SCHEMBL278773

SCHEMBL278773

Cc1cc(C(c2ccc(O)cc2)c2cc(C)c(O)cc2C)c(C)cc1O

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 2/20 0.45
CYP3A4 P08684 2/20 0.45
CYP2D6 P10635 2/20 0.45
MAPT P10636 2/20 0.45
CYP2C9 P11712 2/20 0.45
ALOX15 P16050 2/20 0.45
CYP2C19 P33261 2/20 0.45
ALDH1A1 P00352 2/20 0.45
KDM4E B2RXH2 1/20 0.45
G6PD P11413 1/20 0.45
PKM P14618 1/20 0.45
HPGD P15428 1/20 0.45
ALOX12 P18054 1/20 0.45
MAPK1 P28482 1/20 0.45
CCR6 P51684 1/20 0.45
HIF1A Q16665 1/20 0.45
NPSR1 Q6W5P4 1/20 0.45
HSD17B10 Q99714 1/20 0.45
PTGS1 P23219 2/20 0.42
TRPA1 O75762 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13416158 0.98 CYP1A2 (0.43) CYP1A2CYP3A4CYP2D6MAPTCYP2C9
SCHEMBL12005179 0.95 CYP3A4 (0.41) CYP1A2CYP3A4CYP2D6MAPTCYP2C9
SCHEMBL278561 0.94 CYP2D6 (0.50) CYP1A2CYP3A4CYP2D6MAPTCYP2C9
SCHEMBL4055460 0.90 ESR1 (0.41) CYP1A2CYP3A4CYP2D6MAPTCYP2C9
SCHEMBL25998110 0.90 LMNA (0.45) CYP1A2CYP3A4CYP2D6MAPTCYP2C9
SCHEMBL18888468 0.90 TP53 (0.40) CYP1A2CYP3A4CYP2D6MAPTCYP2C9
SCHEMBL278739 0.90 TYR (0.44) CYP1A2CYP3A4CYP2D6MAPTCYP2C9
SCHEMBL23919975 0.89 PTGS1 (0.42) CYP1A2CYP3A4CYP2D6MAPTCYP2C9
SCHEMBL12415075 0.89 KDM4E (0.45) CYP1A2CYP3A4CYP2D6MAPTCYP2C9
SCHEMBL21775831 0.89 ALDH1A1 (0.45) CYP1A2CYP3A4CYP2D6MAPTCYP2C9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 388 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-8193054-A None JP disclosed
US-20260050215-A1 MATERIAL FOR FORMING SUPERFINE PATTERN, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN TREATMENT COMPOSITION AND FORMATION METHOD OF SUPERFINE PATTERN Advanced Echem Materials Company Limited (TW) 2026-02-19 US disclosed
CN-119620544-A Photosensitive resin composition, dry film, photosensitive dry film, resist film, molded substrate with mold, and method for producing plated molded article 东京应化工业株式会社 2025-03-14 CN disclosed
CN-119575759-A Positive photosensitive resin composition, photosensitive film, resist underlayer film, resist permanent film, and method for producing film DIC株式会社 2025-03-07 CN disclosed
CN-119361563-A Laminate and method for manufacturing electronic component 东京应化工业株式会社 2025-01-24 CN disclosed
EP-3961676-B1 ETCHING METHOD AND PHOTOSENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2025-01-22 EP disclosed
CN-118672058-A Photosensitive resin composition, resist film, resist underlayer film, and resist permanent film DIC株式会社 2024-09-20 CN disclosed
CN-116209690-B Phenolic hydroxyl group-containing resin, resin composition for alkali-developable resist, resist-curable resin composition, and method for producing phenolic hydroxyl group-containing resin DIC株式会社 2024-09-06 CN disclosed
US-20240270891-A1 PHENOLIC HYDROXY GROUP-CONTAINING RESIN, RESIN COMPOSITION FOR ALKALINE DEVELOPABLE RESIST, RESIST CURABLE RESIN COMPOSITION, AND METHOD FOR PRODUCING PHENOLIC HYDROXY GROUP-CONTAINING RESIN DIC CORPORATION (JP) 2024-08-15 US disclosed
CN-118325004-A Phenolic hydroxyl group-containing resin, photosensitive resin composition, curable composition, and resist film DIC株式会社 2024-07-12 CN disclosed
US-5556734-A RESISTS JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1996-09-17 US disclosed
JP-H08193054-A BIS(4-T-BUTOXYCARBONYLMETHYLOXY-2,5-DIMETHYLPHENYL) METHYL-4-T-BUTOXYCARBONYLMETHYLOXYBENZENE AND ITS DERIVATIVE SHIN ETSU CHEM CO LTD 1996-07-30 JP disclosed
US-5501936-A IMPROVED RESOLUTION OF VERY FINE PATTERNS TOKYO OHKA KOGYO CO., LTD. (JP) 1996-03-26 US disclosed
US-5478692-A Fine patterning for electronics TOKYO OHKA KOGYO CO., LTD. (JP) 1995-12-26 US disclosed
EP-0668540-A1 Positive working recording material with improved development properties HOECHST AKTIENGESELLSCHAFT (DE) 1995-08-23 EP disclosed
US-5434031-A Positive-working naphthoquinone diazide photoresist composition containing specific hydroxy compound additive TOKYO OHKA KOGYO CO., LTD. (JP) 1995-07-18 US disclosed
EP-0660187-A1 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1995-06-28 EP disclosed
US-5413896-A Light sensitive element with novolak resin and quinonediazide compounds JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1995-05-09 US disclosed
EP-0633499-A1 Radiation sensitive resist composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1995-01-11 EP disclosed
US-5332647-A Photosensitive resins for elements TOKYO OHKA KOGYO CO., LTD. (JP) 1994-07-26 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260050215-A1 MATERIAL FOR FORMING SUPERFINE PATTERN, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN TREATMENT COMPOSITION AND FORMATION METHOD OF SUPERFINE PATTERN SEM1, ASH2L, RAD51 CYP1A2 1955/4885CYP3A4 2840/4885CYP2D6 2417/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.