SCHEMBL36036

SCHEMBL36036

CCC1(COc2cccc(OCC3(CC)COC3)c2)COC1

nearest known ligand 0.45

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.45
ALDH1A1 P00352 4/20 0.40
SMN1; SMN2 Q16637 2/20 0.40
TP53 P04637 2/20 0.40
CYP3A4 P08684 2/20 0.40
HIF1A Q16665 1/20 0.40
KDM4E B2RXH2 1/20 0.38
HTT P42858 1/20 0.38
MAOB P27338 5/20 0.38
NPSR1 Q6W5P4 1/20 0.38
ALOX5 P09917 1/20 0.37
LMNA P02545 1/20 0.37
MAPK1 P28482 2/20 0.36
L3MBTL1 Q9Y468 1/20 0.35
POLB P06746 1/20 0.35
HSD17B10 Q99714 1/20 0.35
MEN1 O00255 1/20 0.35
KMT2A Q03164 1/20 0.35
APP P05067 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13724631 0.91 ACHE (0.44) TSHRALDH1A1KDM4EMAOBMAPK1
SCHEMBL13929125 0.89 TSHR (0.40) TSHRPOLBHSD17B10MEN1KMT2A
SCHEMBL9999594 0.89 TSHR (0.39) TSHRALDH1A1SMN1; SMN2TP53CYP3A4
SCHEMBL21028469 0.88 LTA4H (0.43) TSHRSMN1; SMN2TP53
SCHEMBL36030 0.88 MEN1 (0.41) TSHRLMNAPOLBHSD17B10MEN1
SCHEMBL36226 0.85 TSHR (0.40) TSHRALDH1A1LMNAMAPK1POLB
SCHEMBL1127568 0.84 AGXT (0.45) TSHRSMN1; SMN2KDM4EALOX5LMNA
SCHEMBL29366776 0.84 AGXT (0.45) TSHRSMN1; SMN2KDM4EALOX5LMNA
SCHEMBL36312 0.83 TSHR (0.38) TSHRALDH1A1SMN1; SMN2KDM4EALOX5
SCHEMBL29448188 0.83 TSHR (0.38) TSHRALDH1A1SMN1; SMN2KDM4EALOX5

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 360 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-09 US disclosed
US-20260063999-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-03-05 US disclosed
EP-4691764-A1 HEAT-ADHESIVE LAMINATE Toagosei Co., Ltd. (JP) 2026-02-11 EP disclosed
US-20250386649-A1 ENCAPSULATABLE MATERIAL FOR DISPLAY DEVICE, ENCAPSULATING MATERIAL, ORGANIC EL DISPLAY, AND LED DISPLAY MITSUI CHEMICALS, INC. (JP) 2025-12-18 US disclosed
US-12421337-B2 Resin composition and cured film ECHEM SOLUTIONS CORP. (TW) 2025-09-23 US disclosed
US-20250251663-A1 PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-08-07 US disclosed
CN-120153318-A Photosensitive resin composition, method for producing cured relief pattern using same, and method for producing polyimide film 旭化成株式会社 2025-06-13 CN disclosed
US-12313942-B2 Optical laminate and manufacturing method therefor, smart window comprising same, and vehicle and building windows and doors to which same are applied DONGWOO FINE-CHEM CO., LTD. (KR) 2025-05-27 US disclosed
WO-2025100302-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND SEMICONDUCTOR DEVICE 旭化成株式会社 2025-05-15 WO disclosed
US-20250145888-A1 LIQUID CRYSTAL ALIGNMENT AGENT, LIQUID CRYSTAL ALIGNMENT FILM, AND LIQUID CRYSTAL DISPLAY ELEMENT NISSAN CHEMICAL CORPORATION (JP) 2025-05-08 US disclosed
US-20070144400-A1 Cationic polymerizable resin composition MITSUI CHEMICALES, INC. (JP) 2007-06-28 US disclosed
US-20070037896-A1 polymerizable resin composition comprises an epoxy compound, a photo cation polymerization initiator, and a photo radical polymerization initiator; excellent in curing properties and corrosion resistance with less resin coloration and less cure shrinkage; surface protective material for optical disks MITSUI CHEMICALS, INC. (JP) 2007-02-15 US disclosed
US-20060222999-A1 Photosensitive composition and cured products thereof ASAHI KASEI CHEMICALS CORPORATION (JP) 2006-10-05 US disclosed
EP-1705202-A1 CATIONICALLY POLYMERIZABLE RESIN COMPOSITION Mitsui Takeda Chemicals, Inc. (JP) 2006-09-27 EP disclosed
US-20060199875-A1 Photo-curable resin composition BRIDGESTONE CORPORATION 2006-09-07 US disclosed
US-20060171627-A1 Optical device and method for producing the same BRIDGESTONE CORPORATION 2006-08-03 US disclosed
US-20060141393-A1 Alkali-soluble resin; a quinone diazide; and a mixture of surfactants including a 3-(perfluoroalkyl)-1,2-epoxypropane, reaction product between methylhydrobis(trimethylsiloxy)silane and polyalkylene glycol monoallyl ether preferably having a molecular weight from 200 to 500 and a 2nd ether silicone SAMSUNG ELECTRONICS CO., LTD. 2006-06-29 US disclosed
US-20060131267-A1 Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel SAMSUNG DISPLAY CO., LTD. (KR) 2006-06-22 US disclosed
EP-1657268-A1 PHOTOSENSITIVE COMPOSITION AND CURED PRODUCT THEREOF Asahi Kasei Chemicals Corporation (JP) 2006-05-17 EP disclosed
EP-1630189-A1 CATIONICALLY PHOTOPOLYMERIZABLE RESIN COMPOSITION AND OPTICAL DISK SURFACE PROTECTION MATERIAL Mitsui Chemicals, Inc. (JP) 2006-03-01 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME CD79B, ITGA1, PTK2 TSHR 2388/4885ALDH1A1 413/4885SMN1; SMN2 2936/4885
US-20260063999-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM ARCN1, PBRM1, LCP1 TSHR 4458/4885ALDH1A1 1600/4885SMN1; SMN2 2062/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.