Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TP53 | P04637 | 1/20 | 0.32 |
| ▸ | CA4 | P22748 | 1/20 | 0.32 |
| ▸ | LTA4H | P09960 | 1/20 | 0.31 |
| ▸ | LMNA | P02545 | 1/20 | 0.31 |
| ▸ | MEN1 | O00255 | 1/20 | 0.31 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL705849 | 0.88 | LTA4H (0.37) | TP53LTA4H | |
| SCHEMBL27622871 | 0.84 | LTA4H (0.37) | TP53LTA4HLMNAMEN1KMT2A | |
| SCHEMBL6268335 | 0.82 | CA4 (0.35) | TP53CA4LTA4H | |
| SCHEMBL641833 | 0.81 | TP53 (0.31) | TP53LTA4H | |
| SCHEMBL708782 | 0.81 | TP53 (0.36) | TP53LTA4H | |
| SCHEMBL3481491 | 0.79 | LMNA (0.36) | TP53LTA4HLMNAMEN1KMT2A | |
| SCHEMBL28684433 | 0.79 | CA2 (0.36) | TP53LTA4HLMNAMEN1KMT2A | |
| SCHEMBL15327776 | 0.78 | HDAC3 (0.37) | — | |
| SCHEMBL5704254 | 0.78 | KIF11 (0.37) | — | |
| SCHEMBL28684436 | 0.77 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| CN-101641767-B | Silicon dielectric treating agent for use after etching, process for producing semiconductor device, and semiconductor device | FUJITSU LTD | 2013-10-30 | — | — | CN | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-1539862-B1 | COMPOSITION ACTING AS COUPLING AGENT FOR FILLED AND PEROXIDICALLY CROSSLINKING RUBBER COMPOUNDS | EVONIK DEGUSSA GMBH (DE) | 2009-12-09 | — | — | EP | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |
| US-7625975-B2 | Composition acting as coupling agent for filled and peroxidically crosslinking rubber compounds | DEGUSSA AG (DE) | 2009-12-01 | — | — | US | disclosed |
| US-20070032609-A1 | Composition acting as coupling agent for filled and peroxidically crosslinking rubber compounds | DEGUSSA AG (DE) | 2007-02-08 | — | — | US | disclosed |
| EP-1539862-A1 | COMPOSITION ACTING AS COUPLING AGENT FOR FILLED AND PEROXIDICALLY CROSSLINKING RUBBER COMPOUNDS | Degussa AG (DE) | 2005-06-15 | — | — | EP | disclosed |
| WO-2004018546-A1 | COMPOSITION ACTING AS COUPLING AGENT FOR FILLED AND PEROXIDICALLY CROSSLINKING RUBBER COMPOUNDS | DEGUSSA AG (DE) | 2004-03-04 | — | — | WO | disclosed |