Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAOA | P21397 | 1/20 | 0.46 |
| ▸ | HTR2A | P28223 | 2/20 | 0.41 |
| ▸ | CYP2A6 | P11509 | 1/20 | 0.41 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.41 |
| ▸ | TAAR1 | Q96RJ0 | 1/20 | 0.41 |
| ▸ | LOXL2 | Q9Y4K0 | 1/20 | 0.41 |
| ▸ | IDO1 | P14902 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11252138 | 0.90 | HTR2A (0.44) | MAOAHTR2ACYP2A6SMN1; SMN2TAAR1 | |
| SCHEMBL614447 | 0.88 | MAOA (0.46) | MAOAHTR2ACYP2A6SMN1; SMN2TAAR1 | |
| SCHEMBL447454 | 0.87 | DRD2 (0.46) | — | |
| Ethylenediamine SCHEMBL17417251 | 0.87 | HTR2A (0.50) | MAOAHTR2ACYP2A6SMN1; SMN2TAAR1 | |
| SCHEMBL28175344 | 0.86 | SIGMAR1 (0.44) | — | |
| SCHEMBL37761 | 0.85 | SIGMAR1 (0.42) | — | |
| SCHEMBL2488885 | 0.83 | HTR2A (0.42) | MAOAHTR2ACYP2A6SMN1; SMN2TAAR1 | |
| SCHEMBL6332013 | 0.82 | RAB9A (0.38) | SMN1; SMN2IDO1 | |
| SCHEMBL28531764 | 0.82 | MAOA (0.47) | MAOAHTR2ACYP2A6SMN1; SMN2TAAR1 | |
| SCHEMBL2111678 | 0.81 | TAAR1 (0.36) | SMN1; SMN2TAAR1IDO1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8784931-B2 | ULSI wiring and method of manufacturing the same | WASEDA UNIVERSITY (JP) | 2014-07-22 | — | — | US | claimed |
| CN-115968394-A | Ink composition containing luminescent particles, light conversion layer and light-emitting element | DIC株式会社 | 2023-04-14 | — | — | CN | disclosed |
| CN-115368873-A | Method for producing polishing composition | 福吉米株式会社 | 2022-11-22 | — | — | CN | disclosed |
| CN-113785031-B | Method for producing light-emitting particle, light-emitting particle dispersion, ink composition, and light-emitting element | DIC株式会社 | 2022-07-26 | — | — | CN | disclosed |
| CN-113785031-A | Method for producing light-emitting particle, light-emitting particle dispersion, ink composition, and light-emitting element | DIC株式会社 | 2021-12-10 | — | — | CN | disclosed |
| CN-113748185-A | Method for producing light-emitting particle, light-emitting particle dispersion, ink composition, and light-emitting element | DIC株式会社 | 2021-12-03 | — | — | CN | disclosed |
| CN-109153884-B | Composition for forming metal-containing film, method for producing composition for forming metal-containing film, semiconductor device, and method for producing semiconductor device | 三井化学株式会社 | 2021-03-09 | — | — | CN | disclosed |
| US-8784931-B2 | ULSI wiring and method of manufacturing the same | WASEDA UNIVERSITY (JP) | 2014-07-22 | — | — | US | disclosed |
| US-20100006326-A1 | ULSI WIRING AND METHOD OF MANUFACTURING THE SAME | NEC ELECTRONICS CORPORATION (JP) | 2010-01-14 | — | — | US | disclosed |
| US-7498520-B2 | Semiconductor multilayer wiring board and method of forming the same | WASEDA UNIVERSITY (JP) | 2009-03-03 | — | — | US | disclosed |
| CN-100341137-C | Semiconductor multi-layer wiring plate and forming method thereof | UNIV WASEDA (JP) | 2007-10-03 | — | — | CN | disclosed |
| US-20050110149-A1 | Semiconductor multilayer wiring board and method of forming the same | WASEDA UNIVERSITY (JP) | 2005-05-26 | — | — | US | disclosed |
| CN-1610091-A | Semiconductor multi-layer wiring plate and forming method thereof | UNIV WASEDA (JP) | 2005-04-27 | — | — | CN | disclosed |
| US-20040126548-A1 | ULSI wiring and method of manufacturing the same | WASEDA UNIVERSITY | 2004-07-01 | — | — | US | disclosed |
| US-20030124255-A1 | ULSI wiring and method of manufacturing the same | NEC CORPORATION | 2003-07-03 | — | — | US | disclosed |
| US-20030124263-A1 | ULSI wiring and method of manufacturing the same | NEC CORPORATION | 2003-07-03 | — | — | US | disclosed |
| US-20030008075-A1 | ULSI wiring and method of manufacturing the same | WASEDA UNIVERSITY, NEC CORPORATION | 2003-01-09 | — | — | US | disclosed |