SCHEMBL4023889

SCHEMBL4023889

CN(C)CCOC(=O)/C=C/c1ccccc1

nearest known ligand 0.72

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.72
AKR1B10 O60218 4/20 0.63
AKR1B1 P15121 4/20 0.63
BCHE P06276 7/20 0.59
ACHE P22303 7/20 0.59
LMNA P02545 2/20 0.59
SMN1; SMN2 Q16637 1/20 0.59
MEN1 O00255 2/20 0.55
KMT2A Q03164 2/20 0.55
MAOB P27338 3/20 0.54
APP P05067 1/20 0.53
KDM4E B2RXH2 1/20 0.53

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4023891 1.00 ALDH1A1 (0.72) ALDH1A1AKR1B10AKR1B1BCHEACHE
SCHEMBL4018802 0.91 LMNA (0.71) ALDH1A1AKR1B10AKR1B1BCHEACHE
SCHEMBL4018801 0.91 LMNA (0.71) ALDH1A1AKR1B10AKR1B1BCHEACHE
SCHEMBL7921547 0.90 LMNA (0.66) ALDH1A1AKR1B10AKR1B1BCHEACHE
SCHEMBL7921543 0.90 LMNA (0.66) ALDH1A1AKR1B10AKR1B1BCHEACHE
SCHEMBL7915315 0.88 LMNA (0.64) ALDH1A1AKR1B10AKR1B1BCHEACHE
SCHEMBL7915244 0.88 LMNA (0.64) ALDH1A1AKR1B10AKR1B1BCHEACHE
SCHEMBL7915247 0.88 LMNA (0.64) ALDH1A1AKR1B10AKR1B1BCHEACHE
SCHEMBL7915314 0.88 LMNA (0.64) ALDH1A1AKR1B10AKR1B1BCHEACHE
SCHEMBL7908387 0.85 ALDH1A1 (0.65) ALDH1A1AKR1B10AKR1B1BCHEACHE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-3076707-A None JP disclosed
US-7521744-B2 Resin-encapsulated semiconductor apparatus and process for its fabrication RENESAS TECHNOLOGY CORP. (JP) 2009-04-21 US disclosed
US-7064368-B2 Resin-encapsulated semiconductor apparatus and process for its fabrication RENESAS TECHNOLOGY CORP. (JP) 2006-06-20 US disclosed
US-20050248014-A1 Resin-encapsulated semiconductor apparatus and process for its fabrication RENESAS TECHNOLOGY CORP. 2005-11-10 US disclosed
US-20050046047-A1 Resin-encapsulated semiconductor apparatus and process for its fabrication HITACHI, LTD. 2005-03-03 US disclosed
US-6847125-B2 Resin-encapsulated semiconductor apparatus and process for its fabrication RENESAS TECHNOLOGY CORP. (JP) 2005-01-25 US disclosed
US-20040084785-A1 Resin-encapsulated semiconductor apparatus and process for its fabrication HITACHI, LTD. 2004-05-06 US disclosed
US-6657245-B2 Resin-encapsulated semiconductor apparatus and process for its fabrication HITACHI, LTD. (JP) 2003-12-02 US disclosed
US-6617630-B2 Resin-encapsulated semiconductor apparatus and process for its fabrication HITACHI, LTD. (JP) 2003-09-09 US disclosed
US-6525359-B2 Resin-encapsulated semiconductor apparatus and process for its fabrication HITACHI, LTD. (JP) 2003-02-25 US disclosed
US-5578697-A DIELECTRIC POLYMERS FOR ELECTRONICS KABUSHIKI KAISHA TOSHIBA (JP) 1996-11-26 US disclosed
US-5574042-A ANTAGONIST FOR BRADYKININS AS ANTIALLERGENS, AUTOIMMUNE DISEASES, ANTIINFLAMMATORY AGENTS, SHOCK OR PAIN FUJISAWA PHARMACEUTICAL CO., LTD (JP) 1996-11-12 US disclosed
US-5563162-A CAN BE ADMINISTERD FOR THE TREATMENT OF ALLERGY, INFLAMMATION, AUTOIMMUNE DISEASES, SHOCK OR PAIN IN ANIMALS AND HUMANS FUJISAWA PHARMACEUTICAL CO., LTD. (JP) 1996-10-08 US disclosed
EP-0622361-A1 Heterocyclic compounds as bradykinin antagonists FUJISAWA PHARMACEUTICAL CO., LTD. (JP) 1994-11-02 EP disclosed
US-5350663-A Construction of electrical circuits and protective or insulating layers for electronic components BASF LACKE+ FARBEN AKTIENGESELLSCHAFT (DE) 1994-09-27 US disclosed
EP-0596406-A1 Imidazo (1,2-a) Pyridines as bradykinin antagonists FUJISAWA PHARMACEUTICAL CO., LTD. (JP) 1994-05-11 EP disclosed
JP-H0376707-A PRODUCTION OF FUNCTIONAL POLYMER FUJI PHOTO FILM CO LTD 1991-04-02 JP disclosed
EP-0065352-B1 LIGHT-SENSITIVE POLYMER COMPOSITION Hitachi, Ltd. (JP) 1986-01-29 EP disclosed
US-4451551-A AROMATIC AMINE CONTAINING AN AZIDE OR SULFONYLAZINE GROUP HITACHI, LTD. (JP) 1984-05-29 US disclosed
EP-0065352-A2 Light-sensitive polymer composition Hitachi, Ltd. (JP) 1982-11-24 EP disclosed