SCHEMBL3476725

SCHEMBL3476725

CO[Si](OC)(OC)C(Cc1ccccc1)C(C)N

nearest known ligand 0.53

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
CYP2D6 P10635 1/20 0.53
TAAR1 Q96RJ0 4/20 0.52
SLC6A2 P23975 2/20 0.52
SIGMAR1 Q99720 2/20 0.52
MAOA P21397 1/20 0.52
SLC6A4 P31645 1/20 0.52
SLC6A3 Q01959 1/20 0.52
CYP2A6 P11509 1/20 0.52
ADORA2A P29274 1/20 0.52
ADORA1 P30542 1/20 0.52
EPHX1 P07099 1/20 0.45
LAP3 P28838 1/20 0.42
SLC18A2 Q05940 1/20 0.40
ANPEP P15144 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2719462 0.90 CYP2D6 (0.50) CYP2D6TAAR1SLC6A2SIGMAR1MAOA
SCHEMBL447453 0.82 SIGMAR1 (0.44) CYP2D6TAAR1SLC6A2SIGMAR1MAOA
SCHEMBL2719458 0.80 ALDH1A1 (0.46) CYP2D6TAAR1SLC6A2SIGMAR1MAOA
SCHEMBL2488884 0.79 SLC6A2 (0.52) CYP2D6TAAR1SLC6A2SIGMAR1MAOA
SCHEMBL339199 0.79 SIGMAR1 (0.47) CYP2D6TAAR1SLC6A2SIGMAR1MAOA
SCHEMBL1730609 0.79 TAAR1 (0.50) CYP2D6TAAR1SLC6A2SIGMAR1MAOA
SCHEMBL15453595 0.78 CYP2D6 (0.49) CYP2D6TAAR1SLC6A2SIGMAR1MAOA
SCHEMBL10696904 0.77 SIGMAR1 (0.48) CYP2D6TAAR1SLC6A2SIGMAR1MAOA
Ammonia Solution, Strong SCHEMBL28922168 0.76 SIGMAR1 (0.47) CYP2D6TAAR1SLC6A2SIGMAR1MAOA
SCHEMBL21271564 0.74 EPHX1 (0.43) CYP2D6TAAR1SLC6A2SIGMAR1MAOA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8784931-B2 ULSI wiring and method of manufacturing the same WASEDA UNIVERSITY (JP) 2014-07-22 US claimed
US-8784931-B2 ULSI wiring and method of manufacturing the same WASEDA UNIVERSITY (JP) 2014-07-22 US disclosed
US-20100006326-A1 ULSI WIRING AND METHOD OF MANUFACTURING THE SAME NEC ELECTRONICS CORPORATION (JP) 2010-01-14 US disclosed
CN-100341137-C Semiconductor multi-layer wiring plate and forming method thereof UNIV WASEDA (JP) 2007-10-03 CN disclosed
CN-1610091-A Semiconductor multi-layer wiring plate and forming method thereof UNIV WASEDA (JP) 2005-04-27 CN disclosed
US-20040126548-A1 ULSI wiring and method of manufacturing the same WASEDA UNIVERSITY 2004-07-01 US disclosed
US-20030124255-A1 ULSI wiring and method of manufacturing the same NEC CORPORATION 2003-07-03 US disclosed
US-20030124263-A1 ULSI wiring and method of manufacturing the same NEC CORPORATION 2003-07-03 US disclosed
US-20030008075-A1 ULSI wiring and method of manufacturing the same WASEDA UNIVERSITY, NEC CORPORATION 2003-01-09 US disclosed