Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SIGMAR1 | Q99720 | 8/20 | 0.45 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.44 |
| ▸ | NAAA | Q02083 | 1/20 | 0.44 |
| ▸ | MAOA | P21397 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3342120 | 0.94 | SIGMAR1 (0.43) | SIGMAR1L3MBTL1 | |
| SCHEMBL837629 | 0.86 | TSHR (0.44) | — | |
| SCHEMBL3643181 | 0.83 | SIGMAR1 (0.49) | SIGMAR1L3MBTL1MAOA | |
| SCHEMBL11243376 | 0.79 | SIGMAR1 (0.45) | SIGMAR1L3MBTL1NAAA | |
| SCHEMBL9233304 | 0.79 | SIGMAR1 (0.46) | SIGMAR1L3MBTL1 | |
| SCHEMBL105419 | 0.78 | LMNA (0.53) | SIGMAR1L3MBTL1MAOA | |
| SCHEMBL10523450 | 0.77 | NAAA (0.44) | SIGMAR1L3MBTL1NAAA | |
| SCHEMBL1837086 | 0.77 | NAAA (0.56) | NAAA | |
| SCHEMBL10523459 | 0.77 | NAAA (0.47) | SIGMAR1L3MBTL1NAAA | |
| SCHEMBL7181668 | 0.77 | PDE4A (0.46) | SIGMAR1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |