Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | POLB | P06746 | 1/20 | 0.40 |
| ▸ | HTT | P42858 | 1/20 | 0.40 |
| ▸ | GABRP | O00591 | 1/20 | 0.38 |
| ▸ | GABRD | O14764 | 1/20 | 0.38 |
| ▸ | GABRA1 | P14867 | 1/20 | 0.38 |
| ▸ | GABRB1 | P18505 | 1/20 | 0.38 |
| ▸ | GABRG2 | P18507 | 1/20 | 0.38 |
| ▸ | GABRB3 | P28472 | 1/20 | 0.38 |
| ▸ | GABRA5 | P31644 | 1/20 | 0.38 |
| ▸ | GABRA3 | P34903 | 1/20 | 0.38 |
| ▸ | GABRA2 | P47869 | 1/20 | 0.38 |
| ▸ | GABRB2 | P47870 | 1/20 | 0.38 |
| ▸ | GABRA4 | P48169 | 1/20 | 0.38 |
| ▸ | GABRE | P78334 | 1/20 | 0.38 |
| ▸ | GABRA6 | Q16445 | 1/20 | 0.38 |
| ▸ | GABRG1 | Q8N1C3 | 1/20 | 0.38 |
| ▸ | GABRG3 | Q99928 | 1/20 | 0.38 |
| ▸ | GABRQ | Q9UN88 | 1/20 | 0.38 |
| ▸ | SKP2 | Q13309 | 1/20 | 0.38 |
| ▸ | TLR8 | Q9NR97 | 2/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3937871 | 1.00 | POLB (0.40) | POLBHTTGABRPGABRDGABRA1 | |
| SCHEMBL831156 | 0.94 | SKP2 (0.41) | HTTGABRPGABRDGABRA1GABRB1 | |
| SCHEMBL5377222 | 0.90 | SKP2 (0.39) | HTTGABRPGABRDGABRA1GABRB1 | |
| SCHEMBL5372853 | 0.88 | TLR8 (0.41) | HTTTLR8TYR | |
| SCHEMBL5380950 | 0.88 | DHFR (0.44) | POLBHTTDHFRBACE1 | |
| SCHEMBL5377737 | 0.86 | TLR8 (0.43) | HTTTLR8TYR | |
| SCHEMBL9766396 | 0.86 | TLR8 (0.43) | HTTTLR8TYR | |
| SCHEMBL11414305 | 0.86 | SKP2 (0.46) | POLBHTTGABRPGABRDGABRA1 | |
| SCHEMBL48459 | 0.85 | HTT (0.50) | POLBHTTDHFRBACE1NOS2 | |
| SCHEMBL7549595 | 0.85 | SKP2 (0.47) | HTTGABRPGABRDGABRA1GABRB1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20130165603-A1 | Adhesive Composition And Adhesive Film Comprising The Same | CHEIL INDUSTRIES, INC. (KR) | 2013-06-27 | — | — | US | claimed |
| US-9957425-B2 | Adhesive composition for semiconductor and adhesive film including the same | CHEIL INDUSTRIES, INC. (KR) | 2018-05-01 | — | — | US | disclosed |
| US-9169425-B2 | Adhesive film and electronic device including the same | CHEIL INDUSTRIES, INC. (KR) | 2015-10-27 | — | — | US | disclosed |
| US-9109147-B2 | Adhesive composition for semiconductor and adhesive film comprising the same | CHEIL INDUSTRIES, INC. (KR) | 2015-08-18 | — | — | US | disclosed |
| US-8946343-B2 | Adhesive composition for semiconductors, adhesive film prepared using the same, and semiconductor device including the film | CHEIL INDUSTRIES, INC. (KR) | 2015-02-03 | — | — | US | disclosed |
| US-20140194555-A1 | ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM INCLUDING THE SAME | CHEIL INDUSTRIES, INC. (KR) | 2014-07-10 | — | — | US | disclosed |
| US-20140186607-A1 | ADHESIVE COMPOSITION FOR A SEMICONDUCTOR, ADHESIVE FILM PREPARED FROM THE COMPOSITION, AND SEMICONDUCTOR DEVICE CONNECTED BY THE FILM | CHEIL INDUSTRIES, INC. (KR) | 2014-07-03 | — | — | US | disclosed |
| US-20130281559-A1 | ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM COMPRISING THE SAME | CHEIL INDUSTRIES, INC. (KR) | 2013-10-24 | — | — | US | disclosed |
| US-20130165603-A1 | Adhesive Composition And Adhesive Film Comprising The Same | CHEIL INDUSTRIES, INC. (KR) | 2013-06-27 | — | — | US | disclosed |
| US-20130154125-A1 | ADHESIVE FILM AND ELECTRONIC DEVICE INCLUDING THE SAME | CHEIL INDUSTRIES INC. (KR) | 2013-06-20 | — | — | US | disclosed |
| US-5663287-A | SOLUBLE IN ORGANIC SOLVENTS AND EXCELS IN HEAT RESISTANCE | TOMOEGAWA PAPER CO., LTD. (JP) | 1997-09-02 | — | — | US | disclosed |
| US-5608013-A | Polyimides and thermosetting resin compositions containing the same | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1997-03-04 | — | — | US | disclosed |
| EP-0729996-A1 | Polyimide and process for producing the same | TOMOEGAWA PAPER CO. LTD. (JP) | 1996-09-04 | — | — | EP | disclosed |
| EP-0553612-B1 | Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides | HITACHI CHEMICAL CO LTD (JP) | 1996-08-21 | — | — | EP | disclosed |
| US-5510425-A | AROMATIC POLYIMIDE-EPOXY COPOLYMER MODIFIED BY BISMALEIMIDE COMPOUND; FLEXIBILITY, PEELING STRENGTH; COLDSETTING RESINS, ADHESIVES | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1996-04-23 | — | — | US | disclosed |
| US-5508357-A | SOLUBILITY IN SOLVENT, LOW MELTING POINT | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1996-04-16 | — | — | US | disclosed |
| EP-0456515-B1 | Polyimides and thermosetting resin compositions containing the same | HITACHI CHEMICAL CO LTD (JP) | 1995-11-08 | — | — | EP | disclosed |
| EP-0618614-A2 | Heat-resistant adhesive for the fabrication of a semiconductor package | Hitachi Chemical Co., Ltd. (JP) | 1994-10-05 | — | — | EP | disclosed |
| EP-0553612-A2 | Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides | HITACHI CHEMICAL CO., LTD. (JP) | 1993-08-04 | — | — | EP | disclosed |
| EP-0456515-A1 | Polyimides and thermosetting resin compositions containing the same | Hitachi Chemical Co., Ltd. (JP) | 1991-11-13 | — | — | EP | disclosed |