SCHEMBL3546161

SCHEMBL3546161

CC(CCC1CC=CCC1)(C1CCCCC1)C1CCCCC1

nearest known ligand 0.34

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.34
TDP1 Q9NUW8 1/20 0.34
CYP1A2 P05177 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2996824 0.80 CYP1A2 (0.50) CYP1A2
SCHEMBL1524646 0.78 KDM4E (0.41) KDM4ETDP1CYP1A2
SCHEMBL1524564 0.76 KDM4E (0.38) KDM4ETDP1CYP1A2
SCHEMBL3546001 0.74 SIGMAR1 (0.47) KDM4ETDP1CYP1A2
SCHEMBL3549807 0.74 CYP1A2 (0.45) KDM4ETDP1CYP1A2
SCHEMBL3543149 0.73 SIGMAR1 (0.50) KDM4ETDP1CYP1A2
SCHEMBL3550474 0.73 SIGMAR1 (0.50) KDM4ETDP1CYP1A2
SCHEMBL1525295 0.71 ALDH1A1 (0.36) KDM4ETDP1CYP1A2
SCHEMBL297458 0.71 CDK1 (0.30)
SCHEMBL17580303 0.71 ALDH1A1 (0.39) KDM4ETDP1CYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-101087772-B High-purity alicyclic diepoxy compound and preparation method thereof DAICEL CHEM 2012-05-09 CN disclosed
CN-1934098-B High-purity alicyclic epoxy compound, process for producing the same, curable epoxy resin composition, cured article thereof, and use DAICEL CHEM 2012-04-25 CN disclosed
US-7732627-B2 High-purity cycloaliphatic diepoxy compound and preparation process thereof DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2010-06-08 US disclosed
US-20080045729-A1 High-Purity Cycloaliphatic Diepoxy Compound and Preparation Process Thereof DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2008-02-21 US disclosed
EP-1834949-A1 HIGH-PURITY ALICYCLIC DIEPOXY COMPOUND AND PROCESS FOR PRODUCING THE SAME Daicel Chemical Industries, Ltd. (JP) 2007-09-19 EP disclosed
US-20070179256-A1 High-purity alicyclic epoxy compound, process for production of the same, curable epoxy resin composition, cured product thereof, and application thereof DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2007-08-02 US disclosed
CN-1934098-A High-purity alicyclic epoxy compound, process for producing the same, curable epoxy resin composition, cured article thereof, and use DAICEL CHEM (JP) 2007-03-21 CN disclosed
EP-1726588-A1 HIGH-PURITY ALICYCLIC EPOXY COMPOUND, PROCESS FOR PRODUCING THE SAME, CURABLE EPOXY RESIN COMPOSITION, CURED ARTICLE THEREOF, AND USE Daicel Chemical Industries, Ltd. (JP) 2006-11-29 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20080045729-A1 High-Purity Cycloaliphatic Diepoxy Compound and Preparation Process Thereof DUOX2, SQLE, HPD KDM4E 3356/4885TDP1 4768/4885CYP1A2 434/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.