SCHEMBL36927

SCHEMBL36927

CS(=O)(=O)ON=C(C#N)c1ccc(Br)cc1

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GSK3B P49841 1/20 0.36
POLB P06746 1/20 0.35
MAPT P10636 5/20 0.35
KDM4E B2RXH2 1/20 0.35
CES2 O00748 1/20 0.34
CES1 P23141 1/20 0.34
RAB9A P51151 4/20 0.34
KMT2A Q03164 2/20 0.34
RECQL P46063 1/20 0.34
MEN1 O00255 1/20 0.34
LMNA P02545 1/20 0.34
MAPK1 P28482 1/20 0.34
NPSR1 Q6W5P4 1/20 0.34
RXFP1 Q9HBX9 1/20 0.34
ALDH1A1 P00352 1/20 0.34
NPC1 O15118 3/20 0.33
F2 P00734 1/20 0.33
PRSS1 P07477 1/20 0.33
PRSS2 P07478 1/20 0.33
PRSS3 P35030 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL296477 1.00 GSK3B (0.36) GSK3BPOLBMAPTKDM4ECES2
SCHEMBL18431381 0.92 PLA2G7 (0.36) MAPTNPC1PLA2G7
SCHEMBL9891196 0.92 PLA2G7 (0.36) MAPTNPC1PLA2G7
SCHEMBL19418706 0.92 PLA2G7 (0.36) MAPTNPC1PLA2G7
SCHEMBL14375142 0.85 HSD17B10 (0.38) MAPTLMNAALDH1A1PLA2G7SMN1; SMN2
SCHEMBL10233179 0.85 ENPP2 (0.37) MAPTKMT2AMEN1LMNAALDH1A1
SCHEMBL6706095 0.85 ALDH1A1 (0.36) POLBMAPTCES2CES1RAB9A
SCHEMBL5229634 0.85 ALDH1A1 (0.36) POLBMAPTCES2CES1RAB9A
SCHEMBL10233186 0.84 PLA2G7 (0.33) PLA2G7
SCHEMBL295508 0.83 PLA2G7 (0.46) POLBMAPTRAB9ALMNAMAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 780 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6042988-A ALKALI-SOLUBLE RESIN, A COMPOUND CAPABLE OF GENERATING AN ACID BY IRRADIATION AND A CROSSLINKING AGENT, AND FURTHER CONTAINS AN ORGANIC CARBOXYLIC ACID AS ACIDIC COMPOUND AND ORGANIC AMINE AS ALKALINE COMPOUND; DEFINITION AND PRECISION TOKYO OHKA KOGYO CO., LTD. (JP) 2000-03-28 US claimed
US-20250321485-A1 RESIST AUXILIARY FILM COMPOSITION, AND PATTERN FORMING METHOD USING SAME MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-10-16 US disclosed
CN-120044752-A Photosensitive resin composition 东京应化工业株式会社 2025-05-27 CN disclosed
CN-119452307-A Resist auxiliary film composition and pattern forming method using the same 三菱瓦斯化学株式会社 2025-02-14 CN disclosed
CN-119422108-A Resist composition and method for forming resist film using same 三菱瓦斯化学株式会社 2025-02-11 CN disclosed
CN-117769684-A Resist auxiliary film composition and pattern forming method using the same 三菱瓦斯化学株式会社 2024-03-26 CN disclosed
CN-117716290-A Resist composition and method for forming resist film using the same 三菱瓦斯化学株式会社 2024-03-15 CN disclosed
WO-2024014329-A1 RESIST COMPOSITION AND RESIST FILM FORMING METHOD USING SAME 三菱瓦斯化学株式会社 2024-01-18 WO disclosed
WO-2024014330-A1 RESIST AUXILIARY FILM COMPOSITION, AND PATTERN FORMING METHOD USING SAME 三菱瓦斯化学株式会社 2024-01-18 WO disclosed
US-11852970-B2 Material for lithography, production method therefor, composition for lithography, pattern formation method, compound, resin, and method for purifying the compound or the resin MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-12-26 US disclosed
US-6022666-A Chemical-sensitization photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 2000-02-08 US disclosed
US-5976760-A Chemical-sensitization resist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1999-11-02 US disclosed
US-5928837-A Negative-working chemical-sensitization photoresist composition comprising oxime sulfonate compounds TOKYO OHKA KOGYO CO., LTD. (JP) 1999-07-27 US disclosed
US-5929271-A Compounds for use in a positive-working resist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1999-07-27 US disclosed
US-5925495-A Photoresist laminate and method for patterning using the same TOKYO OHKA KOGYO CO., LTD. (JP) 1999-07-20 US disclosed
US-5902713-A Chemical-sensitization photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1999-05-11 US disclosed
US-5817444-A POLYHYDROXYSTYRENE SUBSTITUTED WITH TETRAHYDROPYRAN GROUPS, POLYHYDROXYSTYRENE SUBSTITUTED WITH ALKOXYALKYL GROUPS TOKYO OHKA KOGYO CO., LTD. (JP) 1998-10-06 US disclosed
EP-0848289-A1 Negative-working chemical sensitization photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1998-06-17 EP disclosed
EP-0821274-A1 Chemical-sensitization resist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1998-01-28 EP disclosed
EP-0780729-A1 Chemical-sensitization photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1997-06-25 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11852970-B2 Material for lithography, production method therefor, composition for lithography, pattern formation method, compound, resin, and method for purifying the compound or the resin SLC39A11, CROCC, TERB1 GSK3B 2009/4885POLB 2508/4885MAPT 1634/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.