Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 2/20 | 0.71 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.71 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.65 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.64 |
| ▸ | BCHE | P06276 | 5/20 | 0.62 |
| ▸ | ACHE | P22303 | 5/20 | 0.62 |
| ▸ | AKR1B10 | O60218 | 5/20 | 0.60 |
| ▸ | AKR1B1 | P15121 | 5/20 | 0.60 |
| ▸ | MEN1 | O00255 | 1/20 | 0.52 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.52 |
| ▸ | MAOB | P27338 | 1/20 | 0.51 |
| ▸ | APP | P05067 | 1/20 | 0.51 |
| ▸ | ALOX5 | P09917 | 1/20 | 0.49 |
| ▸ | HTR2A | P28223 | 1/20 | 0.48 |
| ▸ | HTR2C | P28335 | 1/20 | 0.48 |
| ▸ | SIGMAR1 | Q99720 | 1/20 | 0.48 |
| ▸ | GP6 | Q9HCN6 | 1/20 | 0.48 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4018802 | 1.00 | LMNA (0.71) | LMNASMN1; SMN2ALDH1A1KDM4EBCHE | |
| SCHEMBL7921547 | 0.96 | LMNA (0.66) | LMNASMN1; SMN2ALDH1A1KDM4EBCHE | |
| SCHEMBL7921543 | 0.96 | LMNA (0.66) | LMNASMN1; SMN2ALDH1A1KDM4EBCHE | |
| SCHEMBL7915315 | 0.94 | LMNA (0.64) | LMNASMN1; SMN2ALDH1A1KDM4EBCHE | |
| SCHEMBL7915314 | 0.94 | LMNA (0.64) | LMNASMN1; SMN2ALDH1A1KDM4EBCHE | |
| SCHEMBL7915247 | 0.94 | LMNA (0.64) | LMNASMN1; SMN2ALDH1A1KDM4EBCHE | |
| SCHEMBL7915244 | 0.94 | LMNA (0.64) | LMNASMN1; SMN2ALDH1A1KDM4EBCHE | |
| SCHEMBL4023891 | 0.91 | ALDH1A1 (0.72) | LMNASMN1; SMN2ALDH1A1KDM4EBCHE | |
| SCHEMBL4023889 | 0.91 | ALDH1A1 (0.72) | LMNASMN1; SMN2ALDH1A1KDM4EBCHE | |
| SCHEMBL15347088 | 0.86 | AKR1B10 (0.73) | LMNAALDH1A1AKR1B10AKR1B1MEN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0065352-B1 | LIGHT-SENSITIVE POLYMER COMPOSITION | Hitachi, Ltd. (JP) | 1986-01-29 | — | — | EP | claimed |
| EP-0065352-A2 | Light-sensitive polymer composition | Hitachi, Ltd. (JP) | 1982-11-24 | — | — | EP | claimed |
| US-7521744-B2 | Resin-encapsulated semiconductor apparatus and process for its fabrication | RENESAS TECHNOLOGY CORP. (JP) | 2009-04-21 | — | — | US | disclosed |
| US-7064368-B2 | Resin-encapsulated semiconductor apparatus and process for its fabrication | RENESAS TECHNOLOGY CORP. (JP) | 2006-06-20 | — | — | US | disclosed |
| US-20050248014-A1 | Resin-encapsulated semiconductor apparatus and process for its fabrication | RENESAS TECHNOLOGY CORP. | 2005-11-10 | — | — | US | disclosed |
| US-20050046047-A1 | Resin-encapsulated semiconductor apparatus and process for its fabrication | HITACHI, LTD. | 2005-03-03 | — | — | US | disclosed |
| US-6847125-B2 | Resin-encapsulated semiconductor apparatus and process for its fabrication | RENESAS TECHNOLOGY CORP. (JP) | 2005-01-25 | — | — | US | disclosed |
| US-20040084785-A1 | Resin-encapsulated semiconductor apparatus and process for its fabrication | HITACHI, LTD. | 2004-05-06 | — | — | US | disclosed |
| US-6657245-B2 | Resin-encapsulated semiconductor apparatus and process for its fabrication | HITACHI, LTD. (JP) | 2003-12-02 | — | — | US | disclosed |
| US-6617630-B2 | Resin-encapsulated semiconductor apparatus and process for its fabrication | HITACHI, LTD. (JP) | 2003-09-09 | — | — | US | disclosed |
| US-6525359-B2 | Resin-encapsulated semiconductor apparatus and process for its fabrication | HITACHI, LTD. (JP) | 2003-02-25 | — | — | US | disclosed |
| US-6441416-B1 | Resin-encapsulated semiconductor apparatus and process for its fabrication | HITACHI, LTD. (JP) | 2002-08-27 | — | — | US | disclosed |
| US-20020060373-A1 | Resin-encapsulated semiconductor apparatus and process for its fabrication | HITACHI, LTD. | 2002-05-23 | — | — | US | disclosed |
| US-20020027268-A1 | Resin-encapsulated semiconductor apparatus and process for its fabrication | HITACHI, LTD. | 2002-03-07 | — | — | US | disclosed |
| US-6200831-B1 | HEAT-CURING A COATING OF A POLYAMIC ACID BASED ON A TETRACARBOXYLIC ACID AND A DIAMINE CONTAINNG AN ACTIVE OXYGEN OR NITROGEN FUNCTIONAL GROUP; SEALING THE EXTERNAL TERMINALS WITH A RESIN, E.G. AN EPOXIDE | HITACHI, LTD. (JP) | 2001-03-13 | — | — | US | disclosed |
| US-6147374-A | Resin-encapsulated semiconductor apparatus | HITACHI, LTD. (JP) | 2000-11-14 | — | — | US | disclosed |
| US-5851681-A | Wiring structure with metal wiring layers and polyimide layers, and fabrication process of multilayer wiring board | HITACHI, LTD. (JP) | 1998-12-22 | — | — | US | disclosed |
| US-5350663-A | Construction of electrical circuits and protective or insulating layers for electronic components | BASF LACKE+ FARBEN AKTIENGESELLSCHAFT (DE) | 1994-09-27 | — | — | US | disclosed |
| EP-0065352-B1 | LIGHT-SENSITIVE POLYMER COMPOSITION | Hitachi, Ltd. (JP) | 1986-01-29 | — | — | EP | disclosed |
| EP-0065352-A2 | Light-sensitive polymer composition | Hitachi, Ltd. (JP) | 1982-11-24 | — | — | EP | disclosed |