SCHEMBL379095

SCHEMBL379095

CCOC=C(C)C(=O)OCC(CC)(CO)CO

nearest known ligand 0.37

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.37
TP53 P04637 1/20 0.37
CYP3A4 P08684 1/20 0.37
MAPK1 P28482 1/20 0.37
SMN1; SMN2 Q16637 1/20 0.37
HIF1A Q16665 1/20 0.37
THRB P10828 1/20 0.32
KDM4E B2RXH2 1/20 0.31
PKM P14618 1/20 0.31
GLO1 Q04760 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4961102 1.00 ALDH1A1 (0.37) ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2
SCHEMBL226695 0.93 ALDH1A1 (0.39) ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2
SCHEMBL4398992 0.90 ALDH1A1 (0.35) ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2
SCHEMBL2637237 0.89 ALDH1A1 (0.34) ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2
SCHEMBL8583775 0.84 ALDH1A1 (0.40) ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2
SCHEMBL8583776 0.84 ALDH1A1 (0.40) ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2
SCHEMBL2764469 0.81 ALDH1A1 (0.40) ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2
SCHEMBL434900 0.80 ALDH1A1 (0.33) ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2
SCHEMBL2785110 0.80 THRB (0.33) ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2
SCHEMBL1998152 0.79

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 361 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20070178263-A1 Binder with barrier properties HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) 2007-08-02 US claimed
EP-1781746-A2 BONDING AGENT AND NANOPARTICLES WITH BARRIER PROPERTIES HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) 2007-05-09 EP claimed
US-7156944-B2 Fusible adhesives crosslinkable by radiation HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) 2007-01-02 US claimed
WO-2006015659-A2 BONDING AGENT AND NANOPARTICLES WITH BARRIER PROPERTIES HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) 2006-02-16 WO claimed
US-20050165164-A1 Fusible adhesives crosslinkable by radiation HENKEL AG & CO. KGAA (DE) 2005-07-28 US claimed
EP-3808811-B1 COMPOSITION FOR OPTICAL FILM, OPTICAL FILM AND DISPLAY DEVICE COMPRISING THE SAME LG CHEMICAL LTD (KR) 2024-06-26 EP disclosed
US-12009555-B2 Radical-curable seal member for fuel cell SUMITOMO RIKO COMPANY LIMITED (JP) 2024-06-11 US disclosed
US-11999157-B2 Transfer film, laminate, acoustic speaker, and method for producing laminate FUJIFILM CORPORATION (JP) 2024-06-04 US disclosed
EP-4366003-A1 RADICAL-CURABLE SEALING MEMBER FOR FUEL CELLS Sumitomo Riko Company Limited (JP) 2024-05-08 EP disclosed
WO-2024088029-A1 MODIFIED DIALLYL PHTHALATE RESIN COMPOUND, AND PREPARATION METHOD THEREFOR AND USE THEREOF 常州强力电子新材料股份有限公司 2024-05-02 WO disclosed
EP-3743449-B1 SEMI-FINISHED PRODUCTS BASED ON DUAL CROSS-LINKING MECHANISM COVESTRO DEUTSCHLAND AG (DE) 2024-04-17 EP disclosed
WO-2024057985-A1 ANTI-GLARE LAMINATE AND METHOD FOR MANUFACTURING SAME 三菱瓦斯化学株式会社 2024-03-21 WO disclosed
WO-2002034858-A1 REACTIVE ADHESIVE WITH A LOW MONOMER CONTENT AND WITH MULTISTAGE HARDENING HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) 2002-05-02 WO disclosed
US-20010021750-A1 Polymer compound, method of producing the same, photosensitive composition, and pattern formation method TOYO GOSEI KOGYO CO., LTD. (JP) 2001-09-13 US disclosed
EP-1117005-A1 Polymer compound, method of producing the same, photosensitive composition, and pattern formation method Toyo Gosei Kogyo Co., Ltd. (JP) 2001-07-18 EP disclosed
EP-0635031-A1 PROCESS FOR PRODUCING SURFACE-DISTRIBUTED, PRESSURE-SENSITIVE ADHESIVE MATERIALS BY RADICAL POLYMERISATION OF COMPOSITIONS CONTAINING ACRYLIC ACID AND/OR ACRYLIC ACID DERIVATES Lohmann GmbH & Co. KG (DE) 1995-01-25 EP disclosed
EP-0398713-B1 Photosensitive resin composition and laminate using the same HITACHI CHEMICAL CO LTD (JP) 1994-07-20 EP disclosed
WO-1993020112-A1 PROCESS FOR PRODUCING SURFACE-DISTRIBUTED, PRESSURE-SENSITIVE ADHESIVE MATERIALS BY RADICAL POLYMERISATION OF COMPOSITIONS CONTAINING ACRYLIC ACID AND/OR ACRYLIC ACID DERIVATES LOHMANN GMBH & CO. KG (DE) 1993-10-14 WO disclosed
US-4980266-A Excellent stability and resistance to plating HITACHI CHEMICAL COMPANY, LTD. (JP) 1990-12-25 US disclosed
EP-0398713-A2 Photosensitive resin composition and laminate using the same Hitachi Chemical Co., Ltd. (JP) 1990-11-22 EP disclosed