Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HTR2A | P28223 | 4/20 | 0.42 |
| ▸ | HRH1 | P35367 | 3/20 | 0.42 |
| ▸ | MAOA | P21397 | 1/20 | 0.39 |
| ▸ | KIF11 | P52732 | 2/20 | 0.36 |
| ▸ | TAAR1 | Q96RJ0 | 3/20 | 0.34 |
| ▸ | CYP2A6 | P11509 | 1/20 | 0.33 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.33 |
| ▸ | LOXL2 | Q9Y4K0 | 1/20 | 0.33 |
| ▸ | KCNH2 | Q12809 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL127764 | 0.89 | HRH1 (0.37) | HTR2AHRH1MAOAKIF11TAAR1 | |
| SCHEMBL13829447 | 0.87 | HRH1 (0.36) | HTR2AHRH1MAOAKIF11KCNH2 | |
| SCHEMBL3418590 | 0.87 | HRH1 (0.36) | HTR2AHRH1MAOAKIF11TAAR1 | |
| SCHEMBL125897 | 0.87 | HRH1 (0.38) | HTR2AHRH1MAOAKIF11TAAR1 | |
| SCHEMBL24433793 | 0.84 | KIF11 (0.37) | HTR2AHRH1MAOAKIF11TAAR1 | |
| SCHEMBL5475785 | 0.83 | MAOA (0.37) | HTR2AHRH1MAOAKIF11KCNH2 | |
| SCHEMBL12634222 | 0.83 | HTR2A (0.33) | HTR2AHRH1MAOATAAR1 | |
| SCHEMBL13100638 | 0.82 | HTR2A (0.33) | HTR2AHRH1MAOA | |
| SCHEMBL18327988 | 0.82 | HTR2A (0.33) | HTR2AHRH1MAOA | |
| SCHEMBL10612613 | 0.81 | MAOA (0.34) | HTR2AHRH1MAOAKIF11TAAR1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 261 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115268215-B | Photosensitive polyimide resin composition, photosensitive polyimide film containing photosensitive polyimide resin composition and application of photosensitive polyimide film | 吉林奥来德光电材料股份有限公司 | 2025-05-16 | — | — | CN | claimed |
| CN-119781246-A | Photosensitive polyimide resin composition, cured film, and preparation method and application thereof | 吉林奥来德光电材料股份有限公司 | 2025-04-08 | — | — | CN | claimed |
| CN-118092074-B | Chemical amplification type positive photosensitive polyimide coating adhesive and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2024-08-20 | — | — | CN | claimed |
| CN-118092074-A | Chemical amplification type positive photosensitive polyimide coating adhesive and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2024-05-28 | — | — | CN | claimed |
| CN-115246930-B | Novel polyimide resin, photosensitive polyimide resin composition, and preparation methods and applications thereof | 吉林奥来德光电材料股份有限公司 | 2023-08-18 | — | — | CN | claimed |
| CN-115561966-B | Chemical amplification type negative photosensitive polyimide coating adhesive and application thereof | 明士(北京)新材料开发有限公司 | 2023-05-16 | — | — | CN | claimed |
| CN-112321827-B | Application of compound as polyimide curing accelerator, polyimide precursor and preparation method and application thereof | 中国科学院深圳先进技术研究院 | 2023-03-14 | — | — | CN | claimed |
| CN-115561966-A | Chemical amplification type negative photosensitive polyimide coating adhesive and application | 明士(北京)新材料开发有限公司 | 2023-01-03 | — | — | CN | claimed |
| EP-2949719-B1 | ADHESIVE COMPOSITION | TORAY INDUSTRIES (JP) | 2022-11-09 | — | — | EP | claimed |
| CN-114874441-A | Chemical amplification type positive photosensitive polyimide coating adhesive and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2022-08-09 | — | — | CN | claimed |
| CN-111892884-B | Hot-melt polyimide adhesive film and preparation method and application thereof | 中天电子材料有限公司 | 2022-07-22 | — | — | CN | claimed |
| CN-114621437-A | Compound for preparing photosensitive resin film, preparation method and application thereof | 吉林奥来德光电材料股份有限公司 | 2022-06-14 | — | — | CN | claimed |
| CN-114488690-A | Chemical amplification type negative polyimide photoresist and preparation method and application thereof | 中国科学院化学研究所 | 2022-05-13 | — | — | CN | claimed |
| US-20130065038-A1 | POLYIMIDE FILM | MORTECH CORPORATION (TW) | 2013-03-14 | — | — | US | claimed |
| US-20090061243-A1 | Metal clad laminate and the manufacturing method thereof | MORTECH CORPORATION | 2009-03-05 | — | — | US | claimed |
| US-4101487-A | HEAT CURABLE AROMATIC DIAMINE-DIACID-AIAMIDE COMPOUND | GENERAL ELECTRIC COMPANY (US) | 1978-07-18 | — | — | US | claimed |
| US-4073788-A | Partially imidized polyamide-acid polymers, aqueous coating compositions, coated wire and method, and partially imidized intermediate | GENERAL ELECTRIC COMPANY (US) | 1978-02-14 | — | — | US | claimed |
| CN-115268215-B | Photosensitive polyimide resin composition, photosensitive polyimide film containing photosensitive polyimide resin composition and application of photosensitive polyimide film | 吉林奥来德光电材料股份有限公司 | 2025-05-16 | — | — | CN | disclosed |
| US-4004062-A | WATER SOLUBLE AROMATIC ORTHOAMIC ACID DIAMINE | GENERAL ELECTRIC COMPANY (US) | 1977-01-18 | — | — | US | disclosed |
| US-4003947-A | REACTION PRODUCT OF AROMATIC DIAMINES AND DIANHYDRIDES; LADDER POLYMERS | GENERAL ELECTRIC COMPANY (US) | 1977-01-18 | — | — | US | disclosed |