⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL36675 | 1.00 | — | — | |
| SCHEMBL36923 | 0.95 | MMP1 (0.30) | — | |
| SCHEMBL3219159 | 0.94 | NAAA (0.35) | — | |
| SCHEMBL29144931 | 0.94 | NAAA (0.35) | — | |
| SCHEMBL36061 | 0.91 | — | — | |
| SCHEMBL10072232 | 0.88 | — | — | |
| SCHEMBL2958603 | 0.85 | MEN1 (0.34) | — | |
| SCHEMBL7062010 | 0.84 | MMP1 (0.33) | — | |
| SCHEMBL31589390 | 0.83 | MMP1 (0.41) | — | |
| SCHEMBL3250993 | 0.83 | MMP1 (0.31) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 592 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6153733-A | (Disulfonyl diazomethane compounds) | TOKYO OHKA KOGYO CO., LTD. (JP) | 2000-11-28 | — | — | US | claimed |
| CN-120044751-A | Photosensitive resin composition | 东京应化工业株式会社 | 2025-05-27 | — | — | CN | disclosed |
| WO-2024053579-A1 | PHOTOSENSITIVE RESIN COMPOSITION | 東京応化工業株式会社 | 2024-03-14 | — | — | WO | disclosed |
| US-20240034899-A1 | CURABLE COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-02-01 | — | — | US | disclosed |
| EP-3896522-B1 | PRODUCTION METHOD FOR SEMICONDUCTOR SUBSTRATE | TOKYO OHKA KOGYO CO LTD (JP) | 2023-05-03 | — | — | EP | disclosed |
| EP-3896522-A1 | PRODUCTION METHOD FOR SEMICONDUCTOR SUBSTRATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2021-10-20 | — | — | EP | disclosed |
| EP-2584409-B1 | RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, POLYMERIC COMPOUND, AND COMPOUND | TOKYO OHKA KOGYO CO LTD (JP) | 2021-04-28 | — | — | EP | disclosed |
| EP-2060600-B1 | Resist composition, method of forming resist pattern, novel compound, and acid generator | TOKYO OHKA KOGYO CO LTD (JP) | 2017-12-27 | — | — | EP | disclosed |
| US-9834696-B2 | Undercoat agent and method of forming pattern of layer containing block copolymer | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-12-05 | — | — | US | disclosed |
| US-9821338-B2 | Method of producing structure containing phase-separated structure utilizing a brush composition comprising PS-PMMA | TOKYO OHKA KOGYO., LTD. (JP) | 2017-11-21 | — | — | US | disclosed |
| EP-1602977-A1 | Positive resist composition and compound used therein | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-12-07 | — | — | EP | disclosed |
| US-20050266340-A1 | Positive resist composition and compound used therein | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-12-01 | — | — | US | disclosed |
| US-20050244740-A1 | Chemically amplified positive photo resist composition and method for forming resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-11-03 | — | — | US | disclosed |
| US-20050227170-A1 | Positive resist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-10-13 | — | — | US | disclosed |
| US-20050227171-A1 | Lift-off positive resist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-10-13 | — | — | US | disclosed |
| US-20050221225-A1 | Positive resist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-10-06 | — | — | US | disclosed |
| EP-1582926-A2 | Positive resist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-10-05 | — | — | EP | disclosed |
| EP-1582925-A2 | Positive resist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-10-05 | — | — | EP | disclosed |
| US-6180313-B1 | SUITABLE AS RADIATION-SENSITIVE ACID-GENERATING AGENT; PHOTORESISTS FOR USE IN PHOTOLITHOGRAPHY | TOKYO OHKA KOGYO CO., LTD. (JP) | 2001-01-30 | — | — | US | disclosed |
| US-6153733-A | (Disulfonyl diazomethane compounds) | TOKYO OHKA KOGYO CO., LTD. (JP) | 2000-11-28 | — | — | US | disclosed |