SCHEMBL3630933

SCHEMBL3630933

Nc1ccccc1C1c2ccccc2-c2ccccc21

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.52
L3MBTL1 Q9Y468 2/20 0.52
HTR2A P28223 2/20 0.46
ALOX15 P16050 2/20 0.45
CYP3A4 P08684 1/20 0.45
CASP1 P29466 1/20 0.45
CASP7 P55210 1/20 0.45
SMN1; SMN2 Q16637 1/20 0.45
HSD17B10 Q99714 1/20 0.44
GPR3 P46089 1/20 0.41
IDO1 P14902 1/20 0.38
ADORA2A P29274 2/20 0.37
PTPRC P08575 1/20 0.37
TSHR P16473 2/20 0.36
FGR P09769 1/20 0.36
PIM1 P11309 1/20 0.36
MAOA P21397 1/20 0.36
CSNK1A1 P48729 1/20 0.36
CSNK1D P48730 1/20 0.36
DYRK1A Q13627 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3831153 0.83 ALDH1A1 (0.46) ALDH1A1L3MBTL1HTR2AALOX15CYP3A4
SCHEMBL5160252 0.83 ALDH1A1 (0.52) ALDH1A1L3MBTL1HTR2AALOX15CYP3A4
SCHEMBL2594422 0.74 ALDH1A1 (0.50) ALDH1A1HTR2AHSD17B10GPR3RAB9A
SCHEMBL4022049 0.74 HTR2A (0.46) ALDH1A1L3MBTL1HTR2ACYP3A4GPR3
SCHEMBL29116619 0.72 HTR2A (0.50) ALDH1A1L3MBTL1HTR2ACYP3A4SMN1; SMN2
SCHEMBL115552 0.72 ALDH1A1 (0.44) ALDH1A1L3MBTL1HTR2AALOX15CYP3A4
SCHEMBL28773429 0.72 KDM1A (0.50) HTR2AGPR3IDO1MEN1KMT2A
SCHEMBL382854 0.72 MEN1 (0.46) ALDH1A1L3MBTL1HTR2AALOX15CYP3A4
SCHEMBL29945705 0.72 GPR3 (0.50) HTR2ACYP3A4GPR3TSHRGAA
SCHEMBL8840921 0.72 ALDH1A1 (0.48) ALDH1A1L3MBTL1HTR2AALOX15CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 145 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110114384-B Curable composition 3M创新有限公司 2022-06-07 CN claimed
CN-113165147-A Fast curing bonded abrasive article precursor 3M创新有限公司 2021-07-23 CN claimed
CN-112313262-A Curable compositions and related methods 3M创新有限公司 2021-02-02 CN claimed
EP-3652244-A1 RESIN COMPOSITION Hexcel Composites Limited (GB) 2020-05-20 EP claimed
EP-3652250-A1 RESIN COMPOSITION Hexcel Composites Limited (GB) 2020-05-20 EP claimed
CN-110997748-A Curable composition comprising an epoxy resin and a curable solid filler 3M创新有限公司 2020-04-10 CN claimed
EP-2900726-B1 RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN HEXCEL COMPOSITES LTD (GB) 2020-04-08 EP claimed
WO-2019011984-A1 RESIN COMPOSITION HEXCEL COMPOSITES LIMITED (GB) 2019-01-17 WO claimed
WO-2019011982-A1 RESIN COMPOSITION HEXCEL COMPOSITES LIMITED (GB) 2019-01-17 WO claimed
EP-2900726-A2 RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN Hexcel Composites Limited (GB) 2015-08-05 EP claimed
US-20150210847-A1 RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN HEXCEL COMPOSITES LIMITED (GB) 2015-07-30 US claimed
CN-102143987-B Heat-cured epoxy resin composition YOKOHAMA RUBBER CO LTD 2013-08-21 CN claimed
EP-0929841-A4 METHOD FOR FORMING PHOTORESIST FEATURES HAVING REENTRANT PROFILES USING A BASIC AGENT MKE QUANTUM COMPONENTS COLORAD (US) 2001-04-18 EP claimed
US-5955244-A Method for forming photoresist features having reentrant profiles using a basic agent QUANTUM CORPORATION (US) 1999-09-21 US claimed
EP-0929841-A1 METHOD FOR FORMING PHOTORESIST FEATURES HAVING REENTRANT PROFILES USING A BASIC AGENT Mke-Quantum Components Colorado LLC (US) 1999-07-21 EP claimed
WO-1998008143-A1 METHOD FOR FORMING PHOTORESIST FEATURES HAVING REENTRANT PROFILES USING A BASIC AGENT MKE-QUANTUM COMPONENTS COLORADO LLC (US) 1998-02-26 WO claimed
US-5541000-A Latent, thermal cure accelerators for epoxy-aromatic amine resins having lowered peak exotherms MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1996-07-30 US claimed
CN-113549217-B Polyimide precursor, resin composition containing same, polyimide resin film, and method for producing same 旭化成株式会社 2024-03-08 CN disclosed
US-5432010-A Binder resin for resin transfer molding preforms, preforms made therewith, and a method for preparing such preforms MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1995-07-11 US disclosed
US-5369192-A Aromatic epoxide with bis(aminophenyl)fluorene compound curing agent MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1994-11-29 US disclosed