SCHEMBL3846079

SCHEMBL3846079

C=Cc1[c]ccc(C=C)c1

nearest known ligand 0.39

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.39
TDP1 Q9NUW8 2/20 0.37
TP53 P04637 1/20 0.37
TSHR P16473 1/20 0.35
TRPA1 O75762 1/20 0.31
HDAC8 Q9BY41 2/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1418811 0.74
SCHEMBL6300144 0.74
SCHEMBL28872389 0.74
SCHEMBL5125916 0.74
SCHEMBL6317124 0.74
SCHEMBL9401069 0.74
SCHEMBL292231 0.74
SCHEMBL21616763 0.70 TRPA1 (0.43) ALDH1A1TDP1TP53TSHRTRPA1
SCHEMBL7754056 0.70 TP53 (0.36) ALDH1A1TDP1TP53TSHRTRPA1
SCHEMBL3844845 0.69 ALDH1A1 (0.40) ALDH1A1TDP1TP53TSHRHDAC8

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1485369-B1 BLUE 3H-NAPHTHO- 2,1-B -PYRAN DERIVATIVES AND USE THEREOF RODENSTOCK GMBH (DE) 2008-08-20 EP claimed
US-20230340253-A1 RESIN COMPOSITION AND SHAPED ARTICLE KURARAY CO., LTD. (JP) 2023-10-26 US disclosed
WO-2023163111-A1 POLYETHER RESIN 味の素株式会社 2023-08-31 WO disclosed
EP-4219574-A1 RESIN COMPOSITION AND MOLDED ARTICLE Kuraray Co., Ltd. (JP) 2023-08-02 EP disclosed
CN-101068810-B Carbostyril compound OTSUKA PHARMA CO LTD 2011-02-09 CN disclosed
CN-101689411-A Organic insulating material, varnish for organic insulating film using the same, organic insulating film, and semiconductor device SUMITOMO BAKELITE CO 2010-03-31 CN disclosed
US-20090318610-A1 ORGANIC INSULATING MATERIALS, VARNISHES FOR ORGANIC INSULATING FILM EMPLOYING THEM, ORGANIC INSULATING FILMS AND SEMICONDUCTOR DEVICES SUMITOMO BAKELITE CO., LTD (JP) 2009-12-24 US disclosed
EP-2117009-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR ORGANIC INSULATING FILM USING THE SAME, ORGANIC INSULATING FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Co., Ltd. (JP) 2009-11-11 EP disclosed
CN-100497345-C 2, 3-dihydro-6-nitroimidazolo [2,1-b] oxazole compounds for the treatment of tuberculosis OTSUKA PHARMA CO LTD (JP) 2009-06-10 CN disclosed
CN-100360625-C Adhesive composition and adhesive article 3M INNOVATIVE PROPERTIES CO (US) 2008-01-09 CN disclosed
CN-101068810-A Carbostyril compound OTSUKA PHARMA CO LTD (JP) 2007-11-07 CN disclosed
CN-1878777-A 2,3-dihydro-6-nitroimidazo (2,1-b) oxazole compounds for the treatment of tuberculosis OTSUKA PHARMA CO LTD (JP) 2006-12-13 CN disclosed
EP-1211270-B1 STAR BLOCK COPOLYMER NIPPON SODA CO (JP) 2006-10-11 EP disclosed
CN-1509323-A Adhesive composition and adhesive article 3M 2004-06-30 CN disclosed
US-6713564-B1 HAVING ALKENYLPHENOL SKELETONS; HIGH MOLECULAR WEIGHT; LOW VISCOSITY NARROW MOLECULAR WEIGHT RANGE; RESIST MATERIAL NIPPON SODA CO. LTD. (JP) 2004-03-30 US disclosed
EP-1211270-A1 STAR BLOCK COPOLYMER NIPPON SODA CO., LTD. (JP) 2002-06-05 EP disclosed
EP-0676425-B1 Hydrogenated block copolymer and hydrogenated block copolymer composition JAPAN SYNTHETIC RUBBER CO LTD (JP) 1998-09-09 EP disclosed
US-5596041-A HYDROGENATED STAR BRANCHED BLOCK COPOLYMERS OF BUTADIENE FOR IMPACT STRENGTH, HEAT RESISTANCE, STIFFNESS AND MOLDINGS JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1997-01-21 US disclosed
EP-0676425-A1 Hydrogenated block copolymer and hydrogenated block copolymer composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1995-10-11 EP disclosed