Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TRPA1 | O75762 | 2/20 | 0.46 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.46 |
| ▸ | CACNA1C | Q13936 | 1/20 | 0.46 |
| ▸ | KDM4E | B2RXH2 | 8/20 | 0.43 |
| ▸ | MAPT | P10636 | 8/20 | 0.43 |
| ▸ | HIF1A | Q16665 | 3/20 | 0.43 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.43 |
| ▸ | CYP3A4 | P08684 | 3/20 | 0.43 |
| ▸ | MAPK1 | P28482 | 3/20 | 0.43 |
| ▸ | HPGD | P15428 | 3/20 | 0.43 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.43 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.43 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.43 |
| ▸ | CYP2D6 | P10635 | 2/20 | 0.43 |
| ▸ | ALOX12 | P18054 | 2/20 | 0.43 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.43 |
| ▸ | G6PD | P11413 | 1/20 | 0.43 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.43 |
| ▸ | PKM | P14618 | 1/20 | 0.43 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29373437 | 1.00 | TRPA1 (0.46) | TRPA1PTGS1CACNA1CKDM4EMAPT | |
| SCHEMBL18941007 | 0.91 | PTGS1 (0.39) | TRPA1PTGS1CACNA1CKDM4EMAPT | |
| SCHEMBL278561 | 0.88 | CYP2D6 (0.50) | TRPA1PTGS1CACNA1CKDM4EMAPT | |
| SCHEMBL10051844 | 0.85 | CYP3A4 (0.43) | TRPA1PTGS1CACNA1CKDM4EMAPT | |
| SCHEMBL20808844 | 0.85 | ALDH1A1 (0.43) | TRPA1PTGS1CACNA1CKDM4EMAPT | |
| SCHEMBL10296819 | 0.84 | TRPA1 (0.44) | TRPA1PTGS1CACNA1CKDM4EMAPT | |
| SCHEMBL12415075 | 0.83 | KDM4E (0.45) | TRPA1PTGS1CACNA1CKDM4EMAPT | |
| SCHEMBL21775831 | 0.83 | ALDH1A1 (0.45) | TRPA1PTGS1CACNA1CKDM4EMAPT | |
| SCHEMBL12922960 | 0.83 | KDM4E (0.45) | TRPA1PTGS1CACNA1CKDM4EMAPT | |
| SCHEMBL278773 | 0.83 | CYP1A2 (0.45) | TRPA1PTGS1CACNA1CKDM4EMAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 501 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7879528-B2 | For forming pattern that prevents contamination within the exposure apparatus; lithography | TOKYO OHKA KOGYO CO., LTD. (JP) | 2011-02-01 | — | — | US | claimed |
| US-20080176170-A1 | RESIST COMPOSITION FOR ELECTRON BEAM OR EUV | TOKYO OHKA KOGYO CO., LTD. (JP) | 2008-07-24 | — | — | US | claimed |
| US-20060177764-A1 | Positive-tone photosensitivity resin composition | EVERLIGHT USA, INC. (US) | 2006-08-10 | — | — | US | claimed |
| US-5434031-A | Positive-working naphthoquinone diazide photoresist composition containing specific hydroxy compound additive | TOKYO OHKA KOGYO CO., LTD. (JP) | 1995-07-18 | — | — | US | claimed |
| EP-3961676-B1 | ETCHING METHOD AND PHOTOSENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO LTD (JP) | 2025-01-22 | — | — | EP | disclosed |
| US-20240270891-A1 | PHENOLIC HYDROXY GROUP-CONTAINING RESIN, RESIN COMPOSITION FOR ALKALINE DEVELOPABLE RESIST, RESIST CURABLE RESIN COMPOSITION, AND METHOD FOR PRODUCING PHENOLIC HYDROXY GROUP-CONTAINING RESIN | DIC CORPORATION (JP) | 2024-08-15 | — | — | US | disclosed |
| CN-118325004-A | Phenolic hydroxyl group-containing resin, photosensitive resin composition, curable composition, and resist film | DIC株式会社 | 2024-07-12 | — | — | CN | disclosed |
| CN-114902135-B | Positive photosensitive resin composition, cured film, and resist film | DIC株式会社 | 2024-07-02 | — | — | CN | disclosed |
| CN-113348188-B | Phenolic hydroxyl group-containing resin, photosensitive composition, resist film, curable composition, and cured product | DIC株式会社 | 2024-05-10 | — | — | CN | disclosed |
| CN-117321109-A | Phenolic hydroxyl group-containing resin | DIC株式会社 | 2023-12-29 | — | — | CN | disclosed |
| CN-113227181-B | Resist composition | DIC株式会社 | 2023-07-18 | — | — | CN | disclosed |
| CN-116430671-A | Photoresist composition and photoetching process | 上海飞凯材料科技股份有限公司 | 2023-07-14 | — | — | CN | disclosed |
| US-5728504-A | Positive photoresist compositions and multilayer resist materials using the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 1998-03-17 | — | — | US | disclosed |
| US-5702862-A | ALKALI SOLUBLE RESIN; A QUINONE DIAZIDE GROUP-CONTAINING COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 1997-12-30 | — | — | US | disclosed |
| US-5702861-A | BLEND OF ALKALI SOLUBLE RESIN, QUINONE DIAZIDE COMPOUND AND AN AROMATIC POLYHYDROXY COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 1997-12-30 | — | — | US | disclosed |
| US-5601961-A | QUINONE DIAZIDE GROUP-CONTAINING COMPOUND AS PHOTOSENSITIZING AGENT, ALKALI-SOLUBLE RESINOUS INGREDIENT AS FILM-FORMING AGENT MADE FROM A BLEND OF AT LEAST TWO NOVOLAK-TYPE RESINS FROM M-AND P-CRESOL, A XYLENOL AND A TRIMETHYLPHENOL | TOKYO OHKA KOGYO CO., LTD. (JP) | 1997-02-11 | — | — | US | disclosed |
| US-5576138-A | MIXTURE OF RESIN, PHOTOSENSITIZER AND BENZOPHENONE COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 1996-11-19 | — | — | US | disclosed |
| US-5501936-A | IMPROVED RESOLUTION OF VERY FINE PATTERNS | TOKYO OHKA KOGYO CO., LTD. (JP) | 1996-03-26 | — | — | US | disclosed |
| US-5478692-A | Fine patterning for electronics | TOKYO OHKA KOGYO CO., LTD. (JP) | 1995-12-26 | — | — | US | disclosed |
| US-5434031-A | Positive-working naphthoquinone diazide photoresist composition containing specific hydroxy compound additive | TOKYO OHKA KOGYO CO., LTD. (JP) | 1995-07-18 | — | — | US | disclosed |