Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.33 |
| ▸ | CA4 | P22748 | 1/20 | 0.32 |
| ▸ | THRB | P10828 | 1/20 | 0.32 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.32 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.31 |
| ▸ | ESR1 | P03372 | 1/20 | 0.30 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11130173 | 1.00 | TDP1 (0.33) | TDP1CA4THRBALDH1A1KDM4E | |
| SCHEMBL5363344 | 0.83 | CA4 (0.32) | CA4THRBKDM4EESR1ESR2 | |
| SCHEMBL28172890 | 0.81 | ESR1 (0.33) | CA4THRBALDH1A1KDM4EESR1 | |
| SCHEMBL106923 | 0.79 | TDP1 (0.37) | TDP1CA4THRBALDH1A1ESR1 | |
| SCHEMBL7242289 | 0.74 | POLB (0.33) | CA4ALDH1A1KDM4EESR1ESR2 | |
| SCHEMBL7190607 | 0.74 | POLB (0.33) | CA4ALDH1A1KDM4EESR1ESR2 | |
| SCHEMBL11526330 | 0.74 | ADRA2A (0.40) | TDP1ALDH1A1KDM4E | |
| SCHEMBL7786206 | 0.74 | MAPT (0.36) | TDP1ALDH1A1KDM4E | |
| SCHEMBL645558 | 0.72 | ALDH1A1 (0.35) | TDP1THRBALDH1A1KDM4E | |
| SCHEMBL5546414 | 0.72 | KMT2A (0.36) | TDP1ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12104113-B2 | Thermally conductive silicone composition, production method thereof, and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-10-01 | — | — | US | disclosed |
| US-20220275265-A1 | THERMALLY CONDUCTIVE SILICONE COMPOSITION, PRODUCTION METHOD THEREOF, AND SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-09-01 | — | — | US | disclosed |
| EP-4036964-A1 | THERMALLY CONDUCTIVE SILICONE COMPOSITION, PRODUCTION METHOD THEREOF, AND SEMICONDUCTOR DEVICE | Shin-Etsu Chemical Co., Ltd. (JP) | 2022-08-03 | — | — | EP | disclosed |
| EP-2794984-B1 | HEAT-TRANSFER TEXTILE INK | DOW CORNING (US) | 2017-09-27 | — | — | EP | disclosed |
| US-9315682-B2 | Heat-transfer textile ink | DOW CORNING CORPORATION (US) | 2016-04-19 | — | — | US | disclosed |
| US-20150004336-A1 | Heat-Transfer Textile Ink | DOW CORNING CORPORATION (US) | 2015-01-01 | — | — | US | disclosed |
| US-20140356590-A1 | Direct Printing Composition | DOW CORNING CORPORATION | 2014-12-04 | — | — | US | disclosed |
| EP-2794984-A2 | HEAT-TRANSFER TEXTILE INK | Dow Corning Corporation (US) | 2014-10-29 | — | — | EP | disclosed |
| EP-2794783-A2 | DERECT PRINTING COMPOSITION | Dow Corning Corporation (US) | 2014-10-29 | — | — | EP | disclosed |
| EP-1957597-B1 | CONTINUOUS PROCESS FOR PRODUCTION OF SILICONE PRESSURE SENSITIVE ADHESIVES | DOW CORNING (US) | 2014-04-30 | — | — | EP | disclosed |
| EP-0239049-B1 | IMPROVED BAKEWARE RELEASE COATING | DOW CORNING CORPORATION (US) | 1993-04-07 | — | — | EP | disclosed |
| US-5196477-A | Protective coating for metal contactor in electronic circuits | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1993-03-23 | — | — | US | disclosed |
| US-5180771-A | ROOM TEMPERATURE CURABLE ORGANOPOLYSILOXANE COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1993-01-19 | — | — | US | disclosed |
| US-4965333-A | BONDING ADHESIVE; IMPROVED SHELF LIFE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1990-10-23 | — | — | US | disclosed |
| EP-0392877-A2 | Room temperature curable organopolysiloxane composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1990-10-17 | — | — | EP | disclosed |
| US-4721766-A | Room temperature-curable organopolysiloxane composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1988-01-26 | — | — | US | disclosed |
| EP-0239049-A2 | Improved bakeware release coating | DOW CORNING CORPORATION (US) | 1987-09-30 | — | — | EP | disclosed |
| US-4677147-A | Bakeware release coating | DOW CORNING CORPORATION (US) | 1987-06-30 | — | — | US | disclosed |
| US-4064096-A | Curable, storage-stable liquid organopolysiloxane compositions | RHONE-POULENC INDUSTRIES (FR) | 1977-12-20 | — | — | US | disclosed |
| US-3965280-A | Use of organopolysiloxane compositions which cure at ambient temperature in coating electrical and electronic devices | RHONE-POULENC S.A. (FR) | 1976-06-22 | — | — | US | disclosed |