SCHEMBL382760

SCHEMBL382760

O=C1C(c2ccccc2)=C(c2ccccc2)C(=O)N1OS(=O)(=O)c1ccccc1C(F)(F)F

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ KMT2A Q03164 9/20 0.47
▸ MEN1 O00255 5/20 0.47
▸ ALDH1A1 P00352 6/20 0.41
▸ KDM4E B2RXH2 5/20 0.41
▸ MAPT P10636 5/20 0.41
▸ HPGD P15428 3/20 0.41
▸ F2 P00734 3/20 0.39
▸ HTT P42858 3/20 0.39
▸ LMNA P02545 1/20 0.39
▸ SMN1; SMN2 Q16637 1/20 0.39
▸ PARL Q9H300 2/20 0.38
▸ GBA1 P04062 1/20 0.38
▸ SLC22A12 Q96S37 5/20 0.38
▸ XBP1 P17861 1/20 0.37
▸ CYP2C9 P11712 1/20 0.36
▸ SLC22A6 Q4U2R8 1/20 0.36
▸ SLC22A8 Q8TCC7 1/20 0.36
▸ SLC22A11 Q9NSA0 1/20 0.36
▸ PTGS2 P35354 1/20 0.35
▸ VDR P11473 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29366384 1.00 KMT2A (0.47) KMT2AMEN1ALDH1A1KDM4EMAPT
SCHEMBL450075 0.84 KDM4E (0.55) KMT2AMEN1ALDH1A1KDM4EMAPT
SCHEMBL29369802 0.84 KDM4E (0.55) KMT2AMEN1ALDH1A1KDM4EMAPT
SCHEMBL4831923 0.78 KMT2A (0.50) KMT2AMEN1ALDH1A1SLC22A12CYP2C9
SCHEMBL452741 0.78 PARL (0.57) KMT2AMEN1ALDH1A1KDM4EMAPT
SCHEMBL29369615 0.78 PARL (0.57) KMT2AMEN1ALDH1A1KDM4EMAPT
SCHEMBL27975286 0.78 KMT2A (0.41) KMT2AMEN1ALDH1A1KDM4EMAPT
SCHEMBL2903856 0.78 KDM4E (0.51) KMT2AMEN1ALDH1A1KDM4EMAPT
SCHEMBL461885 0.77 KDM4E (0.61) KMT2AMEN1ALDH1A1KDM4EMAPT
SCHEMBL382979 0.77 PTGS2 (0.41) KMT2AMEN1ALDH1A1KDM4EMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 434 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-101154041-B Radiation sensitive resin composition, and formation of interlayer insulating film and microlens JSR CORP 2011-11-23 — — CN claimed
US-5994022-A BECOMES SOLUBLE IN ALKALI DEVELOPING SOLUTION BY ACTION OF AN ACID JSR CORPORATION (JP) 1999-11-30 — — US claimed
US-20240352203-A1 FILM-FORMING MATERIAL FOR SEMICONDUCTOR, MEMBER-FORMING MATERIAL FOR SEMICONDUCTOR, PROCESS MEMBER-FORMING MATERIAL FOR SEMICONDUCTOR, UNDERLAYER FILM-FORMING MATERIAL, UNDERLAYER FILM, AND SEMICONDUCTOR DEVICE ADEKA CORPORATION (JP) 2024-10-24 — — US disclosed
US-20240199854-A1 COMPOSITION, CURED FILM, STRUCTURAL BODY, OPTICAL FILTER, SOLID-STATE IMAGING ELEMENT, IMAGE DISPLAY DEVICE, AND MANUFACTURING METHOD OF CURED FILM FUJIFLIM CORPORATION (JP) 2024-06-20 — — US disclosed
EP-4375750-A1 FILM-FORMING MATERIAL FOR SEMICONDUCTOR, MEMBER-FORMING MATERIAL FOR SEMICONDUCTOR, PROCESS MEMBER-FORMING MATERIAL FOR SEMICONDUCTOR, UNDERLAYER FILM-FORMING MATERIAL, UNDERLAYER FILM, AND SEMICONDUCTOR DEVICE ADEKA CORPORATION (JP) 2024-05-29 — — EP disclosed
EP-3010943-B1 CURABLE COMPOSITION, FILM, AND METHOD OF PRODUCING FILM CANON KK (JP) 2024-04-03 — — EP disclosed
WO-2024057999-A1 COLORING COMPOSITION, CURED FILM, COLOR FILTER, DISPLAY DEVICE AND METHOD FOR PRODUCING CURED FILM 富士フイルム株式会社 2024-03-21 — — WO disclosed
CN-117616337-A Film forming material for semiconductor, member forming material for semiconductor, process member forming material for semiconductor, underlayer film forming material, underlayer film, and semiconductor device 株式会社艾迪科 2024-02-27 — — CN disclosed
WO-2023210418-A1 THERMOSETTING COMPOSITION, CURED PRODUCT, AND OPTICAL MEMBER 富士フイルム株式会社 2023-11-02 — — WO disclosed
CN-110383170-B Method for producing plated molded article JSR株式会社 2023-10-03 — — CN disclosed
US-11681227-B2 Enhanced EUV photoresist materials, formulations and processes IRRESISTIBLE MATERIALS LTD (GB) 2023-06-20 — — US disclosed
EP-0898201-A1 Radiation sensitive resin composition JSR Corporation (JP) 1999-02-24 — — EP disclosed
EP-0843220-A1 Radiation sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1998-05-20 — — EP disclosed
US-5679495-A TERPOLYMER PHOTORESIST CONTAINING VINYLPHENOL DERIVATIVE, TERT-BUTYL (METH)ACRYLATE, AND A UNIT TO REDUCE ALKALINE SOLUBILITY; DRY ETCH RESISTANCE JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1997-10-21 — — US disclosed
EP-0793144-A2 Radiation sensitive composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1997-09-03 — — EP disclosed
EP-0660187-B1 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO LTD (JP) 1997-03-05 — — EP disclosed
US-5556734-A RESISTS JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1996-09-17 — — US disclosed
US-5449705-A Silicon-containing polyamic acid derivative and photosensitive resin composition using it CHISSO CORPORATION (JP) 1995-09-12 — — US disclosed
US-5449588-A Shrinkage inhibition CHISSO CORPORATION (JP) 1995-09-12 — — US disclosed
EP-0660187-A1 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1995-06-28 — — EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20240352203-A1 FILM-FORMING MATERIAL FOR SEMICONDUCTOR, MEMBER-FORMING MATERIAL FOR SEMICONDUCTOR, PROCESS MEMBER-FORMING MATERIAL FOR SEMICONDUCTOR, UNDERLAYER FILM-FORMING MATERIAL, UNDERLAYER FILM, AND SEMICONDUCTOR DEVICE FBXL19, SRSF9, CNOT9 KMT2A 1297/4885MEN1 795/4885ALDH1A1 3931/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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