Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP2D6 | P10635 | 2/20 | 0.50 |
| ▸ | CYP2C9 | P11712 | 2/20 | 0.50 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.50 |
| ▸ | CYP2C19 | P33261 | 2/20 | 0.50 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.50 |
| ▸ | ALOX12 | P18054 | 2/20 | 0.50 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.50 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.50 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.50 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.50 |
| ▸ | MAPT | P10636 | 1/20 | 0.50 |
| ▸ | G6PD | P11413 | 1/20 | 0.50 |
| ▸ | PKM | P14618 | 1/20 | 0.50 |
| ▸ | HPGD | P15428 | 1/20 | 0.50 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.50 |
| ▸ | CCR6 | P51684 | 1/20 | 0.50 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.50 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.50 |
| ▸ | TRPA1 | O75762 | 2/20 | 0.47 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.47 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12415075 | 0.94 | KDM4E (0.45) | CYP2D6CYP2C9ALOX15CYP2C19ALDH1A1 | |
| SCHEMBL12922960 | 0.94 | KDM4E (0.45) | CYP2D6CYP2C9ALOX15CYP2C19ALDH1A1 | |
| SCHEMBL278773 | 0.94 | CYP1A2 (0.45) | CYP2D6CYP2C9ALOX15CYP2C19ALDH1A1 | |
| SCHEMBL21775831 | 0.94 | ALDH1A1 (0.45) | CYP2D6CYP2C9ALOX15CYP2C19ALDH1A1 | |
| SCHEMBL17570365 | 0.92 | PTGS1 (0.55) | CYP2D6CYP2C9ALOX15CYP2C19ALDH1A1 | |
| SCHEMBL13416158 | 0.92 | CYP1A2 (0.43) | CYP2D6CYP2C9ALOX15CYP2C19ALDH1A1 | |
| SCHEMBL5612635 | 0.90 | ALDH1A1 (0.45) | CYP2D6CYP2C9ALOX15CYP2C19ALDH1A1 | |
| SCHEMBL12005179 | 0.89 | CYP3A4 (0.41) | CYP2D6CYP2C9ALOX15CYP2C19ALDH1A1 | |
| SCHEMBL13416157 | 0.89 | ALDH1A1 (0.41) | CYP2D6CYP2C9ALOX15CYP2C19ALDH1A1 | |
| SCHEMBL36188 | 0.88 | TRPA1 (0.46) | CYP2D6CYP2C9ALOX15CYP2C19ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 89 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4063954-B1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE PHOTOSENSITIVE DRY FILM, METHOD FOR PRODUCING POSITIVE PHOTOSENSITIVE DRY FILM, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHINETSU CHEMICAL CO (JP) | 2023-10-04 | — | — | EP | disclosed |
| US-11768434-B2 | Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-09-26 | — | — | US | disclosed |
| US-11768434-B2 | Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-09-26 | — | — | US | disclosed |
| US-11572442-B2 | Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2023-02-07 | — | — | US | disclosed |
| US-11333975-B2 | Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2022-05-17 | — | — | US | disclosed |
| US-20220091509-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-03-24 | — | — | US | disclosed |
| EP-3951498-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE PHOTOSENSITIVE DRY FILM, METHOD FOR PRODUCING POSITIVE PHOTOSENSITIVE DRY FILM, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2022-02-09 | — | — | EP | disclosed |
| US-11150556-B2 | Polymer of polyimide precursor, positive type photosensitive resin composition, negative type photosensitive resin composition, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-10-19 | — | — | US | disclosed |
| US-20210317268-A1 | POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-10-14 | — | — | US | disclosed |
| US-20210317270-A1 | NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-10-14 | — | — | US | disclosed |
| EP-1375463-A1 | OPTICALLY ACTIVE COMPOUND AND PHOTOSENSITIVE RESIN COMPOSITION | Kansai Research Institute, Inc. (JP) | 2004-01-02 | — | — | EP | disclosed |
| US-20030211421-A1 | Optically active compound and photosensitive resin composition | KRI, INC. (JP) | 2003-11-13 | — | — | US | disclosed |
| US-20030129410-A1 | Ultraviolet protective dual layer laminate for polycarbonate resin substrates and method of manufacture thereof | GENERAL ELECTRIC COMPANY | 2003-07-10 | — | — | US | disclosed |
| US-6462165-B1 | REDUCED CONTENT OF IMPURITIES SUCH AS REMAINING MONOMERS AND OLIGOMERS AND HAVING EXCELLENT PHYSICAL PROPERTIES SUCH AS IMPACT STRENGTH, AND ALSO TO OPTICAL MATERIALS AND BLOW MOLDING MATERIALS | IDEMITSU PETROCHEMICAL CO., LTD. (JP) | 2002-10-08 | — | — | US | disclosed |
| US-6399738-B1 | OXIDATIVE CARBONYLATION OF AROMATIC HYDROXY COMPOUND WITH CARBON MONOXIDE AND OXYGEN | IDEMITSU PETROCHEMICAL CO., LTD. (JP) | 2002-06-04 | — | — | US | disclosed |
| EP-1069146-A1 | POLYCARBONATE AND OPTICAL MATERIAL | Idemitsu Petrochemical Co., Ltd. (JP) | 2001-01-17 | — | — | EP | disclosed |
| EP-1035151-A1 | BRANCHED POLYCARBONATE RESIN | Idemitsu Petrochemical Co., Ltd. (JP) | 2000-09-13 | — | — | EP | disclosed |
| EP-0709736-B1 | Method for producing compounds used in a positive chemically amplified resist composition | FUJI PHOTO FILM CO LTD (JP) | 1999-04-21 | — | — | EP | disclosed |
| US-5693452-A | FOR USE IN PRODUCTION OF SEMICONDUCTORS | FUJI PHOTO FILM CO., LTD. (JP) | 1997-12-02 | — | — | US | disclosed |
| EP-0709736-A1 | Positive chemically amplified resist composition and method for producing compounds used therein | FUJI PHOTO FILM CO., LTD. (JP) | 1996-05-01 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20030211421-A1 | Optically active compound and photosensitive resin composition | ARCN1, RAD51, PAM | CYP2D6 2877/4885CYP2C9 1479/4885ALOX15 336/4885 |
| US-11572442-B2 | Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component | BRIX1, RBX1, HAX1 | CYP2D6 4408/4885CYP2C9 2509/4885ALOX15 1375/4885 |
| US-20210317270-A1 | NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | BRIX1, HAX1, RBX1 | CYP2D6 4496/4885CYP2C9 2595/4885ALOX15 1544/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.