SCHEMBL36050

SCHEMBL36050

COCN1C(=O)N(COC)C(OC)C1OC

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
L3MBTL1 Q9Y468 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4540306 0.90 L3MBTL1 (0.42) L3MBTL1
SCHEMBL14756634 0.90
SCHEMBL12166047 0.87 TP53 (0.34)
SCHEMBL13706072 0.87 L3MBTL1 (0.32) L3MBTL1
SCHEMBL12430562 0.86
SCHEMBL19959610 0.82 L3MBTL1 (0.36) L3MBTL1
SCHEMBL4540605 0.81 L3MBTL1 (0.39) L3MBTL1
SCHEMBL10202163 0.81 L3MBTL1 (0.39) L3MBTL1
SCHEMBL2605558 0.81 POLB (0.46)
SCHEMBL10801004 0.80

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 677 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119591780-A Photoresist additive and photoresist composition 合肥鼎材科技有限公司 2025-03-11 CN claimed
CN-113087843-B Polymer and photoresist composition containing same 北京鼎材科技有限公司 2023-10-13 CN claimed
US-11520083-B2 Member, imaging apparatus, and method for producing member CANON KABUSHIKI KAISHA (JP) 2022-12-06 US claimed
CN-122095297-A Composition for forming cured film, alignment material, and phase difference material 2026-05-26 CN disclosed
US-12527163-B2 Method for producing light-emitting elements CENTRAL GLASS COMPANY, LIMITED (JP) 2026-01-13 US disclosed
US-20260003282-A1 PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED CURED FILM TOKYO OHKA KOGYO CO LTD (JP) 2026-01-01 US disclosed
US-20260003283-A1 PHOTOSENSITIVE COMPOSITION, METHOD FOR FORMING PATTERNED SILICON-CONTAINING RESIN FILM, AND SILICON-CONTAINING RESIN TOKYO OHKA KOGYO CO LTD (JP) 2026-01-01 US disclosed
US-20260003284-A1 PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED SILICON-CONTAINING RESIN FILM TOKYO OHKA KOGYO CO LTD (JP) 2026-01-01 US disclosed
US-20260003277-A1 NEGATIVE PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED CURED FILM TOKYO OHKA KOGYO CO LTD (JP) 2026-01-01 US disclosed
EP-4667537-A1 PRIMER COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE TOKYO OHKA KOGYO CO., LTD. (JP) 2025-12-24 EP disclosed
CN-121165394-A Photosensitive resin composition, cured film, and color light-shielding layer 武汉柔显科技股份有限公司 2025-12-19 CN disclosed
US-20060210915-A1 Composition for forming lower layer film for lithography comprising compound having protected carboxyl group NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2006-09-21 US disclosed
EP-1703328-A1 COMPOSITION FOR FORMING NITRIDE COATING FILM FOR HARD MASK Nissan Chemical Industries, Ltd. (JP) 2006-09-20 EP disclosed
EP-1681594-A1 COMPOSITION FOR FORMING UNDERLYING FILM CONTAINING DEXTRIN ESTER COMPOUND Nissan Chemical Industries, Ltd. (JP) 2006-07-19 EP disclosed
EP-1662769-A1 COMPOSITION FOR FORMING LOWER LAYER FILM FOR LITHOGRAPHY COMPRISING COMPOUND HAVING PROTECTED CARBOXYL GROUP Nissan Chemical Industries, Ltd. (JP) 2006-05-31 EP disclosed
US-6864036-B2 Negative-working photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 2005-03-08 US disclosed
US-6406829-B1 BLEND OF ALKALI-SOLUBLE RESIN, ONIUM SALT AND ETHYLENEUREA COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2002-06-18 US disclosed
US-20020061467-A1 Negative-working photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 2002-05-23 US disclosed
US-4705570-A Method of manufacturing a bonded particulate article by reacting a polyol and a meterocyclic compound AMERICAN CYANAMID COMPANY (US) 1987-11-10 US disclosed
EP-0223113-A2 Method of manufacturing a bonded particulate article by reacting a polyol and a heterocyclic compound AMERICAN CYANAMID COMPANY (US) 1987-05-27 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260003282-A1 PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED CURED FILM H1-4, H1-10, H1-0 L3MBTL1 521/4885
US-20260003284-A1 PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED SILICON-CONTAINING RESIN FILM ASH2L, SEM1, COL1A1 L3MBTL1 2444/4885
US-20260003277-A1 NEGATIVE PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED CURED FILM H1-4, H1-10, H1-0 L3MBTL1 464/4885
US-20260003283-A1 PHOTOSENSITIVE COMPOSITION, METHOD FOR FORMING PATTERNED SILICON-CONTAINING RESIN FILM, AND SILICON-CONTAINING RESIN RARA, COL1A1, TAS1R1 L3MBTL1 3566/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.