SCHEMBL3435343

SCHEMBL3435343

Cc1c(C(C)C)cc(O)cc1C(C)C

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA1 P00915 2/20 0.46
CA2 P00918 2/20 0.46
LMNA P02545 3/20 0.44
HTR2B P41595 3/20 0.44
SLC6A2 P23975 2/20 0.44
CHRM1 P11229 2/20 0.44
ADRA1A P35348 2/20 0.44
TRPA1 O75762 1/20 0.44
GABRA1 P14867 6/20 0.42
GABRB1 P18505 4/20 0.42
GABRB2 P47870 4/20 0.42
ALDH1A1 P00352 1/20 0.41
CYP3A4 P08684 3/20 0.40
FAAH O00519 1/20 0.40
CYP1A2 P05177 1/20 0.40
HPGD P15428 1/20 0.40
TSHR P16473 1/20 0.40
GABRG2 P18507 1/20 0.40
PTGS1 P23219 1/20 0.40
HTR2C P28335 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1977309 0.87 HTR2B (0.42) CA1CA2LMNAHTR2BSLC6A2
SCHEMBL26500861 0.84 LMNA (0.48) CA1CA2LMNAHTR2BSLC6A2
SCHEMBL1760529 0.80 CA1 (0.70) CA1CA2LMNAHTR2BSLC6A2
SCHEMBL4907457 0.80 GABRA1 (0.50) CA1CA2LMNAHTR2BSLC6A2
SCHEMBL17323097 0.77 CA1 (0.81) CA1CA2LMNAHTR2BSLC6A2
SCHEMBL3283300 0.77 CA1 (0.52) CA1CA2LMNAHTR2BSLC6A2
SCHEMBL20636510 0.77 LMNA (0.42) CA1CA2LMNAHTR2BSLC6A2
SCHEMBL23735726 0.76 GABRA1 (0.34) CA1CA2LMNAHTR2BSLC6A2
SCHEMBL21251576 0.76 CA1 (0.44) CA1CA2LMNAHTR2BSLC6A2
SCHEMBL4712954 0.76 GABRA1 (0.52) CA1CA2LMNAHTR2BSLC6A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230194986-A1 CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-06-22 US disclosed
US-11131926-B2 Resist composition and resist patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-09-28 US disclosed
US-10416558-B2 Positive resist composition, resist pattern forming process, and photomask blank SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-09-17 US disclosed
WO-2019008025-A1 NOVEL SULFONAMIDE CARBOXAMIDE COMPOUNDS INFLAZOME LIMITED (IE) 2019-01-10 WO disclosed
US-20180039177-A1 POSITIVE RESIST COMPOSITION, RESIST PATTERN FORMING PROCESS, AND PHOTOMASK BLANK SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-02-08 US disclosed
US-9285679-B2 Actinic ray-sensitive or radiation-sensitive composition, and resist film, resist-coated mask blanks, resist pattern forming method and photomask each using the composition FUJIFILM CORPORATION (JP) 2016-03-15 US disclosed
US-9223219-B2 Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition and resist film FUJIFILM CORPORATION (JP) 2015-12-29 US disclosed
US-9223208-B2 Actinic-ray- or radiation-sensitive resin composition and method of forming pattern using the composition FUJIFILM CORPORATION (JP) 2015-12-29 US disclosed
US-8999621-B2 Pattern forming method, chemical amplification resist composition and resist film FUJIFILM CORPORATION (JP) 2015-04-07 US disclosed
US-8956802-B2 Pattern forming method, chemical amplification resist composition and resist film FUJIFILM CORPORATION (JP) 2015-02-17 US disclosed
US-8859192-B2 Negative pattern forming method and resist pattern FUJIFILM CORPORATION (JP) 2014-10-14 US disclosed
US-8808965-B2 Pattern forming method, pattern, chemical amplification resist composition and resist film FUJIFILM CORPORATION (JP) 2014-08-19 US disclosed
US-20130266777-A1 NEGATIVE PATTERN FORMING METHOD AND RESIST PATTERN FUJIFILM CORPORATION (JP) 2013-10-10 US disclosed
US-20130202999-A1 PATTERN FORMING METHOD, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM FUJIFILM CORPORATION (JP) 2013-08-08 US disclosed
US-20130171562-A1 ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE COMPOSITION FUJIFILM CORPORATION (JP) 2013-07-04 US disclosed
US-20120322007-A1 PATTERN FORMING METHOD, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM FUJIFILM CORPORATION (JP) 2012-12-20 US disclosed
US-20120288691-A1 PATTERN FORMING METHOD, PATTERN, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM FUJIFILM CORPORATION (JP) 2012-11-15 US disclosed
US-20120282548-A1 PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND RESIST FILM FUJIFILM CORPORATION (JP) 2012-11-08 US disclosed
US-20120148957-A1 PATTERN FORMING METHOD, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM FUJIFILM CORPORATION (JP) 2012-06-14 US disclosed
US-20120094235-A1 ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE COMPOSITION FUJIFILM CORPORATION (JP) 2012-04-19 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-10416558-B2 Positive resist composition, resist pattern forming process, and photomask blank LRRC47, SLIRP, COPE CA1 1046/4885CA2 463/4885LMNA 232/4885
US-11131926-B2 Resist composition and resist patterning process SLC11A2, RER1, GPS1 CA1 887/4885CA2 1104/4885LMNA 2403/4885
US-20120282548-A1 PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND RESIST FILM RAD51, RER1, RXRA CA1 795/4885CA2 3775/4885LMNA 2073/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.