SCHEMBL3482302

SCHEMBL3482302

Cl[Si](Cl)(Cl)CCCN1CCOCC1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KEAP1 Q14145 1/20 0.54
SMN1; SMN2 Q16637 1/20 0.54
HPGD P15428 1/20 0.48
DUSP3 P51452 1/20 0.48
LMNA P02545 2/20 0.46
ALDH1A1 P00352 3/20 0.43
KDM4E B2RXH2 2/20 0.43
GAA P10253 1/20 0.43
SIGMAR1 Q99720 2/20 0.43
POLB P06746 1/20 0.43
MAPK1 P28482 2/20 0.40
HIF1A Q16665 1/20 0.40
CYP1A2 P05177 1/20 0.40
CHRM2 P08172 1/20 0.40
CHRM1 P11229 1/20 0.40
HTR2A P28223 1/20 0.40
SCN1A P35498 1/20 0.40
HTR2B P41595 1/20 0.40
KCNH2 Q12809 1/20 0.40
SCN2A Q99250 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9517618 0.92 KEAP1 (0.50) KEAP1SMN1; SMN2HPGDDUSP3LMNA
SCHEMBL10411809 0.86 KDM4E (0.46) KEAP1SMN1; SMN2HPGDDUSP3LMNA
SCHEMBL3481711 0.85 KEAP1 (0.52) KEAP1SMN1; SMN2HPGDDUSP3LMNA
SCHEMBL9520262 0.85 KEAP1 (0.52) KEAP1SMN1; SMN2HPGDDUSP3LMNA
SCHEMBL13532385 0.80 KEAP1 (0.56) KEAP1SMN1; SMN2HPGDDUSP3LMNA
SCHEMBL26668773 0.78 KEAP1 (0.54) KEAP1SMN1; SMN2HPGDDUSP3LMNA
SCHEMBL1998867 0.78 KEAP1 (0.71) KEAP1SMN1; SMN2HPGDDUSP3LMNA
SCHEMBL7239607 0.78 KEAP1 (0.71) KEAP1SMN1; SMN2HPGDDUSP3LMNA
SCHEMBL16446525 0.77 HRH3 (0.56) SMN1; SMN2SIGMAR1MAPK1HIF1ACYP1A2
SCHEMBL9517507 0.77 HRH3 (0.56) SMN1; SMN2SIGMAR1MAPK1HIF1ACYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2128897-B1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LTD (JP) 2015-05-06 EP disclosed
US-8716209-B2 Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device FUJITSU LIMITED (JP) 2014-05-06 US disclosed
US-20100007031-A1 AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2010-01-14 US disclosed
EP-2128897-A1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE Fujitsu Limited (JP) 2009-12-02 EP disclosed
EP-0417755-B1 Packing for chromatography and its use for separating water soluble organic compounds DAISO CO LTD (JP) 1993-12-29 EP disclosed
US-5103000-A PACKING FOR CHROMATOGRAPHY AND METHOD FOR SEPARATING WATER SOLUBLE ORGANIC COMPOUNDS USING THE SAME DAISO CO., LTD. (JP) 1992-04-07 US disclosed
EP-0417755-A1 Packing for chromatography and its use for separating water soluble organic compounds DAISO CO., LTD. (JP) 1991-03-20 EP disclosed
US-4927750-A SEPARATION AND PURIFICATION OF BIOLOGICAL CELLS USING A COLLOIDAL SILICA, ORGANOSILANE REAGENT Simpson, Jeanette (US) 1990-05-22 US disclosed
EP-0263867-A4 REAGENT FOR CELL SEPARATION. SEPRATECH CORP (US) 1988-11-24 EP disclosed
EP-0263867-A1 REAGENT FOR CELL SEPARATION SEPRATECH CORPORATION (US) 1988-04-20 EP disclosed
WO-1987006233-A1 REAGENT FOR CELL SEPARATION SEPRATECH CORPORATION (US) 1987-10-22 WO disclosed