⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7038556 | 0.82 | CYP3A4 (0.40) | — | |
| SCHEMBL5613847 | 0.82 | — | — | |
| SCHEMBL2581786 | 0.80 | — | — | |
| SCHEMBL21722359 | 0.77 | PDCD1 (0.37) | — | |
| SCHEMBL148575 | 0.76 | TSHR (0.35) | — | |
| SCHEMBL21936342 | 0.76 | TSHR (0.35) | — | |
| SCHEMBL4144518 | 0.75 | CYP2A6 (0.38) | — | |
| SCHEMBL9787307 | 0.75 | — | — | |
| SCHEMBL29638145 | 0.75 | CYP2A6 (0.38) | — | |
| SCHEMBL23700716 | 0.71 | ALDH1A1 (0.45) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2015130652-A1 | SYNTHESIS OF OLIGOMERIC DIVINYLDIALKYLSILANE CONTAINING COMPOSITIONS | THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) | 2015-09-03 | — | — | WO | claimed |
| US-9085692-B1 | Synthesis of oligomeric divinyldialkylsilane containing compositions | THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) | 2015-07-21 | — | — | US | claimed |
| EP-1483112-B1 | HYDROSILYLATION CURE OF SILICONE RESIN CONTAINING COLLOIDAL SILICA AND A PROCESS FOR PRODUCING THE SAME | MASSACHUSETTS INST TECHNOLOGY (US) | 2006-12-06 | — | — | EP | claimed |
| EP-1483112-A4 | HYDROSILYLATION CURE OF SILICONE RESIN CONTAINING COLLOIDAL SILICA AND A PROCESS FOR PRODUCING THE SAME | MASSACHUSETTS INST TECHNOLOGY (US) | 2005-03-23 | — | — | EP | claimed |
| EP-1483112-A1 | HYDROSILYLATION CURE OF SILICONE RESIN CONTAINING COLLOIDAL SILICA AND A PROCESS FOR PRODUCING THE SAME | MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) | 2004-12-08 | — | — | EP | claimed |
| US-6646039-B2 | Hydrosilyation cured silicone resin containing colloidal silica and a process for producing the same | DOW CORNING CORPORATION | 2003-11-11 | — | — | US | claimed |
| WO-2003076182-A1 | HYDROSILYLATION CURE OF SILICONE RESIN CONTAINING COLLOIDAL SILICA AND A PROCESS FOR PRODUCING THE SAME | MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) | 2003-09-18 | — | — | WO | claimed |
| US-20030171476-A1 | HYDROSILYATION CURED SILICONE RESIN CONTAINING COLLOIDAL SILICA AND A PROCESS FOR PRODUCING THE SAME | DOW CORNING CORPORATION | 2003-09-11 | — | — | US | claimed |
| US-6596821-B1 | Producing a cured silsesquioxane resin. The process includes fractionating the silsesquioxane resin a plurality of times utilizing an organic solvent in combination with an organic non-solvent. The fractionated resin is then stripped of | DOW CORNING CORPORATION | 2003-07-22 | — | — | US | claimed |
| WO-2023223186-A1 | ADHESION MODIFIER COMPOSITION, AND CURABLE COMPOSITION AND METHOD OF BONDING INCLUDING THE SAME | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2023-11-23 | — | — | WO | disclosed |
| WO-2015130652-A1 | SYNTHESIS OF OLIGOMERIC DIVINYLDIALKYLSILANE CONTAINING COMPOSITIONS | THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) | 2015-09-03 | — | — | WO | disclosed |
| US-9085692-B1 | Synthesis of oligomeric divinyldialkylsilane containing compositions | THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) | 2015-07-21 | — | — | US | disclosed |
| EP-2076387-A2 | DUCTILE MULTILAYER SILICONE RESIN FILMS | Dow Corning Corporation (US) | 2009-07-08 | — | — | EP | disclosed |
| EP-2041801-A2 | A SOLAR CELL INCLUDING A SILICONE RESIN LAYER | Dow Corning Corporation (US) | 2009-04-01 | — | — | EP | disclosed |
| WO-2007145885-A2 | DUCTILE MULTILAYER SILICONE RESIN FILMS | DOW CORNING CORPORATION (US) | 2007-12-21 | — | — | WO | disclosed |
| EP-1856206-A1 | REINFORCED SILICONE RESIN FILM AND METHOD OF PREPARING SAME | Dow Corning Corporation (US) | 2007-11-21 | — | — | EP | disclosed |
| WO-2007123898-A1 | COPPER INDIUM DISELENIDE-BASED PHOTOVOLTAIC DEVICE AND METHOD OF PREPARING THE SAME | DOW CORNING CORPORATION (US) | 2007-11-01 | — | — | WO | disclosed |
| WO-2006088646-A1 | REINFORCED SILICONE RESIN FILM AND METHOD OF PREPARING SAME | DOW CORNING CORPORATION (US) | 2006-08-24 | — | — | WO | disclosed |
| EP-0661332-B1 | Silicon-containing reactive polymer and curable resin composition comprising the same | KANEGAFUCHI CHEMICAL IND (JP) | 2000-04-12 | — | — | EP | disclosed |
| EP-0661332-A2 | Silicon-containing reactive polymer and curable resin composition comprising the same | Kanegafuchi Chemical Industry Co., Ltd. (JP) | 1995-07-05 | — | — | EP | disclosed |