Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 1/20 | 0.39 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.33 |
| ▸ | CYSLTR2 | Q9NS75 | 1/20 | 0.30 |
| ▸ | CYSLTR1 | Q9Y271 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3482221 | 0.92 | TSHR (0.38) | TSHRSMN1; SMN2 | |
| SCHEMBL3481876 | 0.82 | TSHR (0.37) | TSHRSMN1; SMN2 | |
| SCHEMBL715340 | 0.82 | TSHR (0.39) | TSHR | |
| SCHEMBL31380293 | 0.81 | TSHR (0.48) | TSHRSMN1; SMN2CYSLTR2CYSLTR1 | |
| SCHEMBL707196 | 0.79 | GABRA1 (0.36) | TSHR | |
| SCHEMBL3481841 | 0.76 | TSHR (0.35) | TSHR | |
| SCHEMBL704445 | 0.75 | CYSLTR2 (0.40) | CYSLTR2CYSLTR1 | |
| SCHEMBL705169 | 0.74 | ESR1 (0.47) | TSHR | |
| SCHEMBL3481497 | 0.74 | ADRA2A (0.40) | TSHRCYSLTR2CYSLTR1 | |
| SCHEMBL3482257 | 0.73 | CYSLTR2 (0.46) | CYSLTR2CYSLTR1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |