SCHEMBL3418590

SCHEMBL3418590

C[Si](C)(CCCN)O[Si](CCCN)(c1ccccc1)c1ccccc1

nearest known ligand 0.36

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
HRH1 P35367 2/20 0.36
HTR2A P28223 1/20 0.36
MAOA P21397 1/20 0.33
TAAR1 Q96RJ0 1/20 0.32
KIF11 P52732 3/20 0.32
KCNH2 Q12809 1/20 0.31
MAOB P27338 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12634222 0.92 HTR2A (0.33) HRH1HTR2AMAOATAAR1
SCHEMBL13100638 0.91 HTR2A (0.33) HRH1HTR2AMAOA
SCHEMBL13829447 0.90 HRH1 (0.36) HRH1HTR2AMAOAKIF11KCNH2
SCHEMBL127764 0.88 HRH1 (0.37) HRH1HTR2AMAOATAAR1KIF11
SCHEMBL126332 0.87 HTR2A (0.42) HRH1HTR2AMAOATAAR1KIF11
SCHEMBL26017954 0.87 HTR2A (0.30) HRH1HTR2A
SCHEMBL20565391 0.86 MAOA (0.35) HRH1HTR2AMAOATAAR1KIF11
SCHEMBL1240249 0.84 MAOA (0.34) HRH1HTR2AMAOATAAR1KIF11
SCHEMBL20000036 0.84 MAOA (0.34) HRH1HTR2AMAOATAAR1KIF11
SCHEMBL5475785 0.83 MAOA (0.37) HRH1HTR2AMAOAKIF11KCNH2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20130065038-A1 POLYIMIDE FILM MORTECH CORPORATION (TW) 2013-03-14 US claimed
US-20090061243-A1 Metal clad laminate and the manufacturing method thereof MORTECH CORPORATION 2009-03-05 US claimed
WO-2023199718-A1 COPOLYIMIDE 三菱瓦斯化学株式会社 2023-10-19 WO disclosed
US-10688770-B2 Methods for solid freeform fabrication RICOH CO., LTD. (JP) 2020-06-23 US disclosed
US-10683393-B2 Methods of solid freeform fabrication RICOH CO., LTD. (JP) 2020-06-16 US disclosed
US-10675808-B2 Method for solid freeform fabrication RICOH COMPANY, LTD. (JP) 2020-06-09 US disclosed
US-20190071583-A1 Method for Solid Freeform Fabrication RICOH COMPANY, LTD. (JP) 2019-03-07 US disclosed
US-20190023576-A1 COMPOSITE MATERIAL CONTAINING ARTIFICIAL GRAPHITE, GRAPHITE SHEET AND MANUFACTURING METHOD OF MANUFACTURING THE SAME MORTECH CORPORATION (TW) 2019-01-24 US disclosed
US-10066119-B2 Method for solid freeform fabrication RICOH CO., LTD. (JP) 2018-09-04 US disclosed
US-9865879-B2 Binder for lithium ion battery electrode, paste for lithium ion battery negative electrode, and method for producing lithium ion battery negative electrode TORAY INDUSTRIES, INC. (JP) 2018-01-09 US disclosed
US-20180001544-A1 Method for Solid Freeform Fabrication RICOH COMPANY, LTD. (JP) 2018-01-04 US disclosed
US-9234085-B2 Polyimide film and polyimide laminate thereof MORTECH CORPORATION (TW) 2016-01-12 US disclosed
US-20140205824-A1 POLYIMIDE FILM AND POLYIMIDE LAMINATE THEREOF MORTECH CORPORATION (TW) 2014-07-24 US disclosed
US-20130280512-A1 POLYIMIDE FILM MORTECH CORPORATION (TW) 2013-10-24 US disclosed
US-20130273254-A1 POLYMIDE FILM AND METHOD FOR MANUFACTURING THE SAME MORTECH CORPORATION (TW) 2013-10-17 US disclosed
US-20130260020-A1 BINDER FOR LITHIUM ION BATTERY ELECTRODE, PASTE FOR LITHIUM ION BATTERY NEGATIVE ELECTRODE, AND METHOD FOR PRODUCING LITHIUM ION BATTERY NEGATIVE ELECTRODE TORAY INDUSTRIES, INC. (JP) 2013-10-03 US disclosed
US-20130065038-A1 POLYIMIDE FILM MORTECH CORPORATION (TW) 2013-03-14 US disclosed
US-20120118616-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, POLYIMIDE RESIN FILM USING SAME, AND FLEXIBLE PRINTED CIRCUIT BOARD SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. (JP) 2012-05-17 US disclosed
US-20100143706-A1 POLYIMIDE LAMINATE AND A METHOD OF FABRICATING THE SAME MORTECH CORPORATION (TW) 2010-06-10 US disclosed
US-20090061243-A1 Metal clad laminate and the manufacturing method thereof MORTECH CORPORATION 2009-03-05 US disclosed