SCHEMBL3481692

SCHEMBL3481692

Cc1cc(C)cc([SiH](O)O)c1

nearest known ligand 0.45

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.45
TSHR P16473 2/20 0.40
TPMT P51580 1/20 0.38
ACHE P22303 2/20 0.36
SELL P14151 1/20 0.36
SELP P16109 1/20 0.36
SELE P16581 1/20 0.36
PRSS1 P07477 1/20 0.36
PRSS2 P07478 1/20 0.36
C1S P09871 1/20 0.36
PRSS3 P35030 1/20 0.36
RXRA P19793 1/20 0.34
RXRB P28702 1/20 0.34
CA2 P00918 1/20 0.31
POLB P06746 1/20 0.31
TYR P14679 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
GAA P10253 1/20 0.30
MAPT P10636 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3482235 0.79 ALDH1A1 (0.43) ALDH1A1TSHRTPMTACHESELL
SCHEMBL16820306 0.73 ALDH1A1 (0.44) ALDH1A1TSHRTPMTACHESELL
Methyl Alcohol SCHEMBL27974355 0.71 ALDH1A1 (0.64) ALDH1A1TSHRTPMTACHESELL
Methyl Alcohol SCHEMBL28397318 0.71 ALDH1A1 (0.64) ALDH1A1TSHRTPMTACHESELL
SCHEMBL23027789 0.71 ALDH1A1 (0.42) ALDH1A1TSHRTPMTACHESELL
SCHEMBL341533 0.71 ALDH1A1 (0.67) ALDH1A1TSHRTPMTACHESELL
SCHEMBL26115 0.71
SCHEMBL3481666 0.69 ACHE (0.38) ALDH1A1TSHRTPMTACHERXRA
SCHEMBL3482163 0.69 ALDH1A1 (0.40) ALDH1A1TSHRTPMTACHESELL
SCHEMBL3834701 0.68 ALDH1A1 (0.60) ALDH1A1TSHRTPMTACHESELL

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105968360-B A kind of organosilicon ternary encapsulating material and preparation method thereof 深圳市国华光电科技有限公司 2018-10-16 CN disclosed
CN-105968360-A Organic-silicon ternary packaging material and preparation method thereof 深圳市国华光电科技有限公司 2016-09-28 CN disclosed
EP-2128897-B1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LTD (JP) 2015-05-06 EP disclosed
US-8716209-B2 Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device FUJITSU LIMITED (JP) 2014-05-06 US disclosed
US-20100007031-A1 AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2010-01-14 US disclosed
EP-2128897-A1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE Fujitsu Limited (JP) 2009-12-02 EP disclosed