SCHEMBL3483561

SCHEMBL3483561

CCOCC(COCC)OC(COCC)COCC

nearest known ligand 0.32

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.32
THRB P10828 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13986673 0.88 LMNA (0.32)
SCHEMBL3483356 0.83 ALDH1A1 (0.38) ALDH1A1
SCHEMBL19681660 0.81 OPRM1 (0.39) THRB
SCHEMBL11272278 0.79 ALDH1A1 (0.40) ALDH1A1THRB
SCHEMBL2607019 0.78 PRKD3 (0.41) ALDH1A1
SCHEMBL208312 0.78 THRB (0.42) ALDH1A1THRB
SCHEMBL10023016 0.75 THRB (0.40) THRB
SCHEMBL9575312 0.75 THRB (0.33) THRB
SCHEMBL11955576 0.75 THRB (0.40) THRB
SCHEMBL8916310 0.75 THRB (0.35) THRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240060004-A1 DETERGENT COMPOSITION FOR FIBERS KAO CORPORATION (JP) 2024-02-22 US disclosed
US-20240052261-A1 DETERGENT COMPOSITION FOR FIBERS KAO CORPORATION (JP) 2024-02-15 US disclosed
EP-4269680-A1 DETERGENT COMPOSITION FOR TEXTILES Kao Corporation (JP) 2023-11-01 EP disclosed
EP-4269547-A1 DETERGENT COMPOSITION FOR FIBERS Kao Corporation (JP) 2023-11-01 EP disclosed
US-20220025307-A1 WIPING DETERGENT COMPOSITION FOR TEXTILE PRODUCTS KAO CORPORATION (JP) 2022-01-27 US disclosed
EP-3904585-A1 WIPING DETERGENT COMPOSITION FOR FIBER PRODUCT Kao Corporation (JP) 2021-11-03 EP disclosed
WO-2020138001-A1 WIPING DETERGENT COMPOSITION FOR FIBER PRODUCT 花王株式会社 2020-07-02 WO disclosed
WO-2020138002-A1 WIPING DETERGENT SHEET FOR FIBER PRODUCT 花王株式会社 2020-07-02 WO disclosed
US-8217115-B2 Liquid resin composition, semiconductor wafer having adhesive layer, semiconductor element having adhesive layer, semiconductor package, process for manufacturing semiconductor element and process for manufacturing semiconductor package SUMITOMO BAKELITE COMPANY, LTD (JP) 2012-07-10 US disclosed
US-20100006998-A1 LIQUID RESIN COMPOSITION, SEMICONDUCTOR WAFER HAVING ADHESIVE LAYER, SEMICONDUCTOR ELEMENT HAVING ADHESIVE LAYER, SEMICONDUCTOR PACKAGE, PROCESS FOR MANUFACTURING SEMICONDUCTOR ELEMENT AND PROCESS FOR MANUFACTURING SEMICONDUCTOR PACKAGE SUMITOMO BAKELITE CO., LTD. (JP) 2010-01-14 US disclosed