | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1989-12-05 | — | — | US | disclosed |
| EP-0337695-A2 | Abrasion resistant coatings comprising silicon dioxide dispersions | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1989-10-18 | — | — | EP | disclosed |
| EP-0252603-A2 | Adhesives for ceramics and processes for the bonding of ceramics using same | MITSUI SEKIYU KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 1988-01-13 | — | — | EP | disclosed |
| US-4535102-A | CARBOXYLIC MONOMER WITH UNSATURATED ESTER OR OTHER VINYL COMPOUND AND ORGANIC TITANATE AND INITIATOR | TOKUYAMA SODA KABUSHIKI KAISHA (JP) | 1985-08-13 | — | — | US | disclosed |
| EP-0103420-A2 | Adhesive coating material | TOKUYAMA SODA KABUSHIKI KAISHA (JP) | 1984-03-21 | — | — | EP | disclosed |
| US-4420306-A | DENTAL RESTORATIVE AND FILLING MATERIAL | BLENDAX-WERKE R. SCHNEIDER GMBH & CO. (DE) | 1983-12-13 | — | — | US | disclosed |