Hydrogen Sulfide

Hydrogen Sulfide

SCHEMBL3678041

Nc1ccc(-c2ccccc2N)cc1.Nc1ccc(-c2ccccc2N)cc1.S

nearest known ligand 0.68

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Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.68
HSD17B10 Q99714 3/20 0.68
L3MBTL1 Q9Y468 1/20 0.57
CYP3A4 P08684 3/20 0.52
TDP1 Q9NUW8 2/20 0.52
TAAR1 Q96RJ0 1/20 0.52
BCHE P06276 1/20 0.52
ACHE P22303 1/20 0.52
TP53 P04637 2/20 0.48
NCOA1 Q15788 2/20 0.44
NCOA3 Q9Y6Q9 2/20 0.44
SMN1; SMN2 Q16637 4/20 0.43
ALOX15 P16050 2/20 0.43
CASP1 P29466 1/20 0.43
CASP7 P55210 1/20 0.43
PRKCZ Q05513 1/20 0.42
DHFR P00374 1/20 0.42
KDM4E B2RXH2 3/20 0.41
HPGD P15428 2/20 0.41
NPC1 O15118 2/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrogen Sulfide SCHEMBL34563 1.00 ALDH1A1 (0.68) ALDH1A1HSD17B10L3MBTL1CYP3A4TDP1
SCHEMBL29510158 0.97 ALDH1A1 (0.71) ALDH1A1HSD17B10L3MBTL1CYP3A4TDP1
SCHEMBL599657 0.97 ALDH1A1 (0.71) ALDH1A1HSD17B10L3MBTL1CYP3A4TDP1
SCHEMBL31264297 0.95 ALDH1A1 (0.68) ALDH1A1HSD17B10L3MBTL1CYP3A4TDP1
Methane SCHEMBL3050883 0.95 ALDH1A1 (0.68) ALDH1A1HSD17B10L3MBTL1CYP3A4TDP1
SCHEMBL29471400 0.95 ALDH1A1 (0.68) ALDH1A1HSD17B10L3MBTL1CYP3A4TDP1
SCHEMBL7141191 0.95 ALDH1A1 (0.68) ALDH1A1HSD17B10L3MBTL1CYP3A4TDP1
Water SCHEMBL2446952 0.95 ALDH1A1 (0.68) ALDH1A1HSD17B10L3MBTL1CYP3A4TDP1
Biphenyl-4-Amine SCHEMBL6081432 0.91 ALDH1A1 (0.77) ALDH1A1HSD17B10L3MBTL1CYP3A4TDP1
Benzidine SCHEMBL28123514 0.91 ALDH1A1 (0.77) ALDH1A1HSD17B10L3MBTL1CYP3A4TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118210196-A Photosensitive resin composition, cured film pattern and method for producing the same 奇美实业股份有限公司 2024-06-18 CN disclosed
WO-2024111131-A1 POLYAMIC ACID ESTER AND RESIN COMPOSITION HDマイクロシステムズ株式会社 2024-05-30 WO disclosed
WO-2024111129-A1 METHOD FOR PRODUCING POLYIMIDE PRECURSOR, POLYIMIDE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING PATTERN CURED PRODUCT, AND ELECTRONIC COMPONENT HDマイクロシステムズ株式会社 2024-05-30 WO disclosed
WO-2024111130-A1 POLYAMIC ACID ESTER AND RESIN COMPOSITION HDマイクロシステムズ株式会社 2024-05-30 WO disclosed
WO-2024095573-A1 POLYIMIDE PRECURSOR AND RESIN COMPOSITION HDマイクロシステムズ株式会社 2024-05-10 WO disclosed
WO-2024084636-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING PATTERNED CURED PRODUCT, AND ELECTRONIC COMPONENT HDマイクロシステムズ株式会社 2024-04-25 WO disclosed
CN-117677672-A Resin composition and insulated wire 住友电气工业株式会社 2024-03-08 CN disclosed
US-20240018306-A1 RESIN COMPOSITION, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND METHOD FOR SYNTHESIZING POLYIMIDE PRECURSOR RESONAC CORPORATION (JP) 2024-01-18 US disclosed
US-11226560-B2 Photosensitive resin composition, cured pattern production method, cured product, interlayer insulating film, cover coat layer, surface protective layer, and electronic component HD MICROSYSTEMS, LTD. (JP) 2022-01-18 US disclosed
US-11021572-B2 Photosensitive resin composition, cured product of same, interlayer insulating film, surface protective film and electronic component HD MICROSYSTEMS, LTD. (JP) 2021-06-01 US disclosed
US-20130189622-A1 BLOCK COPOLYMER OF POLYMIDE AND POLYAMIC ACID, METHOD FOR PRODUCING THE BLOCK COPOLYMER, PHOTOSENSITIVE RESIN COMPOSITION COMPRISING THE BLOCK COPOLYMER AND PROTECTIVE FILM FORMED USING THE BLOCK COPOLYMER LG CHEM, LTD. (KR) 2013-07-25 US disclosed
US-20100069520-A1 Block copolymer of polyimide and polyamic acid, method for producing the block copolymer, photosensitive resin composition comprising the block copolymer and protective film formed using the block copolymer LG CHEM, LTD. (KR) 2010-03-18 US disclosed
US-7521511-B2 Thermosetting resin composition, multilayer body using same, and circuit board KANEKA CORPORATION (JP) 2009-04-21 US disclosed
US-20080306220-A1 Thermosetting Resin Composition, Multilayer Body Using Same, and Circuit Board KANEKA CORPORATION (JP) 2008-12-11 US disclosed
US-20060205891-A1 Thermosetting resin composition, multilayer body using same, and circuit board KANEKA CORPORATION (JP) 2006-09-14 US disclosed
EP-0940724-B1 Use of a solution for developing a photosensitive polyimide precursor, and method of patterning HITACHI CHEM DUPONT MICROSYS (JP) 2004-08-04 EP disclosed
US-6146815-A Developer for photosensitive polyimide precursor, and method of using it for patterning HITACHI CHEMICAL DUPONT MICROSYSTEMS L.L.C. (US) 2000-11-14 US disclosed
EP-0940724-A2 Developer for photosensitive polyimide precursor, and method of using it for patterning Hitachi Chemical DuPont MicroSystems Ltd. (JP) 1999-09-08 EP disclosed
US-4520186-A IMPROVING MECHANICAL PROPERTIES OF ELASTOMERS BAYER AKTIENGESELLSCHAFT (DE) 1985-05-28 US disclosed
US-4276386-A LIQUID AT ROOM TEMPERATURE OR LIQUEFIABLE BY GENTLE HEATING BAYER AKTIENGESELLSCHAFT (US) 1981-06-30 US disclosed