SCHEMBL353837

SCHEMBL353837

C=C(C)C(=O)OCCOC(=O)c1cc(N)cc(N)c1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.46
SERPINE1 P05121 3/20 0.43
NPC1 O15118 3/20 0.42
POLB P06746 1/20 0.41
APEX1 P27695 1/20 0.41
HTT P42858 1/20 0.41
TDP1 Q9NUW8 1/20 0.41
TSHR P16473 5/20 0.41
LMNA P02545 2/20 0.41
CYP1A2 P05177 2/20 0.41
CYP3A4 P08684 2/20 0.41
CYP2C9 P11712 1/20 0.41
CYP2C19 P33261 1/20 0.41
PDE4D Q08499 1/20 0.41
PHLPP2 Q6ZVD8 1/20 0.40
CA1 P00915 1/20 0.39
CA2 P00918 1/20 0.39
RAB9A P51151 2/20 0.39
MAPT P10636 1/20 0.39
ALDH1A1 P00352 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16982215 0.94 TSHR (0.46) THRBSERPINE1NPC1POLBAPEX1
SCHEMBL27788176 0.94 TSHR (0.50) THRBSERPINE1NPC1POLBAPEX1
SCHEMBL14937515 0.92 TSHR (0.53) SERPINE1NPC1POLBAPEX1HTT
SCHEMBL12126372 0.91 NPC1 (0.42) THRBSERPINE1NPC1POLBAPEX1
SCHEMBL10040738 0.88 THRB (0.53) THRBSERPINE1POLBAPEX1HTT
SCHEMBL9755536 0.87 POLB (0.51) THRBNPC1POLBAPEX1HTT
SCHEMBL17343172 0.86 CNR1 (0.44) SERPINE1NPC1POLBAPEX1HTT
SCHEMBL15695702 0.85 THRB (0.47) THRBSERPINE1POLBAPEX1HTT
SCHEMBL18373598 0.84 LMNA (0.59) THRBNPC1POLBAPEX1HTT
SCHEMBL9478540 0.83 MAPK1 (0.42) THRBSERPINE1NPC1POLBAPEX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 135 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106990673-B Transparent and photosensitive polyimide resin composition 浙江福斯特新材料研究院有限公司 2021-06-11 CN claimed
CN-111708252-A Photosensitive frame covering film for flexible folding screen 浙江福斯特新材料研究院有限公司 2020-09-25 CN claimed
US-8703901-B2 Transparent, highly heat-resistant polyimide precursor and photosensitive polyimide composition thereof LG CHEM, LTD. (KR) 2014-04-22 US claimed
US-20120308741-A1 TRANSPARENT, HIGHLY HEAT-RESISTANT POLYIMIDE PRECURSOR AND PHOTOSENSITIVE POLYIMIDE COMPOSITION THEREOF LG CHEM, LTD. (KR) 2012-12-06 US claimed
US-20070093640-A1 Transparent, highly heat-resistant polyimide precursor and photosensitive polyimide composition thereof LG CHEM, LTD. (KR) 2007-04-26 US claimed
US-4595745-A Polycondensation product of aromatic dicarboxylic acid component comprising acids and acid halides with organic diamine comprising diamino chalcone and ester or ether containing diamine and nonphotocrosslinkable diamine UBE INDUSTRIES, LTD. (JP) 1986-06-17 US claimed
US-4558117-A Organic solvent-soluble photosensitive polyimide resin UBE INDUSTRIES, LTD. (JP) 1985-12-10 US claimed
JP-61238809-A None JP disclosed
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-09 US disclosed
WO-2024219463-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND CURED FILM 旭化成株式会社 2024-10-24 WO disclosed
CN-118302485-A Resin composition 日产化学株式会社 2024-07-05 CN disclosed
WO-2024095927-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME 旭化成株式会社 2024-05-10 WO disclosed
US-11976018-B2 Diamine compound, method for manufacturing the same, and applications thereof DAXIN MATERIALS CORP. (TW) 2024-05-07 US disclosed
WO-1995032941-A1 PROCESS FOR THE PREPARATION OF UNSATURATED AMINO COMPOUNDS CIBA-GEIGY AG (CH) 1995-12-07 WO disclosed
WO-1995032952-A1 PROCESS FOR THE PREPARATION OF 3-ARYLURACILS CIBA-GEIGY AG (CH) 1995-12-07 WO disclosed
US-4764181-A Process for producing an electrolytic capacitor UBE INDUSTRIES LTD. (JP) 1988-08-16 US disclosed
US-4673773-A AROMATIC POLYAMIDE DIELECTRIC UBE INDUSTRIES, LTD. (JP) 1987-06-16 US disclosed
JP-S61238809-A LIQUID PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION UBE IND LTD 1986-10-24 JP disclosed
US-4595745-A Polycondensation product of aromatic dicarboxylic acid component comprising acids and acid halides with organic diamine comprising diamino chalcone and ester or ether containing diamine and nonphotocrosslinkable diamine UBE INDUSTRIES, LTD. (JP) 1986-06-17 US disclosed
US-4558117-A Organic solvent-soluble photosensitive polyimide resin UBE INDUSTRIES, LTD. (JP) 1985-12-10 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME CD79B, ITGA1, PTK2 THRB 1053/4885SERPINE1 1592/4885NPC1 3340/4885
US-11976018-B2 Diamine compound, method for manufacturing the same, and applications thereof AOC1, C9, PYM1 THRB 3439/4885SERPINE1 2630/4885NPC1 3532/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.