SCHEMBL4352906

SCHEMBL4352906

CCCc1nc(C=O)c(C=O)[nH]1

nearest known ligand 0.38

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
GLA P06280 1/20 0.38
POLB P06746 1/20 0.36
KDM4C Q9H3R0 1/20 0.34
ADORA3 P0DMS8 2/20 0.33
ADORA2A P29274 2/20 0.33
ADORA1 P30542 2/20 0.33
KDM4E B2RXH2 1/20 0.33
KMT2A Q03164 1/20 0.33
PARP1 P09874 1/20 0.32
GPR84 Q9NQS5 1/20 0.30
PDE5A O76074 1/20 0.30
PDE3B Q13370 1/20 0.30
PDE3A Q14432 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3735333 0.89 PARP1 (0.43) PARP1GPR84
SCHEMBL3728620 0.86 GPR84 (0.45) PARP1GPR84
SCHEMBL4354597 0.84 ADORA1 (0.38) ADORA3ADORA2AADORA1
SCHEMBL9308282 0.81 GLA (0.38) GLAPOLBKDM4CKDM4EKMT2A
SCHEMBL11078634 0.81 GLA (0.38) GLAPOLBKDM4CADORA3ADORA2A
SCHEMBL7763940 0.79 GLA (0.37) GLAPOLBKDM4CADORA3ADORA2A
SCHEMBL9295900 0.79 GLA (0.37) GLAPOLBKDM4CKDM4EKMT2A
SCHEMBL895 0.79 GLA (0.37) GLAPOLBKDM4CKDM4EKMT2A
SCHEMBL9029353 0.79 GLA (0.37) GLAPOLBKDM4CKDM4EKMT2A
SCHEMBL4638662 0.79 GLA (0.37) GLAPOLBKDM4CKDM4EKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7614145-B2 Method for manufacturing multilayer circuit board and resin base material ZEON CORPORATION (JP) 2009-11-10 US disclosed
US-20080217617-A1 Thin Film Transistor, Wiring Board and Methods of Manufacturing the Same ZEON CORPORATION (JP) 2008-09-11 US disclosed
CN-100383278-C Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board ZEON CORP (JP) 2008-04-23 CN disclosed
US-20050153059-A1 Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board ZEON CORPORATION (JP) 2005-07-14 US disclosed
CN-1639384-A Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board ZEON CORP (JP) 2005-07-13 CN disclosed
US-20040237295-A1 Multilayer circuit board and resin base material, and its production method ZEON CORPORATION (JP) 2004-12-02 US disclosed