SCHEMBL3937871

SCHEMBL3937871

CCCCc1cc(Cc2cc(CC)c(N)c(CCCC)c2)cc(CC)c1N

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
POLB P06746 1/20 0.40
HTT P42858 1/20 0.40
GABRP O00591 1/20 0.38
GABRD O14764 1/20 0.38
GABRA1 P14867 1/20 0.38
GABRB1 P18505 1/20 0.38
GABRG2 P18507 1/20 0.38
GABRB3 P28472 1/20 0.38
GABRA5 P31644 1/20 0.38
GABRA3 P34903 1/20 0.38
GABRA2 P47869 1/20 0.38
GABRB2 P47870 1/20 0.38
GABRA4 P48169 1/20 0.38
GABRE P78334 1/20 0.38
GABRA6 Q16445 1/20 0.38
GABRG1 Q8N1C3 1/20 0.38
GABRG3 Q99928 1/20 0.38
GABRQ Q9UN88 1/20 0.38
SKP2 Q13309 1/20 0.38
TLR8 Q9NR97 2/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3945176 1.00 POLB (0.40) POLBHTTGABRPGABRDGABRA1
SCHEMBL831156 0.94 SKP2 (0.41) HTTGABRPGABRDGABRA1GABRB1
SCHEMBL5377222 0.90 SKP2 (0.39) HTTGABRPGABRDGABRA1GABRB1
SCHEMBL5372853 0.88 TLR8 (0.41) HTTTLR8TYR
SCHEMBL5380950 0.88 DHFR (0.44) POLBHTTDHFRBACE1
SCHEMBL5377737 0.86 TLR8 (0.43) HTTTLR8TYR
SCHEMBL9766396 0.86 TLR8 (0.43) HTTTLR8TYR
SCHEMBL11414305 0.86 SKP2 (0.46) POLBHTTGABRPGABRDGABRA1
SCHEMBL48459 0.85 HTT (0.50) POLBHTTDHFRBACE1NOS2
SCHEMBL7549595 0.85 SKP2 (0.47) HTTGABRPGABRDGABRA1GABRB1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7560307-B2 Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same HITACHI CHEMICAL COMPANY, LTD. (JP) 2009-07-14 US disclosed
US-7202359-B2 Azaoxa heterocyclic compound and method of preparing the same CHANG CHUN PLASTICS CO., LTD. (TW) 2007-04-10 US disclosed
US-20060180908-A1 Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same YANO YASUHIRO 2006-08-17 US disclosed
US-7061081-B2 Comprises polyamideetherimide or polyether amide; for use as coating material, adhesive and stress releasing material; controlled elasticity; dielectrics; electronics HITACHI CHEMICAL CO., LTD. (JP) 2006-06-13 US disclosed
US-20050255278-A1 Adhesive film, lead frame with adhesive film, and semiconductor device using same HITACHI CHEMICAL CO., LTD. (JP) 2005-11-17 US disclosed
US-20050085634-A1 Azaoxa heterocyclic compound and method of preparing the same CHANG CHUN PLASTICS CO., LTD. (TW) 2005-04-21 US disclosed
US-6744133-B2 Adhesive film for semiconductor, lead frame and semiconductor device using the same HITACHI CHEMICAL CO., LTD. (JP) 2004-06-01 US disclosed
US-20040068084-A1 Azaoxa heterocyclic compound and method of preparing the same CHANG CHUN PLASTICS CO., LTD. (TW) 2004-04-08 US disclosed
EP-0862205-B1 Heat-resistant adhesive HITACHI CHEMICAL CO LTD (JP) 2004-02-04 EP disclosed
US-20030102573-A1 Adhesive film for semiconductor, lead frame and semiconductor device using the same HITACHI CHEMICAL CO., LTD. (JP) 2003-06-05 US disclosed
US-5663287-A SOLUBLE IN ORGANIC SOLVENTS AND EXCELS IN HEAT RESISTANCE TOMOEGAWA PAPER CO., LTD. (JP) 1997-09-02 US disclosed
US-5608013-A Polyimides and thermosetting resin compositions containing the same HITACHI CHEMICAL COMPANY, LTD. (JP) 1997-03-04 US disclosed
EP-0729996-A1 Polyimide and process for producing the same TOMOEGAWA PAPER CO. LTD. (JP) 1996-09-04 EP disclosed
EP-0553612-B1 Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides HITACHI CHEMICAL CO LTD (JP) 1996-08-21 EP disclosed
US-5510425-A AROMATIC POLYIMIDE-EPOXY COPOLYMER MODIFIED BY BISMALEIMIDE COMPOUND; FLEXIBILITY, PEELING STRENGTH; COLDSETTING RESINS, ADHESIVES HITACHI CHEMICAL COMPANY, LTD. (JP) 1996-04-23 US disclosed
US-5508357-A SOLUBILITY IN SOLVENT, LOW MELTING POINT HITACHI CHEMICAL COMPANY, LTD. (JP) 1996-04-16 US disclosed
EP-0456515-B1 Polyimides and thermosetting resin compositions containing the same HITACHI CHEMICAL CO LTD (JP) 1995-11-08 EP disclosed
EP-0618614-A2 Heat-resistant adhesive for the fabrication of a semiconductor package Hitachi Chemical Co., Ltd. (JP) 1994-10-05 EP disclosed
EP-0553612-A2 Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides HITACHI CHEMICAL CO., LTD. (JP) 1993-08-04 EP disclosed
EP-0456515-A1 Polyimides and thermosetting resin compositions containing the same Hitachi Chemical Co., Ltd. (JP) 1991-11-13 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20040068084-A1 Azaoxa heterocyclic compound and method of preparing the same AOX1, KDM1A, BMI1 POLB 1238/4885HTT 2124/4885GABRP 1655/4885
US-20050085634-A1 Azaoxa heterocyclic compound and method of preparing the same AOX1, KDM1A, BMI1 POLB 1310/4885HTT 2082/4885GABRP 1481/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.