Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DPYD | Q12882 | 1/20 | 0.32 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.31 |
| ▸ | MAPT | P10636 | 1/20 | 0.31 |
| ▸ | TYMS | P04818 | 1/20 | 0.31 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL139174 | 0.83 | LMNA (0.36) | — | |
| SCHEMBL21828456 | 0.81 | L3MBTL1 (0.41) | L3MBTL1MAPT | |
| SCHEMBL6237802 | 0.81 | L3MBTL1 (0.41) | L3MBTL1MAPT | |
| SCHEMBL159174 | 0.81 | L3MBTL1 (0.41) | L3MBTL1MAPT | |
| SCHEMBL20499889 | 0.80 | — | — | |
| SCHEMBL28881677 | 0.78 | LMNA (0.31) | — | |
| SCHEMBL16848515 | 0.68 | HSP90AB1 (0.41) | — | |
| SCHEMBL20860813 | 0.68 | — | — | |
| SCHEMBL28613136 | 0.68 | KDM4E (0.31) | L3MBTL1 | |
| Styrene SCHEMBL4605348 | 0.67 | ALDH1A1 (0.56) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 818 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20220204696-A1 | PHENOLIC FUNCTIONALIZED POLYIMIDES AND COMPOSITIONS THEREOF | DESIGNER MOLECULES, INC | 2022-06-30 | — | — | US | claimed |
| CN-108475015-B | Photosensitive resin composition, dry film and printed wiring board | 互应化学工业株式会社 | 2022-03-18 | — | — | CN | claimed |
| CN-107209457-B | Photosensitive resin composition, dry film and printed wiring board | 互应化学工业株式会社 | 2021-03-26 | — | — | CN | claimed |
| CN-108291122-B | Anionically curable compositions | 设计分子有限公司 | 2021-01-05 | — | — | CN | claimed |
| WO-2020219852-A1 | PHENOLIC FUNCTIONALIZED POLYIMIDES AND COMPOSITIONS THEREOF | DESIGNER MOLECULES, INC. (US) | 2020-10-29 | — | — | WO | claimed |
| US-20180237668-A1 | ANIONIC CURABLE COMPOSITIONS | DESIGNER MOLECULES, INC. | 2018-08-23 | — | — | US | claimed |
| EP-3331959-A1 | ANIONIC CURABLE COMPOSITIONS | Designer Molecules, Inc. (US) | 2018-06-13 | — | — | EP | claimed |
| WO-2017027482-A1 | ANIONIC CURABLE COMPOSITIONS | DESIGNER MOLECULES, INC. (US) | 2017-02-16 | — | — | WO | claimed |
| EP-0166588-B1 | EPOXY RESIN COMPOSITION | SHIKOKU CHEMICALS CORPORATION (JP) | 1988-09-14 | — | — | EP | claimed |
| US-4593069-A | Containing 2-vinyl-4,6-diamino-s-triazine or adduct thereof with isocyanuric acid | SHIKOKU CHEMICALS CORP. (JP) | 1986-06-03 | — | — | US | claimed |
| EP-0166588-A1 | Epoxy resin composition | SHIKOKU CHEMICALS CORPORATION (JP) | 1986-01-02 | — | — | EP | claimed |
| JP-61009428-A | — | — | None | — | — | JP | disclosed |
| CN-114072444-B | Curable composition, cured product, overcoat film, flexible wiring board, and method for producing same | 日保丽公司 | 2024-07-09 | — | — | CN | disclosed |
| US-12017307-B2 | Flux for resin-cored solder, resin-cored solder, and soldering method | SENJU METAL INDUSTRY CO., LTD. (JP) | 2024-06-25 | — | — | US | disclosed |
| US-20240196545-A1 | ADHESIVE FOR PROVISIONALLY FIXING ELECTRONIC COMPONENT TO SOLDER PRECOAT AND METHOD FOR PRODUCING ELECTRONIC COMPONENT MOUNTED SUBSTRATE | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2024-06-13 | — | — | US | disclosed |
| US-4593069-A | Containing 2-vinyl-4,6-diamino-s-triazine or adduct thereof with isocyanuric acid | SHIKOKU CHEMICALS CORP. (JP) | 1986-06-03 | — | — | US | disclosed |
| US-4593069-A | Containing 2-vinyl-4,6-diamino-s-triazine or adduct thereof with isocyanuric acid | SHIKOKU CHEMICALS CORP. (JP) | 1986-06-03 | — | — | US | disclosed |
| JP-S619428-A | EPOXY RESIN COMPOSITION | SHIKOKU CHEM CORP | 1986-01-17 | — | — | JP | disclosed |
| EP-0166588-A1 | Epoxy resin composition | SHIKOKU CHEMICALS CORPORATION (JP) | 1986-01-02 | — | — | EP | disclosed |
| EP-0166588-A1 | Epoxy resin composition | SHIKOKU CHEMICALS CORPORATION (JP) | 1986-01-02 | — | — | EP | disclosed |