SCHEMBL3482205

SCHEMBL3482205

CCCCC(CCCC)[SiH2]O

nearest known ligand 0.40

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.40
DNM1 Q05193 2/20 0.39
FDPS P14324 1/20 0.39
CA2 P00918 5/20 0.37
MAPK1 P28482 1/20 0.37
CA1 P00915 3/20 0.36
TDP1 Q9NUW8 1/20 0.35
LMNA P02545 1/20 0.35
MAPT P10636 1/20 0.34
LCK P06239 1/20 0.34
PPARD Q03181 1/20 0.34
ZDHHC20 Q5W0Z9 1/20 0.34
ZDHHC2 Q9UIJ5 1/20 0.34
TSHR P16473 2/20 0.33
SMN1; SMN2 Q16637 1/20 0.33
CYP3A4 P08684 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3481430 0.89
SCHEMBL3481930 0.81
SCHEMBL3481896 0.81 LMNA (0.41) ALDH1A1FDPSCA1LMNAMAPT
SCHEMBL3482159 0.74
SCHEMBL708795 0.71 DNM1 (0.39) ALDH1A1DNM1FDPSCA2MAPK1
SCHEMBL8517997 0.71 DNM1 (0.39) ALDH1A1DNM1FDPSCA2MAPK1
SCHEMBL3189990 0.71 DNM1 (0.39) ALDH1A1DNM1FDPSCA2MAPK1
SCHEMBL16044986 0.71
SCHEMBL8384894 0.71 DNM1 (0.39) ALDH1A1DNM1FDPSCA2MAPK1
SCHEMBL705653 0.71 DNM1 (0.39) ALDH1A1DNM1FDPSCA2MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2128897-B1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LTD (JP) 2015-05-06 EP disclosed
US-8716209-B2 Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device FUJITSU LIMITED (JP) 2014-05-06 US disclosed
US-20100007031-A1 AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2010-01-14 US disclosed
EP-2128897-A1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE Fujitsu Limited (JP) 2009-12-02 EP disclosed